JPS6237964U - - Google Patents
Info
- Publication number
- JPS6237964U JPS6237964U JP12907885U JP12907885U JPS6237964U JP S6237964 U JPS6237964 U JP S6237964U JP 12907885 U JP12907885 U JP 12907885U JP 12907885 U JP12907885 U JP 12907885U JP S6237964 U JPS6237964 U JP S6237964U
- Authority
- JP
- Japan
- Prior art keywords
- component
- circuit board
- printed circuit
- hole
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図イは本考案のプリント基板の１実施例に
おける部品装着状態を示す断面図、第１図ロは同
部品装着状態を示す要部斜視図、第２図は従来の
プリント基板における要部断面図である。
１…プリント基板、２…銅箔、３…装着部品、
４…半田、５…保護基板、６…熱硬化性接着剤、
７…透孔。
Fig. 1A is a cross-sectional view showing a state in which components are installed in one embodiment of the printed circuit board of the present invention, Fig. 1B is a perspective view of a main part showing a state in which the same components are mounted, and Fig. 2 is a main part in a conventional printed circuit board. FIG. 1...Printed circuit board, 2...Copper foil, 3...Mounted parts,
4...Solder, 5...Protection board, 6...Thermosetting adhesive,
7...Through hole.
Claims (1)
き部品の取付け位置に対応し、かつ、前記部品が
はいる透孔を設けた保護用基板を貼り合わせたプ
リント基板。 A printed circuit board in which a protective substrate is bonded to the component mounting surface side of a printed circuit board main body, which corresponds to the mounting position of the component to be mounted and has a through hole into which the component is inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12907885U JPS6237964U (en) | 1985-08-24 | 1985-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12907885U JPS6237964U (en) | 1985-08-24 | 1985-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237964U true JPS6237964U (en) | 1987-03-06 |
Family
ID=31025330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12907885U Pending JPS6237964U (en) | 1985-08-24 | 1985-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237964U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6314297B1 (en) * | 2017-04-15 | 2018-04-25 | 株式会社サムス | Electronic component module device and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5930549U (en) * | 1982-08-20 | 1984-02-25 | 自動車機器技術研究組合 | Fuel pressure control device of fuel supply system |
-
1985
- 1985-08-24 JP JP12907885U patent/JPS6237964U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5930549U (en) * | 1982-08-20 | 1984-02-25 | 自動車機器技術研究組合 | Fuel pressure control device of fuel supply system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6314297B1 (en) * | 2017-04-15 | 2018-04-25 | 株式会社サムス | Electronic component module device and manufacturing method thereof |
| JP2018180347A (en) * | 2017-04-15 | 2018-11-15 | 株式会社サムス | Electronic component module device and manufacturing method of the same |
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