JPS6258030U - - Google Patents
Info
- Publication number
- JPS6258030U JPS6258030U JP14904985U JP14904985U JPS6258030U JP S6258030 U JPS6258030 U JP S6258030U JP 14904985 U JP14904985 U JP 14904985U JP 14904985 U JP14904985 U JP 14904985U JP S6258030 U JPS6258030 U JP S6258030U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- chip
- chip part
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Description
第１図ないし第３図は本考案の各実施例におけ
る斜視外観図、第４図は半田付された状態の斜視
図、第５図はチツプ部品の外観例図、第６図はプ
リント基板へのチツプ部品の装着断面図である。
１……チツプ部品、２，２′……チツプ部品の
端部、３……プリント基板、５……接着剤、６，
６′，７，７′，８，８′……半田付部分。
Figures 1 to 3 are perspective external views of each embodiment of the present invention, Figure 4 is a perspective view of the soldered state, Figure 5 is an example of the appearance of chip components, and Figure 6 is a printed circuit board. FIG. 1... Chip component, 2, 2'... Edge of chip component, 3... Printed circuit board, 5... Adhesive, 6,
6', 7, 7', 8, 8'...Soldering part.
Claims (1)
において、該チツプ部品の両端半田付用電極に予
め該チツプ部品の外形、寸法と該チツプ部品が装
着されるプリント基板への半田付けに必要な位置
に半田を付着したことを特徴とする半田付けチツ
プ部品。 For chip parts for electronic devices that require soldering, the external shape and dimensions of the chip part and the position required for soldering to the printed circuit board on which the chip part will be mounted are determined in advance on the soldering electrodes at both ends of the chip part. A soldering chip component characterized by having solder adhered to it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14904985U JPS6258030U (en) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14904985U JPS6258030U (en) | 1985-09-30 | 1985-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6258030U true JPS6258030U (en) | 1987-04-10 |
Family
ID=31063888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14904985U Pending JPS6258030U (en) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258030U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858327B2 (en) * | 1975-08-22 | 1983-12-24 | 帝人株式会社 | Glycol Luino Seizouhou |
| JPS599947A (en) * | 1982-07-07 | 1984-01-19 | Matsushita Electric Ind Co Ltd | Package for electronic circuit and its manufacture |
| JPS5942012B2 (en) * | 1974-07-02 | 1984-10-12 | 旭化成株式会社 | Method for producing cross-linked ethylene-vinyl alcohol copolymer molded product |
| JPS59215750A (en) * | 1983-05-23 | 1984-12-05 | Sanyo Electric Co Ltd | Semiconductor device for memory |
-
1985
- 1985-09-30 JP JP14904985U patent/JPS6258030U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5942012B2 (en) * | 1974-07-02 | 1984-10-12 | 旭化成株式会社 | Method for producing cross-linked ethylene-vinyl alcohol copolymer molded product |
| JPS5858327B2 (en) * | 1975-08-22 | 1983-12-24 | 帝人株式会社 | Glycol Luino Seizouhou |
| JPS599947A (en) * | 1982-07-07 | 1984-01-19 | Matsushita Electric Ind Co Ltd | Package for electronic circuit and its manufacture |
| JPS59215750A (en) * | 1983-05-23 | 1984-12-05 | Sanyo Electric Co Ltd | Semiconductor device for memory |
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