JPS6085864U - Chip component mounting structure on printed circuit board - Google Patents
Chip component mounting structure on printed circuit boardInfo
- Publication number
- JPS6085864U JPS6085864U JP17941983U JP17941983U JPS6085864U JP S6085864 U JPS6085864 U JP S6085864U JP 17941983 U JP17941983 U JP 17941983U JP 17941983 U JP17941983 U JP 17941983U JP S6085864 U JPS6085864 U JP S6085864U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- circuit board
- printed circuit
- mounting structure
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは従来のチップ部品搭載用状態を示す正面図、
第１図すは同側面図である。第２図ａは本考案によるプ
リント基板のチップ部品搭載構造の一実施例を示す正面
図、第２図すは同側面図である。
１．１１・・・チップ部品半田付パターン、２，１２・
・・接着剤、３，１３・・・チップ部品、４，１４・・
・チップ部品電極、５．１５・・・プリント基板、６・
・・チップ部品接着用パターン。FIG. 1a is a front view showing a conventional state for mounting chip components;
FIG. 1 is a side view of the same. FIG. 2a is a front view showing an embodiment of a chip component mounting structure of a printed circuit board according to the present invention, and FIG. 2a is a side view of the same. 1.11...Chip component soldering pattern, 2,12.
...Adhesive, 3,13...Chip parts, 4,14...
・Chip component electrode, 5.15...Printed circuit board, 6.
・Pattern for adhering chip parts.
Claims (1)
接着固定する構造において、前記接着剤塗布位置に銅箔
パターンを形成し、その上に接着剤を塗布してチップ部
品を接着するように構成したことを特徴とするプリント
基板のチップ部品搭載構造。In a structure in which a chip component is adhesively fixed to a predetermined position on a printed circuit board using an adhesive, a copper foil pattern is formed at the adhesive application position, and the adhesive is applied thereon to adhere the chip component. A printed circuit board chip component mounting structure featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17941983U JPS6085864U (en) | 1983-11-18 | 1983-11-18 | Chip component mounting structure on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17941983U JPS6085864U (en) | 1983-11-18 | 1983-11-18 | Chip component mounting structure on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6085864U true JPS6085864U (en) | 1985-06-13 |
Family
ID=30389292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17941983U Pending JPS6085864U (en) | 1983-11-18 | 1983-11-18 | Chip component mounting structure on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6085864U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568216U (en) * | 1979-06-29 | 1981-01-24 |
-
1983
- 1983-11-18 JP JP17941983U patent/JPS6085864U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568216U (en) * | 1979-06-29 | 1981-01-24 |
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