JPS59140466U - circuit board connection device - Google Patents
circuit board connection deviceInfo
- Publication number
- JPS59140466U JPS59140466U JP3405883U JP3405883U JPS59140466U JP S59140466 U JPS59140466 U JP S59140466U JP 3405883 U JP3405883 U JP 3405883U JP 3405883 U JP3405883 U JP 3405883U JP S59140466 U JPS59140466 U JP S59140466U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- circuit board
- wiring boards
- connection device
- board connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の方法によるセラミック基板と樹脂積層板
を基板とする印刷配線基板との接続構造を示す図、第２
図は本考案の一実施例の接続構造を示す図、第３図は可
撓性印刷配線基板の取付例の説明図である。
１・・・セラミック又は金属を基板とする印刷配線基板
、２・・・樹脂積層板を基板とする印刷配線基板、３・
・・レードフレーム端子、４・・・基板１の印刷配線電
極部、５・・・基板２の印刷配線電極部、６，８゜９・
・・ハンダ付は部、７・・・可撓性印刷配線基板、１０
・・・感圧性又は感熱性接着剤。Figure 1 is a diagram showing a connection structure between a ceramic substrate and a printed wiring board using a resin laminate as a substrate by a conventional method.
The figure shows a connection structure according to an embodiment of the present invention, and FIG. 3 is an explanatory diagram of an example of mounting a flexible printed wiring board. 1...Printed wiring board using ceramic or metal as a substrate, 2...Printed wiring board using resin laminate as a substrate, 3.
...Rade frame terminal, 4...Printed wiring electrode part of board 1, 5...Printed wiring electrode part of board 2, 6,8゜9.
...Soldering part, 7...Flexible printed wiring board, 10
...Pressure-sensitive or heat-sensitive adhesive.
Claims (1)
板のそれぞれの電極部と対応するノλンダ付部を有し、
上記印刷配線基板の一方に仮固定する感圧又は感熱性接
着剤層を形成した可撓性を有する印刷配線基板で構成さ
れ、上記２つの印刷配線基板の電極とハンダ付部をハン
ダ付は接続するようにしたことを特徴とする回路基板接
続装置。It has a soldered part corresponding to each electrode part of two printed wiring boards having different thermal expansion coefficients or hygroscopic expansion coefficients,
Consists of a flexible printed wiring board on which a pressure-sensitive or heat-sensitive adhesive layer is formed that is temporarily fixed to one of the above printed wiring boards, and the electrodes and soldered parts of the two printed wiring boards are connected by soldering. A circuit board connecting device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3405883U JPS59140466U (en) | 1983-03-11 | 1983-03-11 | circuit board connection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3405883U JPS59140466U (en) | 1983-03-11 | 1983-03-11 | circuit board connection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59140466U true JPS59140466U (en) | 1984-09-19 |
| JPH0227574Y2 JPH0227574Y2 (en) | 1990-07-25 |
Family
ID=30164827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3405883U Granted JPS59140466U (en) | 1983-03-11 | 1983-03-11 | circuit board connection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140466U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4347002B2 (en) * | 2003-09-10 | 2009-10-21 | 日本電業工作株式会社 | Dual polarization antenna |
-
1983
- 1983-03-11 JP JP3405883U patent/JPS59140466U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0227574Y2 (en) | 1990-07-25 |
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