JPS59185874U - Chip component wiring body - Google Patents
Chip component wiring bodyInfo
- Publication number
- JPS59185874U JPS59185874U JP8083983U JP8083983U JPS59185874U JP S59185874 U JPS59185874 U JP S59185874U JP 8083983 U JP8083983 U JP 8083983U JP 8083983 U JP8083983 U JP 8083983U JP S59185874 U JPS59185874 U JP S59185874U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- wiring body
- adhesive
- component wiring
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第４図は従来のチップ部品配線体の要部組立
工程を示しており、それぞれ第１図が接着剤の塗着後の
断面図、第２図が第１図の平面図、第３図が仮固定後の
断面図及び第４図が半田固定後の断面図、及び第５図乃
至第８図は本考案のチップ部品配線体の要部組立工程を
示しており、それぞれ第１図乃至第４図に対応する工程
の要部断面及び平面図である。
１０・・・チップ部品配線体、１１・・・プリント基板
、１２．１３・・・導電ランド、１４・・・チップ部品
、１５・・・接着剤、１７．１８・・・電極、１９・・
・半田、２０・・・延長部分。FIGS. 1 to 4 show the main part assembly process of a conventional chip component wiring body, and FIG. 1 is a cross-sectional view after applying adhesive, FIG. 2 is a plan view of FIG. 1, and FIG. FIG. 3 is a cross-sectional view after temporary fixing, FIG. 4 is a cross-sectional view after soldering, and FIGS. 5 to 8 show the assembly process of the main parts of the chip component wiring body of the present invention. FIG. 4 is a cross-sectional view and a plan view of a main part of the process corresponding to FIGS. DESCRIPTION OF SYMBOLS 10... Chip component wiring body, 11... Printed circuit board, 12.13... Conductive land, 14... Chip component, 15... Adhesive, 17.18... Electrode, 19...
・Solder, 20...extension part.
Claims (1)
定後このチップ部品の両端側電極を半田ディツプにより
それぞれ所定の導電ランドに半田固着したプリント鹸線
体において、 前記接着剤はその塗着位置が前記導電ランドの一方の延
在部分にあり、前記チップ部品を前記プリント基板に搭
載する際の圧着により仮固定に満足な接着強度を得るよ
うにしたことを特徴とするチップ部品配線体。[Scope of Claim for Utility Model Registration] In a printed wire body, a chip component mounted on a printed circuit board is temporarily fixed with an adhesive, and then electrodes on both ends of the chip component are soldered to predetermined conductive lands using solder dips. The adhesive is applied at an extending portion of one of the conductive lands, and has adhesive strength sufficient for temporary fixing by pressure bonding when mounting the chip component on the printed circuit board. Chip component wiring body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8083983U JPS59185874U (en) | 1983-05-27 | 1983-05-27 | Chip component wiring body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8083983U JPS59185874U (en) | 1983-05-27 | 1983-05-27 | Chip component wiring body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59185874U true JPS59185874U (en) | 1984-12-10 |
Family
ID=30210816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8083983U Pending JPS59185874U (en) | 1983-05-27 | 1983-05-27 | Chip component wiring body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59185874U (en) |
-
1983
- 1983-05-27 JP JP8083983U patent/JPS59185874U/en active Pending
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