JPS5942070U - Mounting structure for small electrical parts - Google Patents
Mounting structure for small electrical partsInfo
- Publication number
- JPS5942070U JPS5942070U JP13916582U JP13916582U JPS5942070U JP S5942070 U JPS5942070 U JP S5942070U JP 13916582 U JP13916582 U JP 13916582U JP 13916582 U JP13916582 U JP 13916582U JP S5942070 U JPS5942070 U JP S5942070U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- small electrical
- circuit board
- printed circuit
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は混成集積回路のプリント基板両面実装状態を示
す正面図、第２図は両面実装の工程を示すブロック図、
第３図イ９口は各々チップ状部品の形状を示丈正面図、
第４図は従来の取付構造を示す正面図、第５図は本考案
の実施例を示す正面断面図である。
１・・・チップ状部品、１ａ・・・部品本体、１ｂ・・
・電極部、２・・・プリント基板、３・・・銅箔部、４
・・・接着剤、５・・・Ｃ，よんだ付け、６・・・ソル
ダーレジスト層、７・・・接着箇所表示層、Ｇ・・・ギ
ャップ。Fig. 1 is a front view showing a hybrid integrated circuit mounted on both sides of a printed circuit board, Fig. 2 is a block diagram showing the process of double-sided mounting,
Figure 3 A9 is a front view showing the shape of each chip-like part,
FIG. 4 is a front view showing a conventional mounting structure, and FIG. 5 is a front sectional view showing an embodiment of the present invention. 1... Chip-shaped component, 1a... Component body, 1b...
・Electrode part, 2... Printed circuit board, 3... Copper foil part, 4
...Adhesive, 5...C, Soldering, 6...Solder resist layer, 7...Adhesion point display layer, G...Gap.
Claims (1)
、部品本体及び電極部より成り部品本体底面と電極部先
端との間にギャップを有し電極部を上記銅箔部に対応さ
せて部品本体をプリント基板に接着固定されるチップ状
部品とより構成される小型電気部品の取付構造において
、プリント基板の上記部品本体接着固定箇所に、銅箔部
よりも突出させて接着箇所表示層を形成して成る小型電
気部品の取付構造。It consists of a printed circuit board on which a copper foil part for conducting electricity is provided on the mounting surface, a component body, and an electrode part, with a gap between the bottom of the component body and the tip of the electrode part, and the electrode part corresponds to the copper foil part. In a mounting structure for a small electrical component consisting of a chip-like component whose main body is adhesively fixed to a printed circuit board, an adhesive point indicating layer is placed on the printed circuit board at the point where the component body is bonded and fixed, protruding beyond the copper foil portion. A mounting structure for small electrical parts formed by forming a
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13916582U JPS5942070U (en) | 1982-09-13 | 1982-09-13 | Mounting structure for small electrical parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13916582U JPS5942070U (en) | 1982-09-13 | 1982-09-13 | Mounting structure for small electrical parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5942070U true JPS5942070U (en) | 1984-03-17 |
Family
ID=30312010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13916582U Pending JPS5942070U (en) | 1982-09-13 | 1982-09-13 | Mounting structure for small electrical parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5942070U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012216730A (en) * | 2011-04-01 | 2012-11-08 | Mitsubishi Electric Corp | Heat radiation structure for electronic part |
-
1982
- 1982-09-13 JP JP13916582U patent/JPS5942070U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012216730A (en) * | 2011-04-01 | 2012-11-08 | Mitsubishi Electric Corp | Heat radiation structure for electronic part |
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