JPS5920674U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5920674U
JPS5920674U JP11581182U JP11581182U JPS5920674U JP S5920674 U JPS5920674 U JP S5920674U JP 11581182 U JP11581182 U JP 11581182U JP 11581182 U JP11581182 U JP 11581182U JP S5920674 U JPS5920674 U JP S5920674U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
solder
conductor
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11581182U
Other languages
Japanese (ja)
Inventor
中原 照巳
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP11581182U priority Critical patent/JPS5920674U/en
Publication of JPS5920674U publication Critical patent/JPS5920674U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の印刷配線板を示す平面図、第2図は本考
案の印刷配線板の一実施例を示す平面図、第3図は第2
図に示す印刷配線板の■−■間の部分縦断面図である。 1・・・基板、2,7・・・接続電極、3・・・大電流
回路用もしくは高周波回路用導体、4・・・リードピン
挿入孔、5・・・半田レジスト、6・・・ストリップ線
路、8・・・半田。
Fig. 1 is a plan view showing a conventional printed wiring board, Fig. 2 is a plan view showing an embodiment of the printed wiring board of the present invention, and Fig. 3 is a plan view showing a conventional printed wiring board.
FIG. 3 is a partial vertical cross-sectional view taken along the line ■--■ of the printed wiring board shown in the figure. 1... Board, 2, 7... Connection electrode, 3... Conductor for large current circuit or high frequency circuit, 4... Lead pin insertion hole, 5... Solder resist, 6... Strip line , 8... solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に形成された大電流回路用または高周波回路用の
導体に半田を付着してなる印刷配線板において、前記半
田の付着される導体上に形成された接続電極を半田レジ
ストによって区画してなることを特徴とする印刷配線板
In a printed wiring board formed by attaching solder to a conductor for a large current circuit or a high frequency circuit formed on a substrate, connection electrodes formed on the conductor to which the solder is attached are divided by solder resist. A printed wiring board characterized by:
JP11581182U 1982-07-30 1982-07-30 printed wiring board Pending JPS5920674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11581182U JPS5920674U (en) 1982-07-30 1982-07-30 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11581182U JPS5920674U (en) 1982-07-30 1982-07-30 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5920674U true JPS5920674U (en) 1984-02-08

Family

ID=30267207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11581182U Pending JPS5920674U (en) 1982-07-30 1982-07-30 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5920674U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63146492A (en) * 1986-12-10 1988-06-18 松下電器産業株式会社 Printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63146492A (en) * 1986-12-10 1988-06-18 松下電器産業株式会社 Printed board

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