JP2012216730A - Heat radiation structure for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation structure for an electronic part with which a heat-generating electronic part is adhesively fixed to an existing substrate while the coating amount of adhesive agent is regulated, whereby a desired heat radiation effect can be expected.SOLUTION: A heat radiation structure comprises a substrate and a heat sink fixed to the back surface of the substrate. A boundary line is set on the surface of the substrate so that the boundary line is spaced outwardly at a predetermined insulating distance from an outer periphery with which a heating electronic part to be mounted comes into contact and surrounds the outer periphery. Copper foil pattern is applied to only the whole surface at the outside of the boundary line, and the substrate surface of the whole surface at the inside of the boundary line is exposed. A place at which adhesive agent is applied and an indication specifying the coating amount of the adhesive agent are silk-printed on the substrate surface at the inside of the outer periphery.

Description

  The present invention relates to a heat dissipation structure for an electronic component.

  For example, Patent Document 1 discloses a grid-connected inverter device that is a power conditioner of a solar power generation system. The conversion efficiency of the power conditioner of the photovoltaic power generation system is currently achieving 97.5%, and it is considered extremely difficult to increase the efficiency.

  By the way, reactors (DC reactors, AC reactors) used in power supply devices and power generation systems generate heat when energized. If the heat generating reactor is neglected, heat loss will increase.

  That is, in FIG. 2 of Patent Document 1, if a countermeasure for heat radiation is applied to the reactors 51 and 12, further increase in the conversion efficiency of the power conditioner of the solar power generation system can be expected. The heat dissipation measures in this case are individually performed for the reactor 51 and the reactor 12.

Japanese Patent No. 3618902

  As a heat dissipation measure for the reactor as shown in FIG. 2 of Patent Document 1, it is necessary to pay attention to the following points.

  As a heat dissipation structure for an electronic component, a heat sink is generally attached to the electronic component. However, since the heat sink is made of metal, an insulating material is required between the reactor and the heat sink. At that time, a general substrate may be used as the insulating material, but it is necessary to devise so that the substrate does not deteriorate the heat dissipation of the reactor.

  In addition, a predetermined amount of the adhesive that adheres the reactor to the substrate is applied to the substrate in advance, but if the amount of application is small, the heat dissipation of the reactor is deteriorated. is necessary.

  The present invention has been made in view of the above, and it is intended to obtain a heat dissipation structure for an electronic component capable of expecting a predetermined heat dissipation effect by prescribing and fixing a heat generating electronic component by prescribing the amount of adhesive applied to an existing substrate. Objective.

  In order to solve the above-described problems and achieve the object, the present invention is composed of a heat sink and a substrate on which the heat sink is fixed to the back surface. A boundary line surrounding the outer periphery with a predetermined insulation distance from the periphery is defined, a copper foil pattern is applied only to the entire outer surface of the boundary line, the substrate surface is exposed on the entire inner surface of the boundary line, It is characterized in that the place for placing the adhesive on the outer peripheral inner substrate surface and the placement standard for specifying the coating amount are silk-printed.

  According to the present invention, the heat of the heat generating electronic component is transmitted to the copper foil pattern provided on the substrate surface. Therefore, the heat dissipation is performed not only by the heat sink but also by the copper foil pattern, so that the heat dissipation is improved. There is an effect that the heat dissipation structure that individually performs the heat dissipation processing of the electronic components that generate heat can be configured by using an existing substrate and defining the application amount of the adhesive.

FIG. 1 is a plan view showing a configuration of a substrate used in an electronic component heat dissipation structure according to an embodiment of the present invention. FIG. 2 is a cross-sectional view for explaining the configuration of the heat dissipation structure using the substrate shown in FIG. 1 and the state of heat dissipation.

  Embodiments of a heat dissipation structure for an electronic component according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

  FIG. 1 is a plan view showing a configuration of a substrate used in an electronic component heat dissipation structure according to an embodiment of the present invention. FIG. 2 is a cross-sectional view for explaining the configuration of the heat dissipation structure using the substrate shown in FIG. 1 and the state of heat dissipation. For convenience of explanation, it is assumed that the heat generating electronic component is a reactor shown in the background / issues.

  1 and 2, the substrate 1 is a generally used circuit substrate, and it does not matter whether it is a single layer substrate or a multilayer substrate. A heat sink 2 is fixed to the back surface of the substrate 1.

  On the surface of the substrate 1, the copper foil pattern 4 is applied to the entire outer surface of the boundary circle 3 on the basis of the boundary circle 3, and there is no copper foil pattern on the inner side of the boundary circle 3. ing.

  The boundary circle 3 is determined at a position separated by an insulation distance 8 outside the outer contact outer periphery 7 of the doughnut-shaped reactor 6. The serving guide 5 is positioned inside the outer contact periphery 7 of the reactor 6.

  The placement standard 5 is a place where the adhesive 9 is placed in advance. The amount of the adhesive 9 to be preliminarily placed on the placement guide 5 is such that when the reactor 6 is placed on the placement guide 5, the adhesive 9 fills the donut hole 10 of the reactor 6 and straddles the insulation distance 8. The amount is enough to reach 4. The size of the display standard 5 is such that when the adhesive 9 is applied to the full size, the required amount of the adhesive 9 can be applied.

  In the above configuration, the heat generated in the reactor 6 is transmitted to the adhesive 9 as shown in FIG. The heat transmitted to the adhesive 9 is directly transmitted to the substrate 1 at the place where the reactor 6 is disposed, and is transmitted to the substrate 1 via the copper foil pattern 4 at a place away from the place where the reactor 6 is disposed. To the heat sink 2.

  At that time, on the surface of the substrate 1, a relatively wide range is covered with the copper foil pattern 4 having excellent heat conduction. Therefore, heat dissipation can be improved.

  Therefore, if the heat dissipation structure described above is applied to the DC reactor or AC reactor normally used in the power conditioner of the photovoltaic power generation system, it becomes possible to reduce the power loss in the DC reactor or AC reactor. The conversion efficiency of the entire system can be increased.

  In addition, although the thermal radiation of the reactor was demonstrated, it cannot be overemphasized that this Embodiment is applicable similarly to another heat-emitting electronic component.

  In this way, a heat dissipation structure that individually performs heat dissipation processing of the electronic components that generate heat can be configured by using an existing substrate and defining the amount of adhesive applied.

  As described above, the heat dissipation structure for an electronic component according to the present invention is useful as a heat dissipation structure for an electronic component capable of expecting a predetermined heat dissipation effect by prescribing and fixing the heat generating electronic component by prescribing the amount of adhesive applied to an existing substrate In particular, it is suitable for reducing the power loss in the DC reactor and the AC reactor used in the power conditioner of the photovoltaic power generation system and increasing the efficiency of the entire system.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Heat sink 3 Boundary circle 4 Copper foil pattern 5 Disposition standard 6 Reactor (heat generating electronic component)
7 Reactor outer contact 8 Insulation distance 9 Adhesive 10 Hole

Claims (2)

A heat sink,
The heat sink is composed of a substrate fixed to the back surface,
On the surface of the substrate,
A boundary line surrounding the outer periphery is defined by placing a predetermined insulation distance from the outer periphery to which the heat generating electronic component to be mounted contacts, and a copper foil pattern is applied only to the entire outer surface of the boundary line, and the inner side of the boundary line A heat dissipation structure for electronic parts, wherein the substrate surface is exposed over the entire surface, and a placement standard for specifying the location and amount of the adhesive to be applied to the outer peripheral inner substrate surface is silk-printed. The size of the serving standard is
2. The electronic component according to claim 1, wherein when the heat generating electronic component is placed, the adhesive can be applied in such an amount that the adhesive can reach the copper foil pattern across the insulating distance. Heat dissipation structure.