JPS5827969U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS5827969U JPS5827969U JP12114981U JP12114981U JPS5827969U JP S5827969 U JPS5827969 U JP S5827969U JP 12114981 U JP12114981 U JP 12114981U JP 12114981 U JP12114981 U JP 12114981U JP S5827969 U JPS5827969 U JP S5827969U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- circuit board
- printed circuit
- chip components
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のチップ部品の実装状態を示す平面図、第
2図はこの考案によるプリント基板の平 −
1′ も)0ゝ9
面図、第3図、第4図は第2図のA−A’ 、 B−B
断面図、第5図61第2図のチップ部品実装状態を示す
断面図、第6図、第7図は他の実施例を示す平面図であ
る。−
1・・・プリント基板、2・・・ランド、5・・・チッ
プ部品、9・・・かこい、10・・・接着剤。Fig. 1 is a plan view showing the mounting state of conventional chip components, Fig. 2 is a plane view of the printed circuit board according to this invention, and Figs. A-A', B-B
Cross-sectional view, FIG. 5 61 A cross-sectional view showing the state in which chip components are mounted in FIG. 2, and FIGS. 6 and 7 are plan views showing other embodiments. - 1... Printed circuit board, 2... Land, 5... Chip component, 9... Surroundings, 10... Adhesive.
Claims (1)
板のチップ部品固定用の接着剤塗布部分の外周にかこい
をシルク印刷したプリント基板。A printed circuit board for mounting chip components, with a silk screen printed on the outer periphery of the adhesive application area for fixing chip components on the printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12114981U JPS5827969U (en) | 1981-08-14 | 1981-08-14 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12114981U JPS5827969U (en) | 1981-08-14 | 1981-08-14 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5827969U true JPS5827969U (en) | 1983-02-23 |
Family
ID=29915094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12114981U Pending JPS5827969U (en) | 1981-08-14 | 1981-08-14 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5827969U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012216730A (en) * | 2011-04-01 | 2012-11-08 | Mitsubishi Electric Corp | Heat radiation structure for electronic part |
-
1981
- 1981-08-14 JP JP12114981U patent/JPS5827969U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012216730A (en) * | 2011-04-01 | 2012-11-08 | Mitsubishi Electric Corp | Heat radiation structure for electronic part |
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