JPS5827969U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5827969U
JPS5827969U JP12114981U JP12114981U JPS5827969U JP S5827969 U JPS5827969 U JP S5827969U JP 12114981 U JP12114981 U JP 12114981U JP 12114981 U JP12114981 U JP 12114981U JP S5827969 U JPS5827969 U JP S5827969U
Authority
JP
Japan
Prior art keywords
printed board
circuit board
printed circuit
chip components
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12114981U
Other languages
Japanese (ja)
Inventor
浦山 典久
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP12114981U priority Critical patent/JPS5827969U/en
Publication of JPS5827969U publication Critical patent/JPS5827969U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のチップ部品の実装状態を示す平面図、第
2図はこの考案によるプリント基板の平 − 1′ も)0ゝ9 面図、第3図、第4図は第2図のA−A’ 、 B−B
断面図、第5図61第2図のチップ部品実装状態を示す
断面図、第6図、第7図は他の実施例を示す平面図であ
る。− 1・・・プリント基板、2・・・ランド、5・・・チッ
プ部品、9・・・かこい、10・・・接着剤。
Fig. 1 is a plan view showing the mounting state of conventional chip components, Fig. 2 is a plane view of the printed circuit board according to this invention, and Figs. A-A', B-B
Cross-sectional view, FIG. 5 61 A cross-sectional view showing the state in which chip components are mounted in FIG. 2, and FIGS. 6 and 7 are plan views showing other embodiments. - 1... Printed circuit board, 2... Land, 5... Chip component, 9... Surroundings, 10... Adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品装着用のプリン上基板において、プリント基
板のチップ部品固定用の接着剤塗布部分の外周にかこい
をシルク印刷したプリント基板。
A printed circuit board for mounting chip components, with a silk screen printed on the outer periphery of the adhesive application area for fixing chip components on the printed circuit board.
JP12114981U 1981-08-14 1981-08-14 Printed board Pending JPS5827969U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12114981U JPS5827969U (en) 1981-08-14 1981-08-14 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12114981U JPS5827969U (en) 1981-08-14 1981-08-14 Printed board

Publications (1)

Publication Number Publication Date
JPS5827969U true JPS5827969U (en) 1983-02-23

Family

ID=29915094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12114981U Pending JPS5827969U (en) 1981-08-14 1981-08-14 Printed board

Country Status (1)

Country Link
JP (1) JPS5827969U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012216730A (en) * 2011-04-01 2012-11-08 Mitsubishi Electric Corp Heat radiation structure for electronic part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012216730A (en) * 2011-04-01 2012-11-08 Mitsubishi Electric Corp Heat radiation structure for electronic part

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