CN202958092U - Radiating film - Google Patents
Radiating film Download PDFInfo
- Publication number
- CN202958092U CN202958092U CN 201220661635 CN201220661635U CN202958092U CN 202958092 U CN202958092 U CN 202958092U CN 201220661635 CN201220661635 CN 201220661635 CN 201220661635 U CN201220661635 U CN 201220661635U CN 202958092 U CN202958092 U CN 202958092U
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- layer
- radiating
- film
- chip
- heat
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Abstract
The utility model relates to a radiating film which is composed of an adhesive layer, a base material layer and a radiating layer. The base material layer can be arranged between the adhesive layer and the radiating layer, or the radiating layer is arranged between the adhesive layer and the base material layer. By means of the structure, due to the adhesive layer, the radiating film can be attached onto a heating chip directly, occupied space is small, and contact between the radiating film and an electric component is closer. A nanometer carbon layer film diffuses heat of the chip to a whole sheet of the nanometer carbon layer film within a short period of time, and local heat is diffused to a complete surface, so that the heat of the chip is reduced, and the chip can work normally stably for a long time.
Description
Technical field
The utility model relates to a kind of heat radiation pad pasting, especially multilayer heat radiation pad pasting.
Background technology
Along with developing rapidly of science and technology, the function of electronic product is recreational more and more stronger, intensity to the components and parts computing is more and more higher, the build space is also done less and less, it is increasing that the thing followed is exactly the chip caloric value, finally cause the core electron components and parts such as chip often to face the deadlock of electronic product because local temperature is too high, serious directly burning causes and can't use.
Given this, radiating element miscellaneous just arises at the historic moment, in the hope of reaching the purpose of improving heat radiation efficiency.From the prior art, be applied to the usually main flow take copper or aluminium alloy as current heat dissipation technology of radiating element, the structure of radiator is mainly fin.Radiating fin is arranged in parallel and is vertically connected on the base plate, and during use, base plate fits on the electronic device, and heat is conducted on the radiating fin, by external cross-ventilation the heat on the radiating fin is taken away again.
But this radiator can only be done greatlyr dimensionally, is difficult to adapt to the trend of present electronic device microminiaturization, so radiator still remains to be broken through on the problem of microminiaturization.In addition, this fin-shaped fin is because size is larger, and the fin that heat transmits from electronic device needs the process grown, and radiating efficiency is not high.
The utility model content
The technical problems to be solved in the utility model provides a kind of high heat dissipation film of less radiating efficiency that takes up room.
For solving the problems of the technologies described above, the utility model provides a kind of heat radiation pad pasting, comprises the adhesive layer and the heat dissipating layer that set gradually.
Further improvement of the utility model comprises:
Described heat radiation pad pasting also comprises substrate layer, and described substrate layer is between adhesive layer and heat dissipating layer.
Described heat radiation pad pasting also comprises substrate layer, and described heat dissipating layer is between adhesive layer and substrate layer.
Heat dissipating layer is the nano-sized carbon tunic, the material layer that the nano-sized carbon tunic can form for graphite material and/or Graphene
Described substrate layer can be insulation material layer.Insulation material layer can be the PET substrate layer.
Adhesive layer can be glue layer.Adhesive layer also can be adhesive sticker.
After adopting structure of the present utility model, owing to adopt adhesive layer, the heat radiation film directly can be pasted on euthermic chip, it is less to take up room, more tight with contacting of electronic devices and components.The nano-sized carbon tunic of this product will be within the extremely short time with the heat diffusion of the chip nano-sized carbon tunic to full wafer, the spread heat of part to whole, is reduced the heat of chip and guarantees that chip can stablize long-term normal operation with this.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the structural representation of the utility model the first embodiment;
Fig. 2 is the structural representation of the utility model the second embodiment.
Among the figure: 1, glue layer, 2, substrate layer, 3, carbon nanometer tunic.
Embodiment
As shown in Figure 1, heat radiation film of the present utility model is glue layer 1 from bottom to top, the carbon nanometer tunic 3 that substrate layer 2 and graphite material form.
As shown in Figure 2, heat radiation film of the present utility model is glue layer 1 from bottom to top, carbon nanometer tunic 3 and substrate layer 2 that Graphene forms.
The above, only be to preferred embodiment of the present utility model, be not that the utility model is done other forms of restriction, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equal variation.Every the utility model scheme content that do not break away from, all drops in protection scope of the present invention any simple modification, equivalent variations and remodeling that above embodiment does according to technical spirit of the present invention.
Claims (3)
1. a heat radiation pad pasting is characterized in that: comprise the adhesive layer and the heat dissipating layer that set gradually.
2. heat radiation pad pasting according to claim 1, it is characterized in that: also comprise substrate layer, described substrate layer is between adhesive layer and heat dissipating layer.
3. heat radiation pad pasting according to claim 1, it is characterized in that: also comprise substrate layer, described heat dissipating layer is between adhesive layer and substrate layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220661635 CN202958092U (en) | 2012-12-05 | 2012-12-05 | Radiating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220661635 CN202958092U (en) | 2012-12-05 | 2012-12-05 | Radiating film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202958092U true CN202958092U (en) | 2013-05-29 |
Family
ID=48463641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220661635 Expired - Fee Related CN202958092U (en) | 2012-12-05 | 2012-12-05 | Radiating film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202958092U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025127A (en) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | Radiating film |
| CN103474403A (en) * | 2013-07-02 | 2013-12-25 | 邵敏芝 | Non-metallic heat radiation film, production equipment, and manufacturing process |
-
2012
- 2012-12-05 CN CN 201220661635 patent/CN202958092U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025127A (en) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | Radiating film |
| CN103474403A (en) * | 2013-07-02 | 2013-12-25 | 邵敏芝 | Non-metallic heat radiation film, production equipment, and manufacturing process |
| CN103474403B (en) * | 2013-07-02 | 2016-08-31 | 邵敏芝 | Non-metallic heat radiation film and production equipment, manufacturing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130529 Termination date: 20171205 |