CN204999844U - Heat dissipation sticky tape - Google Patents
Heat dissipation sticky tape Download PDFInfo
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- CN204999844U CN204999844U CN201520565451.XU CN201520565451U CN204999844U CN 204999844 U CN204999844 U CN 204999844U CN 201520565451 U CN201520565451 U CN 201520565451U CN 204999844 U CN204999844 U CN 204999844U
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- heat dissipation
- heat
- adhesive tape
- dissipation adhesive
- utility
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Abstract
The utility model discloses a heat dissipation sticky tape to the metal forming is the substrate, and it has the heat -conducting glue to coat below this substrate the heat radiation coating that the higher authority of substrate had coated and has compriseed nanometer silica and silicon resin. The passive radiating mode that relies on the air convection with ordinary heat dissipation sticky tape is different, the utility model discloses a heat dissipation sticky tape adopts infrared's initiative radiating mode, and the radiating effect is better, especially has better heat dissipation cooling performance in the constrictive inner space of digital product such as smart mobile phone, panel computer.
Description
Technical field
The utility model relates to tape technology field, is specifically related to a kind of Heat dissipation adhesive tape.
Background technology
The trend of the lightening and hydrodynamics that the digital products such as current mobile phone, panel computer present.Lighteningly mean that digital product internal electronic device is arranged more and more compacter, space more than needed is more and more narrower and small, and hydrodynamics then means that the arithmetic capability of processor chips is more and more higher, and the capacity of lithium cell is more and more higher, causes thermal value increasing.The change of these two aspects, all has higher requirement to current heat sink material.
In the market for the Heat dissipation adhesive tape of digital products, normally using the graphite flake of excellent thermal conductivity or Copper Foil as base material, compound one deck heat-conducting glue adhesion coating, utilize the thermal conduction capability of glue-line and base material, the heat conduction produced by affixed object is to substrate surface, then by the thermal convection of the air above substrate surface, leave heat.This radiating mode relies on cross-ventilated efficiency, and in the internal space that digital product is narrow and small, because convection of air is limited, heat-sinking capability is low, and effect is unsatisfactory.
Summary of the invention
Main purpose of the present utility model is to provide a kind of Heat dissipation adhesive tape, to solve the technical problem that in prior art, Heat dissipation adhesive tape heat-sinking capability is not high.
In order to realize utility model object, the utility model provides a kind of Heat dissipation adhesive tape, take tinsel as base material, below this base material, be coated with heat-conducting glue, at the applied atop heat radiation coating of described base material.
Preferably, described tinsel is Copper Foil, silver foil or aluminium foil.
Preferably, described Heat dissipation adhesive tape also comprises and is arranged on separate-type paper on that face contrary with described tinsel of described heat-conducting glue or release film.
Preferably, described separate-type paper is scribble the kraft paper of silicon layer, Ge Laxin paper or pouring to mould kraft paper.
Preferably, described release film is poly terephthalic acid second two fat or the polyethylene film that scribble silicon layer.
The utility model is by the heat radiation coating that is made up of nano silicon and silicone resin of applied atop in tinsel, this Heat dissipation adhesive tape relies on the thermal radiation capability of heat radiation coating, to be conducted the heat of coming by heat-conducting glue and tinsel by ultrared mode to external irradiation, leave heat.To rely on cross-ventilated passive radiating mode different from common Heat dissipation adhesive tape, Heat dissipation adhesive tape of the present utility model adopts the active heat removal mode of ir radiation, better heat-radiation effect, especially has better radiating and cooling to show in the narrow internal space of the digital product such as smart mobile phone, panel computer.
Accompanying drawing explanation
Fig. 1 is the structural representation of Heat dissipation adhesive tape in the utility model one embodiment.
The realization of the utility model object, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only for explaining the utility model, and be not used in restriction the utility model.
With reference to Fig. 1, Fig. 1 is the structural representation of Heat dissipation adhesive tape in the utility model one embodiment, in the present embodiment, Heat dissipation adhesive tape with tinsel 2 for base material, heat-conducting glue 3 is coated with, at the heat radiation coating 1 that is made up of nano silicon and silicone resin of applied atop of described base material below this base material.
Tinsel 2 can be Copper Foil, silver foil or aluminium foil, in the present embodiment, tinsel 2 adopts Copper Foil, tinsel 2 is heat conducting major partss of Heat dissipation adhesive tape, by the heat conduction of heater members to heat radiation coating 1, heat-conducting glue 3 plays the effect of pasting and connecting heater members and tinsel 2, also play the effect in filler metal paper tinsel 2 and the direct space of heater members simultaneously, heat radiation coating 1 is made up of nano silicon and silicone resin, heat loss through radiation, heat tinsel 2 conducted leaves in the mode of ir radiation, reaches cooling object.
The utility model is by the heat radiation coating 1 that is made up of nano silicon and silicone resin of applied atop in tinsel 2, this Heat dissipation adhesive tape relies on the thermal radiation capability of heat radiation coating, to be conducted the heat of coming by heat-conducting glue 3 and tinsel 2 by ultrared mode to external irradiation, leave heat.To rely on cross-ventilated passive radiating mode different from common Heat dissipation adhesive tape, Heat dissipation adhesive tape of the present utility model adopts the active heat removal mode of ir radiation, better heat-radiation effect, especially has better radiating and cooling to show in the narrow internal space of the digital product such as smart mobile phone, panel computer.
In the above-described embodiments, Heat dissipation adhesive tape also comprises separate-type paper (film) 4, be arranged on that face contrary with described tinsel 2 of described heat-conducting glue 3, separate-type paper can be scribble the kraft paper of silicon layer, Ge Laxin paper or pouring to mould kraft paper, and release film can be poly terephthalic acid second two fat or the polyethylene film that scribble silicon layer.
The making processes of the utility model Heat dissipation adhesive tape: the heat radiation coating 1 that even spread is made up of nano silicon and silicone resin on Copper Foil, thermal radiation coating is formed after putting into oven cooking cycle, even spread heat-conducting glue 3 on release film, heat conduction glue-line is formed after putting into oven cooking cycle, thermal radiation coating and heat-conducting glue laminating are closed, defines Heat dissipation adhesive tape.
These are only preferred embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification sheets and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. a Heat dissipation adhesive tape, take tinsel as base material, be coated with heat-conducting glue, it is characterized in that below this base material, at the applied atop heat radiation coating of described base material.
2. Heat dissipation adhesive tape as claimed in claim 1, it is characterized in that, described tinsel is Copper Foil, silver foil or aluminium foil.
3. Heat dissipation adhesive tape as claimed in claim 1, is characterized in that, described Heat dissipation adhesive tape also comprises and is arranged on separate-type paper on that face contrary with described tinsel of described heat-conducting glue or release film.
4. Heat dissipation adhesive tape as claimed in claim 3, is characterized in that, described separate-type paper is scribble the kraft paper of silicon layer, Ge Laxin paper or pouring to mould kraft paper.
5. Heat dissipation adhesive tape as claimed in claim 3, it is characterized in that, described release film is poly terephthalic acid second two fat or the polyethylene film that scribble silicon layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520565451.XU CN204999844U (en) | 2015-07-30 | 2015-07-30 | Heat dissipation sticky tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520565451.XU CN204999844U (en) | 2015-07-30 | 2015-07-30 | Heat dissipation sticky tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204999844U true CN204999844U (en) | 2016-01-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520565451.XU Active CN204999844U (en) | 2015-07-30 | 2015-07-30 | Heat dissipation sticky tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204999844U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010351A (en) * | 2016-07-26 | 2016-10-12 | 常熟市长江胶带有限公司 | Heat-dissipating double-sided adhesive tape |
| CN107641476A (en) * | 2017-11-20 | 2018-01-30 | 苏州世华新材料科技有限公司 | A kind of heat conduction and heat radiation insulated compound adhesive tape with jog |
| CN110206172A (en) * | 2019-06-10 | 2019-09-06 | 苏州大学 | A kind of passive cooling system based on micro-nano structure |
| CN114959578A (en) * | 2022-06-22 | 2022-08-30 | 贵州西工液压有限公司 | Surface treatment process for high-speed rail rim |
-
2015
- 2015-07-30 CN CN201520565451.XU patent/CN204999844U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010351A (en) * | 2016-07-26 | 2016-10-12 | 常熟市长江胶带有限公司 | Heat-dissipating double-sided adhesive tape |
| CN107641476A (en) * | 2017-11-20 | 2018-01-30 | 苏州世华新材料科技有限公司 | A kind of heat conduction and heat radiation insulated compound adhesive tape with jog |
| CN110206172A (en) * | 2019-06-10 | 2019-09-06 | 苏州大学 | A kind of passive cooling system based on micro-nano structure |
| CN114959578A (en) * | 2022-06-22 | 2022-08-30 | 贵州西工液压有限公司 | Surface treatment process for high-speed rail rim |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |