CN202941076U - Graphite heat radiation sheet for electronic product - Google Patents
Graphite heat radiation sheet for electronic product Download PDFInfo
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- CN202941076U CN202941076U CN 201220571089 CN201220571089U CN202941076U CN 202941076 U CN202941076 U CN 202941076U CN 201220571089 CN201220571089 CN 201220571089 CN 201220571089 U CN201220571089 U CN 201220571089U CN 202941076 U CN202941076 U CN 202941076U
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- graphite
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Abstract
The utility model discloses a graphite heat radiation sheet for an electronic product. The graphite heat radiation sheet for an electronic product comprises a graphite sheet; the upper and lower surfaces of the graphite sheet are both coated with metal layers; the metal layer on the lower surface of the graphite sheet is coated with a thermal conductive adhesive layer; the other surface of the thermal conductive adhesive layer is coated with a releasing film; the graphite sheet has a thickness of 10 to 100mum; the thickness ratio of the graphite sheet to the metal layer is 1 to 0.05-0.5; the releasing film has a thickness of 12 to 25mum, and the releasing film is a PET film coated with a silicone oil layer; and the silicone oil layer on the surface of the PET film is bonded with the thermal conductive adhesive layer. When the graphite heat radiation sheet for an electronic product coats a component ready for heat radiation, thermal conductivity in the length direction is improved and thermal conductivity in the thickness direction is also improved, thereby realizing uniformity of adhesive tape thermal conduction performances; and at the same time, graphite powder can be prevented from dropping, the circuit can then be prevented from being short-circuited, and reliability of products is improved.
Description
Technical field
The utility model relates to a kind of use for electronic products graphite heat radiation fin, belongs to the adhesive material technical field.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause like this volume dwindling, the function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.On the one hand, the fan type radiating adopted in the past, because volume is large, can produce the problems such as noise, by market, eliminated gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all finding new efficient heat sink material.On the other hand, graphite material has property widely, comprise heigh clarity, high conductivity, high-termal conductivity, high strength etc., utilize graphite material, can develop various product application types, such as graphite circuit structure, graphite core chip architecture, graphite touch screen structure, etc.Although various application possibilities are arranged, be directed to graphite material, how it is effectively processed, such as precise cutting, be still to need the problem solved.
But graphite flake also has weak point, though be that high conductive graphite sheet has certain folding resistance, but the weak strength between material, can be torn easily, or because of the displacement of institute's adhesive attachment means, disrepair phenomenon occur, entry material comes off etc., thereby cause the short circuit of circuit, again, in cutting graphite flake process, there will be the technical problems such as graphite flake breaks.
Summary of the invention
The utility model purpose is to provide a kind of use for electronic products graphite heat radiation fin, this use for electronic products graphite heat radiation fin is covered on when thermal component, both improve the thermal conductivity along length, also improved the thickness direction thermal conductivity, realized the uniformity of adhesive tape heat conductivility; Simultaneously, also can prevent that graphite powder from coming off, thereby avoid short circuit, improve the reliability of product.
For achieving the above object, the kind technical scheme that the utility model adopts is: a kind of use for electronic products graphite heat radiation fin, comprise a graphite flake, and the upper and lower surface of this graphite flake all is covered with metal level; Be positioned on the metal level of graphite flake lower surface and be coated with the heat-conducting glue adhesion coating, a release film is covered on another surface of heat-conducting glue adhesion coating.
In technique scheme, further improved plan is as follows:
1. in such scheme, the thickness of described graphite flake is 10 ~ 100 μ m.
2. in such scheme, the Thickness Ratio of described graphite flake and metal level is 1:0.05 ~ 0.5.
3. in such scheme, the thickness of described release film is 12 μ m ~ 25 μ m.
4. in such scheme, described release film is the PET film that scribbles silicon layer, and the silicon layer on this PET film surface and described heat-conducting glue adhesion coating are bonding.
Because technique scheme is used, the utility model compared with prior art has following advantages and effect:
1. the utility model use for electronic products graphite heat radiation fin, the upper and lower surface of its graphite flake all is covered with metal level, employing is by the anisotropic metal level of wire coefficient and the combination of isotropism metal level, both improved the thermal conductivity along length, also improved the thickness direction thermal conductivity, realize the uniformity of adhesive tape heat conductivility, exempted from the adhesive tape local overheating, improved performance and the life-span of product; Secondly, also can prevent that graphite powder from coming off, thereby avoid short circuit, improve the reliability of product.
2. the utility model use for electronic products graphite heat radiation fin, it is positioned on the metal level of graphite flake lower surface and is coated with the heat-conducting glue adhesion coating, be covered on when thermal component, both be conducive to and the seamless link for the treatment of thermal component, be beneficial to again heat diffusion, avoid the graphite heat radiation fin local overheating, thereby improved performance and the life-span of product.
The accompanying drawing explanation
Accompanying drawing 1 is the utility model use for electronic products graphite heat radiation fin structural representation.
In above accompanying drawing: 1, graphite flake; 2, heat-conducting glue adhesion coating; 3, release film; 31, silicon layer; 32, PET film; 4, metal level.
Embodiment
Below in conjunction with embodiment, the utility model is further described:
Embodiment 1: a kind of use for electronic products graphite heat radiation fin, comprise a graphite flake 1, and this upper and lower surface of graphite flake 1 all is covered with metal level 4; Be positioned at and be coated with heat-conducting glue adhesion coating 2, one release films 3 on the metal level of graphite flake 1 lower surface and be covered on heat-conducting glue adhesion coating 2 another surfaces.
The thickness of above-mentioned graphite flake 1 is preferably 15 μ m, and above-mentioned graphite flake 1 is 1:0.09 with the Thickness Ratio of metal level 4; The thickness of above-mentioned release film 3 is 12 μ m.
Above-mentioned release film 3 is for scribbling the PET film 32 of silicon layer 31, and the silicon layer 31 on these PET film 32 surfaces is bonding with described heat-conducting glue adhesion coating 2.
Embodiment 2: a kind of use for electronic products graphite heat radiation fin, comprise a graphite flake 1, and this upper and lower surface of graphite flake 1 all is covered with metal level 4; Be positioned at and be coated with heat-conducting glue adhesion coating 2, one release films 3 on the metal level of graphite flake 1 lower surface and be covered on heat-conducting glue adhesion coating 2 another surfaces.
The thickness of above-mentioned graphite flake 1 is preferably 80 μ m, and above-mentioned graphite flake 1 is 1:0.45 with the Thickness Ratio of metal level 4, and the thickness of above-mentioned release film 3 is 20 μ m.
Above-mentioned release film 3 is for scribbling the PET film 32 of silicon layer 31, and the silicon layer 31 on these PET film 32 surfaces is bonding with described heat-conducting glue adhesion coating 2.
While adopting above-mentioned use for electronic products graphite heat radiation fin, the upper and lower surface of its graphite flake all is covered with metal level, employing is by the anisotropic metal level of wire coefficient and the combination of isotropism metal level, both improved the thermal conductivity along length, also improved the thickness direction thermal conductivity, realize the uniformity of adhesive tape heat conductivility, exempted from the adhesive tape local overheating, improved performance and the life-span of product; Secondly, also can prevent that graphite powder from coming off, thereby avoid short circuit, improve the reliability of product; Again, it is positioned on the metal level of graphite flake lower surface and is coated with the heat-conducting glue adhesion coating, is covered on when thermal component, both be conducive to and the seamless link for the treatment of thermal component, be beneficial to again heat diffusion, avoid the graphite heat radiation fin local overheating, thereby improved performance and the life-span of product.
Above-described embodiment is only explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the person skilled in the art can understand content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, within all should being encompassed in protection range of the present utility model.
Claims (5)
1. a use for electronic products graphite heat radiation fin, it is characterized in that: comprise a graphite flake (1), the upper and lower surface of this graphite flake (1) all is covered with metal level (4); Be positioned on the metal level of graphite flake (1) lower surface and be coated with heat-conducting glue adhesion coating (2), a release film (3) is covered on another surface of heat-conducting glue adhesion coating (2).
2. use for electronic products graphite heat radiation fin according to claim 1, it is characterized in that: the thickness of described graphite flake (1) is 10 ~ 100 μ m.
3. use for electronic products graphite heat radiation fin according to claim 1 is characterized in that: described graphite flake (1) is 1:0.05 ~ 0.5 with the Thickness Ratio of metal level (4).
4. use for electronic products graphite heat radiation fin according to claim 1, it is characterized in that: the thickness of described release film (3) is 12 μ m ~ 25 μ m.
5. use for electronic products graphite heat radiation fin according to claim 1 and 2, it is characterized in that: described release film (3) is for scribbling the PET film (32) of silicon layer (31), and the silicon layer (31) on this PET film (32) surface is bonding with described heat-conducting glue adhesion coating (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220571089 CN202941076U (en) | 2012-11-01 | 2012-11-01 | Graphite heat radiation sheet for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220571089 CN202941076U (en) | 2012-11-01 | 2012-11-01 | Graphite heat radiation sheet for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202941076U true CN202941076U (en) | 2013-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220571089 Expired - Lifetime CN202941076U (en) | 2012-11-01 | 2012-11-01 | Graphite heat radiation sheet for electronic product |
Country Status (1)
| Country | Link |
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| CN (1) | CN202941076U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298321A (en) * | 2013-06-24 | 2013-09-11 | 江西量一光电科技有限公司 | Tungsten-copper alloy and graphite composite cooling fin and production method thereof |
| CN105611811A (en) * | 2016-03-11 | 2016-05-25 | 奇华光电（昆山）股份有限公司 | Thermal diffusion film/metal foil composite heat sink |
| CN108966615A (en) * | 2018-09-12 | 2018-12-07 | 刘冬舒 | A kind of heat loss through radiation piece |
| CN111357121A (en) * | 2017-12-04 | 2020-06-30 | 东旭集团有限公司 | Upper substrate for micro LED device, and micro LED display device |
-
2012
- 2012-11-01 CN CN 201220571089 patent/CN202941076U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298321A (en) * | 2013-06-24 | 2013-09-11 | 江西量一光电科技有限公司 | Tungsten-copper alloy and graphite composite cooling fin and production method thereof |
| CN105611811A (en) * | 2016-03-11 | 2016-05-25 | 奇华光电（昆山）股份有限公司 | Thermal diffusion film/metal foil composite heat sink |
| CN111357121A (en) * | 2017-12-04 | 2020-06-30 | 东旭集团有限公司 | Upper substrate for micro LED device, and micro LED display device |
| CN108966615A (en) * | 2018-09-12 | 2018-12-07 | 刘冬舒 | A kind of heat loss through radiation piece |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: SUZHOU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130515 |