CN108966615A - A kind of heat loss through radiation piece - Google Patents

A kind of heat loss through radiation piece Download PDF

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Publication number
CN108966615A
CN108966615A CN201811083572.5A CN201811083572A CN108966615A CN 108966615 A CN108966615 A CN 108966615A CN 201811083572 A CN201811083572 A CN 201811083572A CN 108966615 A CN108966615 A CN 108966615A
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CN
China
Prior art keywords
layer
radiation
heat loss
heat
metal layer
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CN201811083572.5A
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Chinese (zh)
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刘冬舒
张建凯
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Individual
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Individual
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Priority to CN201811083572.5A priority Critical patent/CN108966615A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Abstract

A kind of heat loss through radiation piece is mainly made of metal layer and heat loss through radiation layer, metal layer and the matrix for needing to radiate are in close contact, the heat of matrix can be rapidly conducted to metal layer, the heat that matrix conducts can be distributed in rapidly metal layer whole surface by metal layer, the heat of itself is conducted to heat loss through radiation layer by metal layer, heat loss through radiation layer has thermal energy-far infrared conversion function, the converting heat of own absorption can be in far-infrared radiation to air by heat loss through radiation layer, heat loss through radiation layer is radiation infrared must consumption of calorie, the heat of heat loss through radiation layer will constantly be consumed, conduction of the metal layer heat to heat loss through radiation layer can thus be accelerated, since matrix heat can be rapidly conducted to metal layer, the heat of matrix will be constantly consumed, to achieve the purpose that reduce substrate temperature.

Description

A kind of heat loss through radiation piece
Technical field
The present invention relates to the structures and manufacturing process of a kind of heat loss through radiation piece, are mainly used in various electronic instruments, electric appliance The heat loss through radiation of element surface.
Background technique
Electronic instrument constantly minimizes at present, especially mobile digital product to the small form factor requirements of appearance more To be urgent, and the display screen of electronic instrument becomes greatly, and function is stronger and stronger, this certainly will consume more power, consumes power Increase mean that the heat of generation is increasing, this is because the power of input electronic element 100% can not be utilized, electricity Subcomponent input power must some be converted into heat, with electronic component generate heat increase, electronic component Temperature will increase, especially with the rapid development of network technology, mobile phone, computer arithmetic speed be getting faster, operation Speed is accelerated, and the generation of heat is just inevitably enlarged, if the heat that mobile phone, electronic computer generate cannot be quickly discharged to air In, it will result in that mobile phone, the temperature inside electronic computer are excessively high, reduce the speed of service of mobile phone, electronic computer, in order to So that the performance of mobile phone, electronic computer is guaranteed, mobile phone, the heat inside electronic computer must just be made to be discharged to air rapidly In, and the heat of concentration of local can only be conducted rapidly and be scattered by graphite radiating film used at present, it can not be rapid by heat Be diffused into air, thus currently on the market there are no reliable performance, cost performance is suitable, is suitable for handheld electronics makes Heat dissipation technology, the especially product of collection high thermal conductivity and heat loss through radiation occur.
Summary of the invention
In order to overcome the shortcomings of that existing graphite radiating film occurs in use, the present invention to solve the above-mentioned problems, is proposed A kind of heat loss through radiation piece, a kind of heat loss through radiation piece are mainly made of metal layer and heat loss through radiation layer, metal layer and need to radiate Matrix is in close contact, and since metal layer has very high heating conduction, the heat of matrix can be rapidly conducted to metal layer, gold Metal layer whole surface can be distributed in rapidly for the heat that matrix conducts by belonging to layer, keep the heat of matrix high-temperature area rapid It is diffused into the low-temperature region of metal layer, reaches the concentration degree for reducing rapidly matrix high-temperature area heat, metal layer is by the warm of itself Amount is conducted to heat loss through radiation layer, and metal layer conductive conducts heat mainly along the direction of vertical metal layer to the heat of heat loss through radiation layer Amount, since heat loss through radiation coating also has relatively high thermal coefficient, then the heat of metal layer along vertical direction substantially It can be transmitted to heat loss through radiation layer rapidly, heat loss through radiation layer has thermal energy-far infrared conversion function, heat loss through radiation layer It is in far-infrared radiation to air, according to law of conservation of energy it is recognised that radiation dissipates by the converting heat of own absorption Thermosphere it is radiation infrared must consumption of calorie will constantly disappear as heat loss through radiation layer is continuously radiation infrared The heat for consuming heat loss through radiation layer, can thus accelerate conduction of the metal layer heat to heat loss through radiation layer, due to matrix heat meeting It is rapidly conducted to metal layer, the heat of matrix will be constantly consumed, to achieve the purpose that reduce substrate temperature.
The technical solution adopted by the present invention to solve the technical problems is: a kind of heat loss through radiation piece is mainly by adhesive layer, gold Belong to layer, heat loss through radiation layer, surface layer composition, adhesive layer is brushed in metal layer bottom, and adhesive layer is tightly engaged into matrix, metal layer It is tightly engaged into heat loss through radiation layer, heat loss through radiation layer surface spraying surface;Matrix is heat source, and the heat of matrix is fast by adhesive layer Speed is conducted to metal layer, and metal layer has good heating conduction, and the heat that matrix conducts can be distributed in rapidly by metal layer Metal layer whole surface allows the heat of matrix high-temperature area to rapidly diffuse into the low-temperature region of metal layer, reaches rapid drop The concentration degree of low matrix high-temperature area heat, heat loss through radiation layer also have good heating conduction, heat loss through radiation in vertical direction Layer is tightly engaged into metal layer, this just allows the heat of metal layer pass to heat loss through radiation layer along vertical metal layer direction, Heat loss through radiation layer has heat-far infrared conversion function, the heat of itself can be converted to far-infrared radiation to air In, heat loss through radiation layer will consume the heat of itself while radiation infrared, and heat loss through radiation layer can be radiated continuously far Infrared ray, then also will continuous consumption self heat, this heat that just will form metal layer is continuously conducted to heat loss through radiation layer, The heat of matrix is continuously conducted to metal layer, to achieve the purpose that reduce substrate temperature.
The good metal film production of the heating conductions such as copper foil, aluminium foil, silver foil can be used in metal layer.
Adhesive sticker or the production of other bonding agents, adhesive layer can be used in adhesive layer can be divided into two from heating conduction Kind, thermally conductive adhesive layer, not thermally conductive adhesive layer, the thermally conductive adhesive layer of the thermally conductive bonding agent production of adhesive layer selection, adhesive layer selection is commonly Bonding agent makes not thermally conductive adhesive layer.
Heat loss through radiation layer is mainly made of far infrared radiation powder, conductive powder, bonding agent, and far infrared radiation powder, which can choose, to be received The pulvis with radiation infrared function such as rice zinc oxide, nano magnesia;Conductive powder can choose graphene, graphite powder, The pulvis such as carbon black, aluminium nitride, bonding agent can choose acrylic compounds, epoxies, polyurethanes bonding agent;Spoke after curing Penetrate a variety of materials mass ratio in heat dissipating layer are as follows:, far infrared radiation powder is 4-20%, conductive powder 35-45%, and bonding agent is 18-35% will be bonded dilution agent with suitable solvent first, be proportionally added into after waiting bonding agents to be completely dissolved in a solvent remote Then infra-red radiation powder, conductive powder stir evenly stand-by-heat loss through radiation layer slurry.
The thickness control of heat loss through radiation layer is between 0.3-1mm.A kind of heat loss through radiation piece heat dissipation effect and heat loss through radiation layer Thickness direct proportionality.
Metal layer thickness controls between 0.06-0.2mm, the thickness of heat loss through radiation piece heating conduction and metal foil a kind of at Proportional relationship, a kind of more thick heat loss through radiation piece heating conduction of metal foil are better.
Surface thickness gets over Bao Yuehao, the blocked up transmission that will affect far infrared of surface thickness, and surface thickness is controlled in 25-45 Between micron.
A kind of heat loss through radiation piece preferred structure is: a kind of heat loss through radiation piece is by heat loss through radiation layer, adhesive layer, metal layer group At this structural advantages are: the influence radiation infrared for heat loss through radiation layer due to surface layer can be excluded completely, simultaneously The spraying process of surface layer can also be reduced, production cost is reduced.
Matrix of the present invention refers to: the various objects for needing to conduct self heat can be fixed electronics Instrument, hand-held mobile electronic instrument, various electronic components, chemical industry equipment etc..
The beneficial effects of the present invention are: a kind of heat loss through radiation piece can change the graphite radiating for being currently used in electronic instrument Film can only conduct rapidly the heat of part, and effectively cannot be dispersed into heat in air as early as possible while conducting heat Shortcoming, a kind of heat loss through radiation piece can reduce electrical member under conditions of 60 DEG C compared with existing graphite radiating film 5-8 DEG C of part surface Working Temperature.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples
Fig. 1 is a kind of heat loss through radiation piece principle assumption diagram.
Fig. 2 is the principle assumption diagram that a kind of heat loss through radiation piece removes surface layer.
Fig. 3 is a kind of heat loss through radiation piece and matrix juncture schematic diagram.
Figure number explanation: 1. heat loss through radiation layers, 2. metal layers, 3. surface layers, 4. adhesive layers, 5. matrixes.
Specific embodiment
Embodiment 1: referring to Fig.1, a kind of heat loss through radiation piece is mainly by heat loss through radiation layer 1, metal layer 2, adhesive layer 4, surface layer 3 Composition, in heat loss through radiation layer 1, far-infrared radiation material selects nano zine oxide, and addition quality is 8g, and conductive powder selects stone Black alkene, additive amount 28g, bonding agent select epoxy modified acrylic resin, additive amount 15g, solvent selection dimethylbenzene, addition Amount is 44g, is first dissolved bonding agent with dimethylbenzene, after bonding agent is dissolved completely in dimethylbenzene, addition graphene, Nano zine oxide stirs evenly stand-by -1 slurry of heat loss through radiation layer;Metal layer 2 selects 0.1mm copper foil, the bonding agent choosing of adhesive layer 4 With water soluble pressure-sensitive adnesive, 1 slurry of heat loss through radiation layer made is coated in 2 surface of metal layer, slurry curing is later just in gold Belong to 2 surface of layer and form heat loss through radiation layer 1, thickness control is in 0.3mm after heat loss through radiation layer 1 solidifies, then in the another of metal layer 2 Brush water-borne pressure sensitive adhesive on one side, after the moisture evaporation in pressure sensitive adhesive later just 2 surface of metal layer formed one layer of adhesive layer 4, so Afterwards again in 4 surface spraying surface 3 of adhesive layer, 3 sprayed on material of surface layer select acrylic resin, surface layer 3 to solidify after with a thickness of 35 Micron, so far, a kind of heat loss through radiation piece completes.
Embodiment 2: referring to Fig. 2, a kind of heat loss through radiation piece is mainly made of heat loss through radiation layer 1, metal layer 2, adhesive layer 4, In heat loss through radiation layer 1, far-infrared radiation material selects nano magnesia, and addition quality is 10g, and conductive powder selects graphite Powder, additive amount 30g, bonding agent select epoxy modified acrylic resin, additive amount 15g, solvent selection dimethylbenzene, additive amount For 50g, bonding agent is dissolved with dimethylbenzene first, after bonding agent is dissolved completely in dimethylbenzene, graphite powder is added, receives Rice magnesia stirs evenly stand-by -1 slurry of heat loss through radiation layer;Metal layer 2 selects 0.1mm aluminium foil, and the bonding agent of adhesive layer 4 is selected 1 slurry of heat loss through radiation layer made is coated in 2 surface of metal layer by oiliness pressure sensitive adhesive, and slurry curing is later just in metal layer 2 Surface forms heat loss through radiation layer 1, and thickness control is in 0.2mm after heat loss through radiation layer 1 solidifies, then in the another side of metal layer 2 Brush oiliness pressure sensitive adhesive, after the solvent in pressure sensitive adhesive point volatilization later just in 2 surface of metal layer formation, one layer of adhesive layer 4, so far, A kind of heat loss through radiation piece after optimization completes.

Claims (5)

1. a kind of heat loss through radiation piece is mainly made of adhesive layer (4), metal layer (2), heat loss through radiation layer (1), surface layer (3), special Sign is: adhesive layer (4) are brushed in metal layer (2) bottom, and adhesive layer (4) is tightly engaged into matrix (5), and metal layer (2) is above and spoke It penetrates heat dissipating layer (1) to be tightly engaged into, heat loss through radiation layer (1) surface spraying surface (3).
2. a kind of heat loss through radiation piece according to claim 1, it is characterized in that: metal layer (2) can be used copper foil, aluminium foil, The good metal film production of the heating conductions such as silver foil;Adhesive sticker or the production of other bonding agents can be used in adhesive layer (4);Radiation Heat dissipating layer (1) is mainly made of far infrared radiation powder, conductive powder, bonding agent.
3. a kind of heat loss through radiation piece according to claim 1, it is characterized in that: the thickness control of heat loss through radiation layer (1) exists Between 0.3-1mm;Metal layer (2) thickness control is between 0.06-0.2mm;Surface layer (3) thickness control is between 25-45 microns.
4. a kind of heat loss through radiation piece according to claim 1, it is characterized in that: in heat loss through radiation layer (1), a variety of materials matter Amount ratio are as follows: far infrared radiation powder is 4-20%, conductive powder 35-45%, bonding agent 18-35%.
5. a kind of heat loss through radiation piece according to claim 1, it is characterized in that: adhesive layer (4) can be used adhesive sticker or The production of other bonding agents, adhesive layer (4) can be divided into two kinds from heating conduction, thermally conductive adhesive layer (4), not thermally conductive adhesive layer (4), adhesive layer (4) selects thermally conductive bonding agent to make thermally conductive adhesive layer (4), and adhesive layer (4) selection general adhesive production is not led Thermal adhesive layer (4).
CN201811083572.5A 2018-09-12 2018-09-12 A kind of heat loss through radiation piece Pending CN108966615A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202941076U (en) * 2012-11-01 2013-05-15 苏州斯迪克新材料科技股份有限公司 Graphite heat radiation sheet for electronic product
US20160324031A1 (en) * 2013-11-12 2016-11-03 Jnc Corporation Heat sink
CN206493657U (en) * 2017-01-17 2017-09-15 东莞市高酷纳米科技有限公司 Nanometer fin
CN107306489A (en) * 2016-04-20 2017-10-31 美思菲林股份有限公司 The manufacture method of fin and fin
CN107384238A (en) * 2017-08-16 2017-11-24 刘秋雷 One kind leads thermal radiation heat dissipation film
CN209420183U (en) * 2018-09-12 2019-09-20 刘冬舒 A kind of heat loss through radiation piece

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202941076U (en) * 2012-11-01 2013-05-15 苏州斯迪克新材料科技股份有限公司 Graphite heat radiation sheet for electronic product
US20160324031A1 (en) * 2013-11-12 2016-11-03 Jnc Corporation Heat sink
CN107306489A (en) * 2016-04-20 2017-10-31 美思菲林股份有限公司 The manufacture method of fin and fin
CN206493657U (en) * 2017-01-17 2017-09-15 东莞市高酷纳米科技有限公司 Nanometer fin
CN107384238A (en) * 2017-08-16 2017-11-24 刘秋雷 One kind leads thermal radiation heat dissipation film
CN209420183U (en) * 2018-09-12 2019-09-20 刘冬舒 A kind of heat loss through radiation piece

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