CN107901524A - Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film - Google Patents
Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film Download PDFInfo
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- CN107901524A CN107901524A CN201711059790.0A CN201711059790A CN107901524A CN 107901524 A CN107901524 A CN 107901524A CN 201711059790 A CN201711059790 A CN 201711059790A CN 107901524 A CN107901524 A CN 107901524A
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- class graphene
- copper
- copper foil
- control panel
- circuit control
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 119
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 116
- 239000002131 composite material Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 143
- 229910052802 copper Inorganic materials 0.000 claims abstract description 66
- 239000010949 copper Substances 0.000 claims abstract description 66
- 230000002708 enhancing effect Effects 0.000 claims abstract description 63
- 239000011889 copper foil Substances 0.000 claims abstract description 58
- 238000009413 insulation Methods 0.000 claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 150000001336 alkenes Chemical class 0.000 claims description 4
- 238000003490 calendering Methods 0.000 claims description 4
- 239000004568 cement Substances 0.000 claims description 3
- 238000005469 granulation Methods 0.000 claims description 3
- 230000003179 granulation Effects 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 8
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 abstract description 3
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 240000005572 Syzygium cordatum Species 0.000 description 1
- 235000006650 Syzygium cordatum Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of unmanned plane circuit control panel with class graphene composite radiating film of the present invention, including unmanned plane circuit control panel body, the back side of unmanned plane circuit control panel body are connected by thermal conductive insulation glue with class graphene composite radiating film；Class graphene composite radiating film includes class graphene copper-based enhancing heat conducting film, copper foil and water-absorbing resin layer successively outward from interior, multiple holes are wherein evenly equipped with copper foil, copper foil is engaged by hole and the copper-based enhancing heat conducting film of class graphene, and is provided with thermal conductive insulation glue between copper foil and the copper-based enhancing heat conducting film of class graphene.The manufacture method of the unmanned plane circuit control panel with class graphene composite radiating film of the present invention, class graphene composite radiating film is made by class graphene copper-based enhancing heat conducting film, copper foil and thermal conductive insulation glue, and class graphene composite radiating film is attached to the back side of unmanned plane circuit control panel body by thermal conductive insulation glue.The present invention is easy to operate, heat dissipation and good heat conduction effect and stabilization, service life length.
Description
Technical field
The present invention relates to the unmanned plane circuit control panel and its manufacture method of a kind of good heat dissipation effect, more specifically, relate to
And a kind of unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film.
Background technology
Unmanned plane is a kind of unmanned vehicle manipulated by radio robot or itself presetting apparatus.Mesh
Preceding people are very high to the function of unmanned plane and the demand of disposal ability, therefore the degree of integration of unmanned plane is higher and higher, unmanned plane
CPU kernel it is also more and more, while the frequency of CPU is also higher and higher.So high frequency and performance, makes the work of CPU
Temperature is higher and higher, and the rise of the temperature of CPU will seriously affect its working performance, and therefore, effective heat dissipation of CPU is quite important.
Also have on the market in being coated with double faced adhesive tape on graphite paper or graphite composite material, then be labelled to CPU board, but the high meeting of double faced adhesive tape thermal resistance
Heat conductivity is reduced, is current improved important topic still to be studied above.
The content of the invention
1. technical problems to be solved by the inivention
It is an object of the present invention to overcome the above mentioned deficiencies, provide a kind of nobody with class graphene composite radiating film
Machine circuit control panel and its manufacture method, technical solution using the present invention is simple in structure, easy to operate, heat dissipation and heat conduction effect
Fruit is good and stablizes, and extends the service life of unmanned plane circuit control panel.
2. technical solution
To reach above-mentioned purpose, technical solution provided by the invention is：
A kind of unmanned plane circuit control panel with class graphene composite radiating film of the present invention, including unmanned plane circuit control
Making sheet body, the back side of the unmanned plane circuit control panel body pass through thermal conductive insulation glue and class graphene composite radiating film phase
Even；The class graphene composite radiating film includes class graphene copper-based enhancing heat conducting film, copper foil and water suction successively outward from interior
Resin bed, is wherein evenly equipped with multiple holes on copper foil, copper foil is engaged by hole and the copper-based enhancing heat conducting film of class graphene,
And it is provided with thermal conductive insulation glue between copper foil and the copper-based enhancing heat conducting film of class graphene.
Further, the thermal conductive insulation glue is mixed to prepare by adhesive, hexagonal boron nitride and ceramic powder.
Further, the copper-based enhancing heat conducting film of the class graphene mixes post-calendering by class graphene powder with copper powder
It is made.
A kind of manufacture method of unmanned plane circuit control panel with class graphene composite radiating film of the present invention, its step
For：
1) it is mixed to prepare thermal conductive insulation glue using adhesive, hexagonal boron nitride and ceramic powder；
2) class graphene powder and copper powder are added into twin-screw continuous granulation machine and carry out mixed processing, class graphene powder and
The copper-based enhancing Heat Conduction Material of class graphene is made in copper powder after fully merging, then the copper-based enhancing Heat Conduction Material of class graphene is sent to pressure
Prolong mechanism and obtain the copper-based enhancing heat conducting film of class graphene；
3) copper foil surface is pre-processed, removes pollution and the oxide layer of copper foil surface, then copper foil surface is carried out
Roughening treatment, and it is evenly distributed with multiple holes in copper foil surface；
4) by thermal conductive insulation glue and step 3) made from the copper-based enhancing heat conducting film of class graphene made from step 2), step 1)
Obtained copper foil is placed sequentially on pressing machine worktable from top to bottom, and pressing machine works so that the copper-based enhancing heat conducting film of class graphene
With copper foil by hole and the engaged fixation of thermal conductive insulation glue, and keep 2min, you can obtain class graphene composite radiating film；
5) nothing is pasted after step 4) being made the uniform coated with thermally conductive insulating cement in upper surface of class graphene composite radiating film
The back side of man-machine circuit control panel body.
Further, copper foil outer application has water-absorbing resin layer in the step 4).
3. beneficial effect
Using technical solution provided by the invention, compared with existing known technology, have the advantages that：
(1) a kind of unmanned plane circuit control panel with class graphene composite radiating film of the invention, its unmanned plane circuit
The back side of control panel body is by thermal conductive insulation glue and class graphene composite radiating film, and thermal conductive insulation glue is by adhesive, six side's nitrogen
Change boron and ceramic powder is mixed to prepare, there is good pyroconductivity and splendid insulation performance, and high temperature resistant, be not easy high temperature and take off
From class graphene composite radiating film can be transferred heat to well, and plays the purpose of insulation；
(2) a kind of unmanned plane circuit control panel with class graphene composite radiating film of the invention, its class graphene are answered
Close heat dissipation film from it is interior outward successively include class graphene it is copper-based enhancing heat conducting film, copper foil and water-absorbing resin layer, class graphene it is copper-based
Radiate on enhancing heat conducting film heat conduction to copper foil, good heat dissipation effect, and the presence of water-absorbing resin layer possesses moisture-proof role, so as to nothing
Man-machine circuit control panel carries out good protection, ensures service life；
(3) a kind of unmanned plane circuit control panel with class graphene composite radiating film of the invention, on its copper foil uniformly
There are multiple holes, copper foil is engaged by hole and the copper-based enhancing heat conducting film of class graphene so that copper foil and class graphene copper
The adhesive force of base enhancing heat conducting film greatly increases so that the interface resistance smaller of copper foil and the copper-based enhancing heat conducting film of class graphene,
Substantially increase thermal conductivity so that heat dissipation effect is more preferable, and is provided with and leads between copper foil and the copper-based enhancing heat conducting film of class graphene
Heat insulation glue, further improves the adhesive force of copper foil and the copper-based enhancing heat conducting film of class graphene, and plays the purpose of insulation；
(4) a kind of unmanned plane circuit control panel with class graphene composite radiating film of the invention, it is in class graphene
Two surfaces up and down of copper-based enhancing heat conducting film are respectively provided with thermal conductive insulation glue, maximumlly play the copper-based enhancing heat conducting film of class graphene
Heat conductivility, maximumlly suppress class graphene it is copper-based enhancing heat conducting film electric conductivity so that heat conduction is imitated, and is prevented at the same time
The influence of the copper-based enhancing heat conducting film electric conductivity of class graphene；
(5) a kind of unmanned plane circuit control panel with class graphene composite radiating film of the invention, its class graphene copper
Base enhancing heat conducting film mixes post-calendering with copper powder by class graphene powder and is made, and not only increases heat conduction and heat radiation performance, moreover it is possible to and
When effectively shed the heat of inside, ensure that the copper-based enhancing heat conducting film thermal diffusivity of class graphene is balanced and stablizes；
(6) manufacture method of a kind of unmanned plane circuit control panel with class graphene composite radiating film of the invention, its
It is easy to operate, the copper-based enhancing heat conducting film of class graphene that thermal diffusivity is balanced and stablizes can be obtained, and copper foil is engaged by hole,
So that stable connection between copper foil and the copper-based enhancing heat conducting film of class graphene, and utilize copper-based enhancing two table of heat conducting film of class graphene
The thermal conductive insulation glue in face, maximumlly plays the heat conductivility of the copper-based enhancing heat conducting film of class graphene, maximumlly suppresses class stone
The electric conductivity of the black copper-based enhancing heat conducting film of alkene.
Brief description of the drawings
Fig. 1 is a kind of sectional view of unmanned plane circuit control panel with class graphene composite radiating film of the present invention.
Label declaration in schematic diagram：1st, unmanned plane circuit control panel body；2nd, thermal conductive insulation glue；3rd, class graphene is copper-based
Strengthen heat conducting film；4th, copper foil；5th, water-absorbing resin layer.
Embodiment
To further appreciate that present disclosure, the present invention is described in detail in conjunction with the accompanying drawings and embodiments.
Embodiment
With reference to Fig. 1, a kind of unmanned plane circuit control panel with class graphene composite radiating film of the present embodiment, including nothing
Man-machine circuit control panel body 1, the back side of unmanned plane circuit control panel body 1 are compound by thermal conductive insulation glue 2 and class graphene
Heat dissipation film is connected, and thermal conductive insulation glue 2 is mixed to prepare by adhesive, hexagonal boron nitride and ceramic powder, have good pyroconductivity and
Splendid insulation performance, and high temperature resistant, are not easy high temperature and depart from, and can transfer heat to class graphene composite radiating well
Film, and play the purpose of insulation；Class graphene composite radiating film includes the copper-based enhancing heat conduction of class graphene successively outward from interior
Film 3, copper foil 4 and water-absorbing resin layer 5, class graphene copper-based strengthen are radiated on heat conducting film heat conduction to copper foil, good heat dissipation effect, and are inhaled
The presence of water tree lipid layer possesses moisture-proof role, so as to carry out good protection to unmanned plane circuit control panel, ensures service life；
The copper-based enhancing heat conducting film 3 of class graphene mixes post-calendering with copper powder by class graphene powder and is made in the present embodiment, not only strengthens
Heat conduction and heat radiation performance, moreover it is possible to which the heat for the inside that timely and effectively sheds, ensure that the copper-based enhancing heat conducting film heat dissipation of class graphene
Property it is balanced and stablize；Multiple holes are evenly equipped with copper foil 4, copper foil 4 is mutual by hole and the copper-based enhancing heat conducting film 3 of class graphene
Occlusion so that the adhesive force of copper foil and the copper-based enhancing heat conducting film of class graphene greatly increases so that copper foil and class graphene are copper-based
Strengthen the interface resistance smaller of heat conducting film, substantially increase thermal conductivity so that heat dissipation effect is more preferable, and copper foil 4 and class graphite
Thermal conductive insulation glue 2 is provided between the copper-based enhancing heat conducting film 3 of alkene, further improves copper foil and the copper-based enhancing heat conduction of class graphene
The adhesive force of film, and play the purpose of insulation；In addition it is respectively provided with and leads on two surfaces up and down of the copper-based enhancing heat conducting film 3 of class graphene
Heat insulation glue 2, maximumlly plays the heat conductivility of the copper-based enhancing heat conducting film 3 of class graphene, maximumlly suppresses class graphene
The electric conductivity of copper-based enhancing heat conducting film 3.
A kind of manufacture method of unmanned plane circuit control panel with class graphene composite radiating film of the present embodiment, it is walked
Suddenly it is：
1) be mixed to prepare thermal conductive insulation glue 2 using adhesive, hexagonal boron nitride and ceramic powder, have good pyroconductivity and
Splendid insulation performance, and high temperature resistant, are not easy high temperature and depart from；
2) class graphene powder and copper powder are added into twin-screw continuous granulation machine and carry out mixed processing, class graphene powder and
The copper-based enhancing Heat Conduction Material of class graphene is made in copper powder after fully merging, then the copper-based enhancing Heat Conduction Material of class graphene is sent to pressure
Prolong mechanism and obtain the copper-based enhancing heat conducting film 3 of class graphene, not only increase heat conduction and heat radiation performance, moreover it is possible to which timely and effectively shed inside
Heat, ensure that the copper-based enhancing heat conducting film thermal diffusivity of class graphene is balanced and stablizes；
3) 4 surface of copper foil is pre-processed, removes pollution and the oxide layer on copper foil 4 surface, then to 4 surface of copper foil into
Row roughening treatment, and it is evenly distributed with multiple holes in copper foil surface；
4) by thermal conductive insulation glue 2 and step made from the copper-based enhancing heat conducting film 3 of class graphene made from step 2), step 1)
3) copper foil 4 is made to be placed sequentially in from top to bottom on pressing machine worktable, pressing machine works so that the copper-based enhancing of class graphene is led
Hotting mask 3 and copper foil 4 keep 2min by the 2 engaged fixation of hole and thermal conductive insulation glue, you can it is compound to obtain class graphene
Heat dissipation film, adds thermal conductive insulation glue 2, between copper foil and the copper-based enhancing heat conducting film of class graphene between being engaged copper foil simultaneously by hole
Stable connection so that the interface resistance smaller of copper foil and the copper-based enhancing heat conducting film of class graphene substantially increases thermal conductivity so that
Heat dissipation effect is more preferable；4 outer application of copper foil has water-absorbing resin layer 5, possesses moisture-proof role, thus to unmanned plane circuit control panel into
The good protection of row, ensures service life；
5) nothing is pasted after step 4) being made the uniform coated with thermally conductive insulating cement 2 in upper surface of class graphene composite radiating film
The back side of man-machine circuit control panel body 1, can transfer heat to class graphene composite radiating film well, and play absolutely
The purpose of edge.
A kind of the unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film of the present invention, operation
It is convenient, the copper-based enhancing heat conducting film of class graphene that thermal diffusivity is balanced and stablizes can be obtained, and copper foil is engaged by hole so that
Stable connection between copper foil and the copper-based enhancing heat conducting film of class graphene, and utilize two surface of the copper-based enhancing heat conducting film of class graphene
Thermal conductive insulation glue, maximumlly plays the heat conductivility of the copper-based enhancing heat conducting film of class graphene, maximumlly suppresses class graphene
The electric conductivity of copper-based enhancing heat conducting film.
Schematically the present invention and embodiments thereof are described above, this describes no restricted, institute in attached drawing
What is shown is also one of embodiments of the present invention, and actual structure is not limited thereto.So if common skill of this area
Art personnel are enlightened by it, without departing from the spirit of the invention, are not inventively designed and the technical solution
Similar frame mode and embodiment, are within the scope of protection of the invention.
Claims (5)
1. a kind of unmanned plane circuit control panel with class graphene composite radiating film, including unmanned plane circuit control panel body
(1), it is characterised in that：The back side of the unmanned plane circuit control panel body (1) passes through thermal conductive insulation glue (2) and class graphene
Composite radiating film is connected；The class graphene composite radiating film includes the copper-based enhancing heat conducting film of class graphene successively outward from interior
(3), copper foil (4) and water-absorbing resin layer (5), are wherein evenly equipped with multiple holes on copper foil (4), copper foil (4) passes through hole and class stone
The black copper-based enhancing heat conducting film (3) of alkene is engaged, and is set between copper foil (4) and the copper-based enhancing heat conducting film (3) of class graphene
There is thermal conductive insulation glue (2).
2. a kind of unmanned plane circuit control panel with class graphene composite radiating film according to claim 1, its feature
It is：The thermal conductive insulation glue (2) is mixed to prepare by adhesive, hexagonal boron nitride and ceramic powder.
3. a kind of unmanned plane circuit control panel with class graphene composite radiating film according to claim 1, its feature
It is：The copper-based enhancing heat conducting film (3) of the class graphene mixes post-calendering with copper powder by class graphene powder and is made.
4. a kind of manufacture method of the unmanned plane circuit control panel with class graphene composite radiating film, its step are：
1) it is mixed to prepare thermal conductive insulation glue (2) using adhesive, hexagonal boron nitride and ceramic powder；
2) class graphene powder and copper powder are added into twin-screw continuous granulation machine and carries out mixed processing, class graphene powder and copper powder
The copper-based enhancing Heat Conduction Material of class graphene is fully made after fusion, then the copper-based enhancing Heat Conduction Material of class graphene is sent to calender
The copper-based enhancing heat conducting film (3) of class graphene is made；
3) copper foil (4) surface is pre-processed, pollution and the oxide layer on copper foil (4) surface is removed, then to copper foil (4) surface
Roughening treatment is carried out, and multiple holes are evenly distributed with copper foil surface；
4) by thermal conductive insulation glue (2) and step made from the copper-based enhancing heat conducting film (3) of class graphene made from step 2), step 1)
3) copper foil (4) is made to be placed sequentially in from top to bottom on pressing machine worktable, pressing machine works so that the copper-based enhancing of class graphene
Heat conducting film (3) and copper foil (4) keep 2min by hole and thermal conductive insulation glue (2) engaged fixation, you can obtain class stone
Black alkene composite radiating film；
5) nobody is pasted after step 4) being made the uniform coated with thermally conductive insulating cement (2) in upper surface of class graphene composite radiating film
The back side of machine circuit control panel body (1).
A kind of 5. manufacturer of unmanned plane circuit control panel with class graphene composite radiating film according to claim 1
Method, it is characterised in that：Copper foil (4) outer application has water-absorbing resin layer (5) in the step 4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711059790.0A CN107901524A (en) | 2017-11-01 | 2017-11-01 | Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711059790.0A CN107901524A (en) | 2017-11-01 | 2017-11-01 | Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107901524A true CN107901524A (en) | 2018-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711059790.0A Pending CN107901524A (en) | 2017-11-01 | 2017-11-01 | Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film |
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| CN110111951A (en) * | 2019-05-30 | 2019-08-09 | 王奉瑾 | A kind of device being used to prepare graphene conductive structural body |
| CN110232989A (en) * | 2019-05-30 | 2019-09-13 | 王奉瑾 | A kind of preparation method of graphene conductive structural body |
| CN110602871A (en) * | 2019-09-16 | 2019-12-20 | 沪士电子股份有限公司 | Graphene heat-conducting PCB and preparation method thereof |
| CN110690527A (en) * | 2019-10-09 | 2020-01-14 | 浙江绿源电动车有限公司 | Power lithium battery uniform temperature heat dissipation system composed of graphene heat conduction film |
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Application publication date: 20180413 |