CN105472947A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN105472947A CN105472947A CN201510939746.3A CN201510939746A CN105472947A CN 105472947 A CN105472947 A CN 105472947A CN 201510939746 A CN201510939746 A CN 201510939746A CN 105472947 A CN105472947 A CN 105472947A
- Authority
- CN
- China
- Prior art keywords
- thermal insulation
- insulation layer
- layer
- electronic equipment
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
An embodiment of the invention discloses an electronic device. The electronic device comprises a heat dissipation structure and a housing, wherein the heat dissipation structure comprises a heat dissipation layer and a first heat insulation layer; the heat dissipation layer adopts a layer structure capable of emitting heat; and the first heat insulation layer is arranged between the heat dissipation layer and the housing to insulate heat transfer between the heat dissipation layer and the housing.
Description
Technical field
The present invention relates to the heat dissipation technology in electronic applications, particularly relate to a kind of electronic equipment.
Background technology
Along with popularization, the universal and development of electronic product, electronic product function is more and more, performance is more and more stronger, it is more and more abundanter to experience, and brings a lot of facility to the life of people.Certainly, the requirement of people to the aspect such as frivolous property, portability of electronic product is also more and more higher.In order to adapt to the higher requirement of user to electronic product, market there is ultra-thin notebook designs.Due to the lightening design of notebook, the heat radiation of notebook can only rely on radiation and conduction two kinds of modes mostly.The radiating efficiency of above-mentioned two schemes is low, and under notebook high power consumption, Consumer's Experience is also poor.
In order to solve the problem, existing solution pastes high thermal conductivity materials such as graphite flake, auxiliary heat dissipation near heating sources.But because highly heat-conductive material belongs to uniform temperature material in existing this solution, the conductive coefficient of uniform temperature material is limited; Therefore, there will be heat and penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, produce poor Consumer's Experience.
Summary of the invention
For solving the problems of the technologies described above, the embodiment of the present invention is expected to provide a kind of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Technical scheme of the present invention is achieved in that
A kind of electronic equipment, described electronic equipment comprises: radiator structure and shell, described radiator structure comprises: heat dissipating layer and the first thermal insulation layer, described heat dissipating layer is can the Rotating fields of distribute heat, described first thermal insulation layer be arranged on described heat dissipating layer and and between described shell, with isolated heat transmission between described heat dissipating layer and described shell.
Optionally, described radiator structure also comprises: be arranged on described heat dissipating layer and near described shell face on protective layer, described protective layer used in playing sealing function, described radiator structure also comprises:
Second thermal insulation layer, described second thermal insulation layer is arranged on described protective layer and on face away from described heat dissipating layer; Wherein, described second thermal insulation layer passes through for isolated heat;
Described first thermal insulation layer is arranged on the position between described heat dissipating layer and described protective layer.
Optionally; described radiator structure also comprises: be arranged on described heat dissipating layer and near described shell face on protective layer; described protective layer used in playing sealing function, described first thermal insulation layer is arranged on described protective layer and on face away from described heat dissipating layer, described radiator structure also comprises:
Second thermal insulation layer, described second thermal insulation layer is arranged on described first thermal insulation layer and on face away from described heat dissipating layer; Wherein, described second thermal insulation layer passes through for isolated heat;
Optionally, described electronic equipment also comprises protective layer, and described protective layer used in the effect playing insulation, described radiator structure also comprises:
Second thermal insulation layer, described second thermal insulation layer be arranged on described protective layer and near described shell face on;
Described second thermal insulation layer is used for isolated heat to be passed through.
Optionally, described radiator structure also comprises: gum, and described gum is arranged on described first thermal insulation layer and on face away from described heat dissipating layer.
Optionally, described radiator structure also comprises: gum, and described gum is arranged on described second thermal insulation layer and on face away from described protective layer.
Optionally, described radiator structure also comprises gum, wherein:
Described first thermal insulation layer is arranged on described heat dissipating layer and does not all cover on the face of described heat dissipating layer;
Described gum to be arranged on described first thermal insulation layer with layer and described first thermal insulation layer does not cover the position of described heat dissipating layer.
Optionally, described radiator structure also comprises gum, wherein:
Described second thermal insulation layer is arranged on the face of described protective layer away from described heat dissipating layer, and described second thermal insulation layer does not all cover described protective layer;
Described gum to be arranged on described second thermal insulation layer with layer and described second thermal insulation layer does not cover the position of described protective layer.
Optionally, described radiator structure also comprises gum, wherein:
Described second thermal insulation layer is arranged on the face of described first thermal insulation layer away from described heat dissipating layer, and described second thermal insulation layer does not all cover described first thermal insulation layer;
Described gum to be arranged on described second thermal insulation layer with layer and described second thermal insulation layer does not cover the position of described first thermal insulation layer.
Optionally, described electronic equipment also comprises gum, wherein: described gum is arranged on the face of described first thermal insulation layer and described second thermal insulation layer.
Optionally, described electronic equipment also comprises gum, wherein:
Described first thermal insulation layer is arranged on described heat dissipating layer and does not all cover on the face of described heat dissipating layer;
Described second thermal insulation layer is arranged on described protective layer on the face of described shell, and described second thermal insulation layer does not all cover described protective layer;
Described gum to be arranged on described first thermal insulation layer with layer and described first thermal insulation layer does not cover described heat dissipating layer and with described second thermal insulation layer with layer and described second thermal insulation layer does not cover the position of described protective layer.
Optionally, the thickness of described first thermal insulation layer is 1 ~ 80 μm;
The material of described first thermal insulation layer comprises aeroge.
Optionally, the thickness of described second thermal insulation layer is 1 ~ 80 μm;
The material of described second thermal insulation layer comprises aeroge.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Accompanying drawing explanation
The structural representation of a kind of electronic equipment that Fig. 1 provides for embodiments of the invention;
The structural representation of the another kind of electronic equipment that Fig. 2 provides for embodiments of the invention;
The structural representation of another electronic equipment that Fig. 3 provides for embodiments of the invention;
The structural representation of another electronic equipment that Fig. 4 provides for embodiments of the invention;
The structural representation of a kind of electronic equipment that Fig. 5 provides for another embodiment of the present invention;
The structural representation of the another kind of electronic equipment that Fig. 6 provides for another embodiment of the present invention;
The structural representation of another electronic equipment that Fig. 7 provides for another embodiment of the present invention;
The structural representation of another electronic equipment that Fig. 8 provides for another embodiment of the present invention;
The structural representation of a kind of electronic equipment that Fig. 9 provides for another embodiment of the present invention;
The structural representation of the another kind of electronic equipment that Figure 10 provides for another embodiment of the present invention;
The structural representation of another electronic equipment that Figure 11 provides for another embodiment of the present invention;
The structural representation of another electronic equipment that Figure 12 provides for another embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.
Embodiments of the invention provide a kind of electronic equipment, and this electronic equipment comprises: radiator structure 1 and shell 2, and radiator structure 1 comprises: heat dissipating layer 11, this heat dissipating layer 11 is can the Rotating fields of distribute heat, with reference to shown in Fig. 1, radiator structure 1 also comprises: the first thermal insulation layer 12
First thermal insulation layer 12 is arranged between heat dissipating layer 11 and shell 2.
Wherein, the first thermal insulation layer 12 is for the heat transmission between isolated heat dissipating layer 11 and shell 2.
The material of the first thermal insulation layer is all fine as long as can completely cut off the material that heat passes through.
It should be noted that, only that the relation between radiator structure and shell is schematically described shown in figure in the present embodiment, do not limit shell must be contact with radiator structure together, certainly, also can be at regular intervals between radiator structure and shell, as long as ensure that the first thermal insulation layer is all fine in the design of heat dissipating layer on the face of shell.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment, this electronic equipment comprises: radiator structure 1 and shell 2, radiator structure 1 comprises: heat dissipating layer 11, this heat dissipating layer 11 is can the Rotating fields of distribute heat, with reference to shown in Fig. 2, radiator structure 1 also comprises: the first thermal insulation layer 12 and protective layer 13, and protective layer 13 is arranged on heat dissipating layer 11 and on the face of shell 2, protective layer 13 is for playing sealing function; This radiator structure 1 also comprises: the second thermal insulation layer 14, wherein:
Second thermal insulation layer 14 is arranged on protective layer 13 and on face away from heat dissipating layer 11.
Wherein, the second thermal insulation layer 14 passes through for isolated heat.
Now, the first thermal insulation layer 12 is arranged on the position between heat dissipating layer 11 and protective layer 13.
Wherein, the first thermal insulation layer 12 is for the heat transmission between isolated heat dissipating layer and shell.
The material of the first thermal insulation layer and the second thermal insulation layer can be all to completely cut off the material that heat passes through, and can be preferably aeroge.
Concrete, the thickness of the first thermal insulation layer and the second thermal insulation layer can be all 1 μm ~ 80 μm.
The thickness of the thickness and the second thermal insulation layer that arrange the first thermal insulation layer is 1 μm ~ 80 μm, namely the function that the first thermal insulation layer and the second thermal insulation layer well realize isolated heat and pass through can be ensured, the lightening design of electronic equipment can be realized again, avoid the thickness due to the first thermal insulation layer and the second thermal insulation layer blocked up, cause the problem after the electronic equipment thickness of formation, ensure that the design for aesthetic of electronic equipment.Certainly, the thickness of the first thermal insulation layer and the second thermal insulation layer can be just 1 μm ~ 80 μm scopes, the thickness of restriction first thermal insulation layer and the second thermal insulation layer must not be identical, and the thickness of the first thermal insulation layer can be identical from the thickness of the second thermal insulation layer also can be different with the thickness of the second thermal insulation layer; Preferably, the thickness that can design the first thermal insulation layer is identical with the thickness of the second thermal insulation layer, is convenient to realize, and Making programme is simpler, reduces technology difficulty.
Wherein, the material of the first thermal insulation layer and the second thermal insulation layer preferably aeroge time, first thermal insulation layer and the second thermal insulation layer can be realized by following technique: be combined according to preset ratio with bonding agent by aeroge, and be coated in protective layer and away from the position on the face of heat dissipating layer or between heat dissipating layer and protective layer, then the temperature between adopting 100 degree to 200 carries out high-temperature heating, bonding agent is wherein vapored away, final at protective layer and away from the aeroge of position formation thickness between 1 μm ~ 80 μm on the face of heat dissipating layer or between heat dissipating layer and protective layer.The conductive coefficient of aeroge is 0.018-0.02, and bonding agent can play the effect be bonded in by aeroge on heat dissipating layer.Wherein, preset ratio can be set according to concrete manufacture craft and needs in manufacturing process.
Further, as shown in Figure 3, radiator structure also comprises: gum 15, wherein:
Gum 15 is arranged on the second thermal insulation layer 14 and on face away from protective layer 13.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment; this electronic equipment comprises: radiator structure 1 and shell 2; radiator structure 1 comprises: heat dissipating layer 11; this heat dissipating layer 11 is can the Rotating fields of distribute heat, and with reference to shown in Fig. 4, radiator structure 1 also comprises: the first thermal insulation layer 12 and protective layer 13; protective layer 13 be arranged on heat dissipating layer 11 and near shell 2 face on; protective layer 13 is for playing sealing function, and radiator structure 1 also comprises: the second thermal insulation layer 14, wherein:
First thermal insulation layer 12 is arranged on protective layer 13 and on face away from heat dissipating layer 11.
Second thermal insulation layer 14 is arranged on the first thermal insulation layer 12 and on face away from heat dissipating layer 11.
First thermal insulation layer 12 and the second thermal insulation layer 14 all pass through for isolated heat.
Further, as shown in Figure 5, radiator structure 1 also comprises: gum 15, wherein:
Gum 15 is arranged on the second thermal insulation layer 14 and on face away from heat dissipating layer 11.
Wherein, the material of the first thermal insulation layer and the second thermal insulation layer all can comprise aeroge.
The thickness of the first thermal insulation layer and the second thermal insulation layer all can be 1 ~ 80 μm.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
Due to the first thermal insulation layer and the second thermal insulation layer can conductive coefficient larger, actual use in can by the heat that produced by heat dissipating layer well by the surface transport of the first thermal insulation layer and the second thermal insulation layer louvre to electronic equipment, thus can completely cut off heat by the first thermal insulation layer and the second thermal insulation layer, avoid heat to arrive the shell of electronic equipment.
It should be noted that, about identical with other embodiment in the present invention of the explanation of the first thermal insulation layer and the second thermal insulation layer and formation process in this example, with reference to the associated description in other embodiment in the present invention, can repeat no more herein.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment; this electronic equipment comprises: radiator structure 1 and shell 2; radiator structure 1 comprises: heat dissipating layer 11; this heat dissipating layer 11 is can the Rotating fields of distribute heat; with reference to shown in Fig. 6, this electronic equipment also comprises: the first thermal insulation layer 12 and protective layer 13, and protective layer 13 is for playing the effect of insulation; this radiator structure 1 also comprises: the second thermal insulation layer 14, wherein:
Second thermal insulation layer 14 be arranged on protective layer 13 and near shell 2 face on;
First thermal insulation layer 12 is arranged between heat dissipating layer 11 and shell 2.
First thermal insulation layer 12 and the second thermal insulation layer 14 all pass through for isolated heat.
Wherein, the material of the first thermal insulation layer and the second thermal insulation layer all can comprise aeroge.
The thickness of the first thermal insulation layer and the second thermal insulation layer all can be 1 ~ 80 μm.
Further, as shown in Figure 7, radiator structure 1 also comprises: gum 15, wherein:
Gum 15 is arranged on the face of the first thermal insulation layer 12 and the second thermal insulation layer 14.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
It should be noted that, about identical with other embodiment in the present invention of the explanation of the first thermal insulation layer and the second thermal insulation layer and formation process in this example, with reference to the associated description in other embodiment in the present invention, can repeat no more herein.
Wherein, the position of heat dissipating layer and protective layer is just schematically described in Fig. 6 and 7; restriction heat dissipating layer and protective layer can only not be arranged at this; as long as heat dissipating layer can be played in reality and protective layer should have effect, and meet in the present embodiment the position of the restriction of the first thermal insulation layer and the second thermal insulation layer is all fine.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment, and this electronic equipment comprises: radiator structure 1 and shell 2, and radiator structure 1 comprises: heat dissipating layer 11, this heat dissipating layer 11 is can the Rotating fields of distribute heat, with reference to shown in Fig. 8, radiator structure 1 also comprises: the first thermal insulation layer 12 and gum 15, wherein:
First thermal insulation layer 12 is arranged between heat dissipating layer 11 and shell 2.
First thermal insulation layer 12 is for the heat transmission between isolated heat dissipating layer and shell.
Wherein, the material of the first thermal insulation layer can comprise aeroge.
The thickness of the first thermal insulation layer can be 1 ~ 80 μm.
Gum 15 is arranged on the first thermal insulation layer 12 and on face away from heat dissipating layer 11.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
It should be noted that, about identical with other embodiment in the present invention of the explanation of the first thermal insulation layer and formation process in this example, with reference to the associated description in other embodiment in the present invention, can repeat no more herein.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment, and this electronic equipment comprises: radiator structure 1 and shell 2, and radiator structure 1 comprises: heat dissipating layer 11, this heat dissipating layer 11 is can the Rotating fields of distribute heat, with reference to shown in Fig. 9, radiator structure 1 also comprises: the first thermal insulation layer 12 and gum 15, wherein:
First thermal insulation layer 12 is arranged on heat dissipating layer 11 and does not all cover on the face of heat dissipating layer 11.
First thermal insulation layer 12 is for the heat transmission between isolated heat dissipating layer and shell.
Wherein, the first insulating layer material can comprise aeroge.
First insulation thickness can be 1 ~ 80 μm.
Gum 15 to be arranged on the first thermal insulation layer 12 with layer and the first thermal insulation layer 12 does not cover the position of heat dissipating layer 11.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
Preferably, the first thermal insulation layer can select not cover the position of centre on heat dissipating layer and/or periphery.Like this, gum just can be arranged on the first thermal insulation layer with layer and in the middle of heat dissipating layer and/or the position of periphery, can ensure well to be pasted in the electronic device by radiator structure, simultaneously because gum and the first thermal insulation layer are positioned at same layer, the thickness of the electronic equipment that can avoid the formation of is blocked up.Now, the thickness of gum can be identical with the thickness of the first thermal insulation layer.Certainly, just illustrate that the first thermal insulation layer does not cover the position of heat dissipating layer herein, not restriction can only not be can determine according to the demand of reality in application like this, concrete.
It should be noted that, about identical with other embodiment in the present invention of the explanation of the first thermal insulation layer and formation process in this example, with reference to the associated description in other embodiment in the present invention, can repeat no more herein.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment, this electronic equipment comprises: radiator structure 1 and shell 2, radiator structure 1 comprises: heat dissipating layer 11, this heat dissipating layer 11 is can the Rotating fields of distribute heat, with reference to shown in Figure 10, radiator structure 1 also comprises: the first thermal insulation layer 12 and protective layer 13, and protective layer 13 is arranged on heat dissipating layer 11 and on the face of shell 2, protective layer 13 is for playing sealing function; This radiator structure 1 also comprises: the second thermal insulation layer 14 and gum 15, wherein:
Second thermal insulation layer 14 is arranged on protective layer 13 and on face away from heat dissipating layer 11, the second thermal insulation layer 14 whole protective mulch 13.
Now, the first thermal insulation layer 12 is arranged on the position between heat dissipating layer 11 and protective layer 13.
First thermal insulation layer 12 and the second thermal insulation layer 14 all pass through for isolated heat.
Wherein, the material of the first thermal insulation layer and the second thermal insulation layer all can comprise aeroge.
The thickness of the first thermal insulation layer and the second thermal insulation layer all can be 1 ~ 80 μm.
Gum 15 to be arranged on the second thermal insulation layer 14 with layer and the position of the second thermal insulation layer 14 not covered by the protective layer 13.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
Preferably, the second thermal insulation layer can select the position of centre on not protective mulch and/or periphery.Like this; gum just can be arranged on the second thermal insulation layer with layer and in the middle of protective layer and/or the position of periphery; can ensure well to be pasted in the electronic device by radiator structure, simultaneously because gum and the second thermal insulation layer are positioned at same layer, the thickness of the electronic equipment that can avoid the formation of is blocked up.Now, the thickness of gum can be identical with the thickness of the second thermal insulation layer.Certainly, just illustrate the position that the second thermal insulation layer is not covered by the protective layer herein, not restriction can only not be can determine according to the demand of reality in application like this, concrete.
It should be noted that, about identical with other embodiment in the present invention of the explanation of the first thermal insulation layer and the second thermal insulation layer and formation process in this example, with reference to the associated description in other embodiment in the present invention, can repeat no more herein.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment; this electronic equipment comprises: radiator structure 1 and shell 2; radiator structure 1 comprises: heat dissipating layer 11; this heat dissipating layer 11 is can the Rotating fields of distribute heat, and with reference to shown in Figure 11, radiator structure 1 also comprises: the first thermal insulation layer 12 and protective layer 13; protective layer 13 be arranged on heat dissipating layer 11 and near shell 2 face on; protective layer 13 is for playing sealing function, and radiator structure 1 also comprises: the second thermal insulation layer 14 and gum 15, wherein:
First thermal insulation layer 12 is arranged on protective layer 13 and on face away from heat dissipating layer 11,
Second thermal insulation layer 14 is arranged on the first thermal insulation layer 12 and on face away from heat dissipating layer 11, the second thermal insulation layer 14 does not all cover the first thermal insulation layer 12.
First thermal insulation layer 12 and the second thermal insulation layer 14 all pass through for isolated heat.
Wherein, the material of the first thermal insulation layer and the second thermal insulation layer all can comprise aeroge.
The thickness of the first thermal insulation layer and the second thermal insulation layer all can be 1 ~ 80 μm.
Gum 15 to be arranged on the second thermal insulation layer 14 with layer and the second thermal insulation layer 14 does not cover the position of the first thermal insulation layer 12.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
Preferably, the second thermal insulation layer can select not cover the position of centre on the first thermal insulation layer and/or periphery.Like this, gum just can be arranged on the second thermal insulation layer with layer and in the middle of the first thermal insulation layer and/or the position of periphery, can ensure well radiator structure to be pasted in the electronic device, simultaneously because gum and the second thermal insulation layer are positioned at same layer, the thickness of the electronic equipment that can avoid the formation of is blocked up.Now, the thickness of gum can be identical with the thickness of the second thermal insulation layer.Certainly, just illustrate that the second thermal insulation layer does not cover the position of the first thermal insulation layer herein, not restriction can only not be can determine according to the demand of reality in application like this, concrete.
It should be noted that, about identical with other embodiment in the present invention of the explanation of the first thermal insulation layer and the second thermal insulation layer and formation process in this example, with reference to the associated description in other embodiment in the present invention, can repeat no more herein.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
Embodiments of the invention provide a kind of electronic equipment; this electronic equipment comprises: radiator structure 1 and shell 2; radiator structure 1 comprises: heat dissipating layer 11; this heat dissipating layer 11 is can the Rotating fields of distribute heat; with reference to shown in Figure 12, this electronic equipment also comprises: the first thermal insulation layer 12 and protective layer 13, and protective layer 13 is for playing the effect of insulation; this radiator structure 1 also comprises: the second thermal insulation layer 14 and gum 15, wherein:
First thermal insulation layer 12 is arranged on heat dissipating layer 11 and does not all cover on the face of heat dissipating layer 11.
Second thermal insulation layer 14 is arranged on protective layer 13 and on the face of shell 2, the second thermal insulation layer 14 whole protective mulch 13.
First thermal insulation layer 12 and the second thermal insulation layer 14 all pass through for isolated heat.
Wherein, the material of the first thermal insulation layer and the second thermal insulation layer all can comprise aeroge.
The thickness of the first thermal insulation layer and the second thermal insulation layer all can be 1 ~ 80 μm.
Gum 15 to be arranged on the first thermal insulation layer with layer and the first thermal insulation layer 12 does not cover heat dissipating layer 11 and with the second thermal insulation layer 14 with layer and the position of the second thermal insulation layer 14 not covered by the protective layer 13.
Wherein, the thickness of gum can be preferably 10 μm ~ 50 μm.
Now, the thickness arranging gum is between 10 μm ~ 50 μm, both can ensure well to realize by radiator structure bonding on an electronic device, the thickness of gum can be avoided again blocked up, affect the good looking appearance degree of electronic equipment, can also production cost be saved simultaneously, ensure the lightening design of electronic equipment.
Preferably, the first thermal insulation layer can select not cover the position of centre on heat dissipating layer and/or periphery, and the second thermal insulation layer can select the position of centre on not protective mulch and/or periphery.Like this, gum just can be arranged on the first thermal insulation layer and the second thermal insulation layer with layer and the first thermal insulation layer and the second thermal insulation layer do not cover the position of equivalent layer, can ensure well radiator structure to be pasted in the electronic device, simultaneously because gum and the first thermal insulation layer, the second thermal insulation layer are positioned at same layer, the thickness of the electronic equipment that can avoid the formation of is blocked up.Now, the thickness of gum can be identical with the thickness of the first thermal insulation layer and/or the second thermal insulation layer.Certainly, just illustrate that the position of the second thermal insulation layer layer not covered by the protective layer and the first thermal insulation layer are the position covering heat dissipating layer herein, restriction can only not be can determine according to the demand of reality in application like this, concrete.
It should be noted that, about identical with other embodiment in the present invention of the explanation of the first thermal insulation layer and the second thermal insulation layer and formation process in this example, with reference to the associated description in other embodiment in the present invention, can repeat no more herein.
Wherein, the position of heat dissipating layer and protective layer is just schematically described in Figure 12; restriction heat dissipating layer and protective layer can only not be arranged at this; as long as heat dissipating layer can be played in reality and protective layer should have effect, and meet in the present embodiment the position of the restriction of the first thermal insulation layer and the second thermal insulation layer is all fine.
The electronic equipment that the embodiment of the present invention provides, this electronic equipment comprises: radiator structure and shell, radiator structure comprises: heat dissipating layer and the first thermal insulation layer, and heat dissipating layer is can the Rotating fields of distribute heat, and the first thermal insulation layer is arranged on heat dissipating layer and on the face of shell; Wherein, the first thermal insulation layer is used for isolated heat transmission between described heat dissipating layer and described shell; Like this because the first thermal insulation layer can trap heat pass through, the heat produced in electronic device works process can not arrive the shell of electronic equipment, solve the heat distributed in existing electronic equipment and can penetrate the problem that uniform temperature material directly arrives the shell of electronic equipment, enhance the radiating effect of electronic equipment, improve the interaction capabilities of user and electronic equipment.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure transformation utilizing specification of the present invention and accompanying drawing content to do, or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (13)
1. an electronic equipment, described electronic equipment comprises: radiator structure and shell, described radiator structure comprises: heat dissipating layer and the first thermal insulation layer, described heat dissipating layer is can the Rotating fields of distribute heat, described first thermal insulation layer is arranged between described heat dissipating layer and described shell, with isolated heat transmission between described heat dissipating layer and described shell.
2. electronic equipment according to claim 1, is characterized in that, described radiator structure also comprises: be arranged on described heat dissipating layer and near described shell face on protective layer, described protective layer used in playing sealing function, described radiator structure also comprises:
Second thermal insulation layer, described second thermal insulation layer is arranged on described protective layer and on face away from described heat dissipating layer; Wherein, described second thermal insulation layer passes through for isolated heat;
Described first thermal insulation layer is arranged on the position between described heat dissipating layer and described protective layer.
3. electronic equipment according to claim 1; it is characterized in that; described radiator structure also comprises: be arranged on described heat dissipating layer and near described shell face on protective layer; described protective layer used in playing sealing function; described first thermal insulation layer is arranged on described protective layer and on face away from described heat dissipating layer, described radiator structure also comprises:
Second thermal insulation layer, described second thermal insulation layer is arranged on described first thermal insulation layer and on face away from described heat dissipating layer; Wherein, described second thermal insulation layer passes through for isolated heat.
4. electronic equipment according to claim 1, is characterized in that, described electronic equipment also comprises protective layer, and described protective layer used in the effect playing insulation, described radiator structure also comprises:
Second thermal insulation layer, described second thermal insulation layer be arranged on described protective layer and near described shell face on;
Described second thermal insulation layer is used for isolated heat to be passed through.
5. electronic equipment according to claim 1, is characterized in that, described radiator structure also comprises:
Gum, described gum is arranged on described first thermal insulation layer and on face away from described heat dissipating layer.
6. the electronic equipment according to Claims 2 or 3, is characterized in that, described radiator structure also comprises:
Gum, described gum is arranged on described second thermal insulation layer and on face away from described protective layer.
7. electronic equipment according to claim 1, it is characterized in that, described radiator structure also comprises gum, wherein:
Described first thermal insulation layer is arranged on described heat dissipating layer and does not all cover on the face of described heat dissipating layer;
Described gum to be arranged on described first thermal insulation layer with layer and described first thermal insulation layer does not cover the position of described heat dissipating layer.
8. electronic equipment according to claim 2, is characterized in that, described radiator structure also comprises gum, wherein:
Described second thermal insulation layer is arranged on the face of described protective layer away from described heat dissipating layer, and described second thermal insulation layer does not all cover described protective layer;
Described gum to be arranged on described second thermal insulation layer with layer and described second thermal insulation layer does not cover the position of described protective layer.
9. electronic equipment according to claim 3, is characterized in that, described radiator structure also comprises gum, wherein:
Described second thermal insulation layer is arranged on the face of described first thermal insulation layer away from described heat dissipating layer, and described second thermal insulation layer does not all cover described first thermal insulation layer;
Described gum to be arranged on described second thermal insulation layer with layer and described second thermal insulation layer does not cover the position of described first thermal insulation layer.
10. electronic equipment according to claim 4, is characterized in that, described electronic equipment also comprises gum, wherein:
Described gum is arranged on the face of described first thermal insulation layer and described second thermal insulation layer.
11. electronic equipments according to claim 4, is characterized in that, described electronic equipment also comprises gum, wherein:
Described first thermal insulation layer is arranged on described heat dissipating layer and does not all cover on the face of described heat dissipating layer;
Described second thermal insulation layer is arranged on described protective layer on the face of described shell, and described second thermal insulation layer does not all cover described protective layer;
Described gum to be arranged on described first thermal insulation layer with layer and described first thermal insulation layer does not cover described heat dissipating layer and with described second thermal insulation layer with layer and described second thermal insulation layer does not cover the position of described protective layer.
12. according to Claims 1 to 4,6 ~ 11 arbitrary described electronic equipments, and it is characterized in that, the thickness of described first thermal insulation layer is 1 ~ 80 μm;
The material of described first thermal insulation layer comprises aeroge.
13. according to claim 2 ~ 4,6 ~ 11 arbitrary described electronic equipments, and it is characterized in that, the thickness of described second thermal insulation layer is 1 ~ 80 μm;
The material of described second thermal insulation layer comprises aeroge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510939746.3A CN105472947A (en) | 2015-12-15 | 2015-12-15 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510939746.3A CN105472947A (en) | 2015-12-15 | 2015-12-15 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105472947A true CN105472947A (en) | 2016-04-06 |
Family
ID=55610060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510939746.3A Pending CN105472947A (en) | 2015-12-15 | 2015-12-15 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105472947A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107458062A (en) * | 2017-08-22 | 2017-12-12 | 江苏泛亚微透科技股份有限公司 | Carbon thermally conductive sheet and expanded PTFE heat insulating coat film and preparation method thereof |
| CN110868840A (en) * | 2019-11-13 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
| CN112020268A (en) * | 2019-05-31 | 2020-12-01 | 讯凯国际股份有限公司 | Heat sink device |
| CN112399769A (en) * | 2019-08-13 | 2021-02-23 | 四零四科技股份有限公司 | Heat radiation and heating structure suitable for optical fiber transceiver |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106495A (en) * | 1998-09-29 | 2000-04-11 | Kitagawa Ind Co Ltd | Inner structure of electric/electronic apparatus |
| JP2012151196A (en) * | 2011-01-18 | 2012-08-09 | Panasonic Corp | Thermal insulation sheet |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
-
2015
- 2015-12-15 CN CN201510939746.3A patent/CN105472947A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106495A (en) * | 1998-09-29 | 2000-04-11 | Kitagawa Ind Co Ltd | Inner structure of electric/electronic apparatus |
| JP2012151196A (en) * | 2011-01-18 | 2012-08-09 | Panasonic Corp | Thermal insulation sheet |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107458062A (en) * | 2017-08-22 | 2017-12-12 | 江苏泛亚微透科技股份有限公司 | Carbon thermally conductive sheet and expanded PTFE heat insulating coat film and preparation method thereof |
| CN112020268A (en) * | 2019-05-31 | 2020-12-01 | 讯凯国际股份有限公司 | Heat sink device |
| CN112399769A (en) * | 2019-08-13 | 2021-02-23 | 四零四科技股份有限公司 | Heat radiation and heating structure suitable for optical fiber transceiver |
| CN112399769B (en) * | 2019-08-13 | 2024-02-20 | 四零四科技股份有限公司 | Heat dissipation and heating structure suitable for optical fiber transceiver |
| CN110868840A (en) * | 2019-11-13 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
| CN110868840B (en) * | 2019-11-13 | 2021-05-04 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105472947A (en) | Electronic device | |
| CN205213232U (en) | A heat radiation structure for liquid crystal display equipment | |
| CN203788636U (en) | Shielding case | |
| CN102692000A (en) | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate | |
| CN107901524A (en) | Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film | |
| CN106993394A (en) | A kind of preparation method of high-heat conductive efficency graphite composite sheet | |
| CN103906418A (en) | Cooling fin and manufacturing method thereof | |
| CN205661085U (en) | Graphite alkene thermal insulation membrane | |
| CN202931733U (en) | Portable electronic device | |
| CN205266006U (en) | Multi -layer PCB board | |
| CN202439289U (en) | Graphite composite membrane | |
| CN203884121U (en) | Radiating fin | |
| CN204801156U (en) | Thermal film of low heat conduction of high even heat | |
| CN107396618A (en) | A kind of fin of good insulating | |
| CN203968561U (en) | A kind of heat abstractor and electronic equipment | |
| CN204067347U (en) | A kind of riveted joint has the copper coin of ceramic bases | |
| CN202617509U (en) | Aluminum substrate having high heat-conducting performance and high heat-resisting performance | |
| CN201416866Y (en) | Plate type radiator structure used for LEDs | |
| CN107087378A (en) | The radiating subassembly and electronic equipment of electronic equipment | |
| CN207657295U (en) | Unmanned plane circuit control panel with class graphene composite radiating film | |
| CN202738258U (en) | Efficient heat dissipating flexible circuit board | |
| CN103037669A (en) | Graphite heat-conducting flake | |
| CN104244666A (en) | Novel insulating graphite | |
| CN203633041U (en) | Electronic element heat dissipation apparatus | |
| CN206728484U (en) | The radiating subassembly and electronic equipment of electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |
|
| RJ01 | Rejection of invention patent application after publication |