CN110868840A - Electronic equipment and manufacturing method thereof - Google Patents
Electronic equipment and manufacturing method thereof Download PDFInfo
- Publication number
- CN110868840A CN110868840A CN201911107383.1A CN201911107383A CN110868840A CN 110868840 A CN110868840 A CN 110868840A CN 201911107383 A CN201911107383 A CN 201911107383A CN 110868840 A CN110868840 A CN 110868840A
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- Prior art keywords
- limiting
- heat dissipation
- gel
- dissipation plate
- electronic device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses electronic equipment, including inner panel, heating panel, locating part, gel, the inner panel with the heating panel laminating, the heating panel dorsad the one side of inner panel is equipped with spacing region, the gel drips to be arranged in spacing region, the locating part is fixed in on the heating panel, and follow spacing region's periphery aligns and arranges, the locating part is used for the restriction the gel overflows spacing region. The application also provides a manufacturing method of the electronic equipment. The arrangement of the limiting structure can prevent the gel from overflowing.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to an electronic device and a method for manufacturing the same.
Background
At present, glue is usually dispensed directly on an upper cover or a middle frame of the existing electronic equipment, and due to the fluidity of the glue, the glue is easy to overflow to other electronic components, so that the performance of the electronic components is affected.
Content of application
The application provides an electronic equipment, wherein, electronic equipment includes inner panel, heating panel, locating part, gel, the inner panel with the heating panel laminating, the heating panel dorsad the one side of inner panel is equipped with spacing region, the gel drips to be arranged in spacing region, the locating part is fixed in on the heating panel, and follow spacing region's periphery aligns and arranges, the locating part is used for restricting the gel overflows spacing region.
The embodiment of the application provides a manufacturing method of electronic equipment, which comprises the following steps:
providing an inner plate;
providing a heat dissipation plate, fixedly connecting the heat dissipation plate with the inner plate, and forming a limiting area on the heat dissipation plate;
providing a limiting piece, wherein the limiting piece is formed on one surface, far away from the inner plate, of the heat dissipation plate and is arranged along the periphery aligned with the limiting area;
providing a gel, and placing the gel drop in the limiting region.
The embodiment of the application provides electronic equipment and a manufacturing method thereof, wherein the limiting area is arranged on one surface, far away from the inner plate, of the heat dissipation plate, and meanwhile, the limiting piece is attached to the periphery of the limiting area, so that the gel cannot overflow after being pressed.
Drawings
In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is an exploded schematic view of an electronic device provided in an embodiment of the present application.
Fig. 2 is an exploded schematic view of an electronic device provided in another embodiment of the present application.
Fig. 3 is a schematic structural diagram of a limiting element provided in the embodiment of the present application.
Fig. 4 is a schematic structural diagram of a position limiting element provided in another embodiment of the present application.
FIG. 5 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application
Fig. 6 is a schematic cross-sectional view of an electronic device provided in another embodiment of the present application.
Fig. 7 is a schematic flowchart of a method for manufacturing an electronic device according to an embodiment of the present application.
Fig. 8 is a schematic flow chart of a manufacturing method of an inner plate according to an embodiment of the present application.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present application clearer, the technical solutions of the embodiments of the present application will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be obtained by those skilled in the art without any inventive work based on the embodiments in the present application, belong to the protection scope of the present application, and the technical solutions in the embodiments in the present application will be clearly and completely described below with reference to the drawings in the embodiments in the present application.
Referring to fig. 1 to 2, the present application provides an electronic device 100, where the electronic device 100 includes an inner plate 10, a heat dissipation plate 20, a limiting member 30, and a gel 50, the inner plate 10 is attached to the heat dissipation plate 20, a limiting region 20a is disposed on a surface of the heat dissipation plate 20 opposite to the inner plate 10, the gel 50 is dropped in the limiting region 20a, the limiting member 30 is fixed on the heat dissipation plate 20 and aligned along a periphery of the limiting region 20a, and the limiting member 30 is used to limit the gel 50 from overflowing the limiting region 20 a.
Specifically, the inner plate 10 and the heat dissipation plate 20 are attached, the inner plate 10 is a circuit board located on one side of the inner wall of the housing 40, the heat dissipation plate 20 is disposed between the housing 40 and the inner plate 10, the heat dissipation plate 20 may be made of a copper sheet or an aluminum alloy, the limiting area 20a is formed on one side, facing away from the inner plate 10, of the heat dissipation plate 20 in a laser etching or silk printing manner, the limiting area 20a is rectangular, the area of the limiting area 20a for accommodating the gel 50 and the limiting area 20a defines the amount of the gel 50 to be dripped, and the amount of the gel 50 after being pressed is prevented from exceeding the periphery of the limiting area 20a too much; the periphery of the limiting region 20a is provided with a limiting member 30, the limiting member 30 is rectangular ring-shaped, the limiting member 30 may be foam rubber, the foam rubber further has excellent compression deformation resistance, the limiting member 30 is arranged around the periphery of the limiting region 20a, and the limiting member 30 can prevent the gel 50 after pressing from overflowing the limiting region 20 a. Of course, in other embodiments, the shape of the limiting member may also be set as a triangular ring, a circular ring, a polygonal ring, etc. according to actual requirements, and the limiting region may be set as a triangular ring, a circular ring, a polygonal ring, etc. along with the corresponding shape of the limiting member.
In the embodiment, the side of the heat dissipation plate 20 opposite to the inner plate 10 is provided with a limiting area 20a, and the periphery of the limiting area 20a is attached with the limiting part, so that the gel 50 is prevented from overflowing the limiting area 20a after being pressed; in addition, gel 50 is heat conduction silica gel, because the sealed glue of silica gel the inside contains silicone oil, and the grease can be spilled over to silica gel after the pressfitting, consequently locating part 30 can also adsorb gel 50's grease avoids during the grease flows remaining electronic components, influences electronic equipment 100's life. It is understood that the electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, or the like.
Further, referring to fig. 1, the electronic device 100 further includes a housing 40, and a surface of the limiting member 30 away from the heat dissipation plate 20 abuts against an inner wall of the housing 40.
Specifically, electronic equipment 100 is the laminated structure who laminates in proper order, shell 40 passes through gel 50 paste in locating part 30 dorsad heating panel 20's one side, shell 40 is used for hiding one side of shell inner wall the locating part heating panel and electronic components on the heating panel 20 with the inner panel prevents that impurity such as external dust particle from getting into.
In an embodiment, referring to fig. 2, the limiting region 20a is disposed on the inner wall of the housing 40, the limiting members 30 aligned with the periphery of the limiting region 20a are arranged at the periphery of the limiting region 20a, the predetermined gel 50 is dripped in the limiting region 20a, and the inner wall of the housing 40 and the side of the heat dissipation plate 20 opposite to the inner plate 10 are bonded and connected through the gel 50, so that the housing 40 and the heat dissipation plate 20 directly have higher connection strength. Of course, in other embodiments, the limiting region 20a may also be disposed on the heat dissipation plate 20 or on the inner wall of the housing 40, the gel 50 is dripped into the limiting region 20a, and the limiting member 30 is disposed on the inner wall of the housing 40 or on the heat dissipation plate 20, which is not particularly limited in this application.
Further, referring to fig. 3, the limiting member 30 is a continuous closed ring-shaped member. Specifically, the limiting member 30 may be foam rubber, the foam rubber further has excellent compression deformation resistance, the limiting member 30 is a rectangular ring, the limiting member 30 is annularly disposed on the periphery of the limiting region 20a, and the limiting member 30 is processed into a rectangular ring to further limit the region of the gel 50 after being pressed, so as to prevent the gel 50 from overflowing the limiting region 20a after being pressed.
In an embodiment, referring to fig. 4, the limiting member 30 may also be a non-continuous closed ring member, because the amount of the gel 50 and the size of the limiting region 20a are preset values, the gel 50 after pressing does not overflow the limiting region 20a, the limiting member 30 is a rectangular ring, the limiting member 30 may be foam rubber, the foam rubber has a plurality of air holes, and the limiting member 30 may be used to adsorb grease overflowing from the gel 50, so as to prevent the grease from flowing to other electronic components from the gel 50. Of course, in other embodiments, the shape of the limiting member 30 may also be a triangular ring shape, a circular ring shape, or a polygonal ring shape, and the shape of the limiting region 20a corresponding to the shape of the limiting member 30 is set according to actual requirements.
Further, referring to fig. 1 to 3, the position limiting member 30 includes an inner ring and an outer ring surrounding the inner ring, and an inner diameter of the inner ring is equal to an inner diameter of the position limiting area 20 a. Specifically, the limiting member 30 is annularly disposed on the limiting region 20a, and the inner rings are aligned along the periphery of the limiting region 20 a.
Specifically, the inner diameter of the inner ring is equal to the inner diameter of the limiting region 20a, it can be understood that the limiting region 20a is used for dispensing the gel 50 and preventing the gel 50 from overflowing the inner diameter of the limiting region 20a, the inner diameter of the limiting region 20a may overflow after the gel 50 is pressed, and by setting the inner diameter of the inner ring of the limiting member to be equal to the inner diameter of the limiting region 20a, even if the pressed gel tends to overflow the limiting region, the gel 50 may also abut against the inner ring of the limiting member 30, and the limiting member limits the gel from overflowing the limiting region. The outer ring is designed around the inner ring, a distance is formed between the outer ring and the inner ring, and the distance does not block other electronic components on the heat dissipation plate.
Further, referring to fig. 5, the heat dissipation plate 20 is provided with a concave surface 20b, and the concave surface 20b forms the limiting area 20 a. Specifically, the concave surface 20b is disposed on a surface of the heat dissipation plate 20 opposite to the inner plate 10, the concave surface 20b is processed into a rectangular shape by a screen printing method, the gel 50 is dropped into the concave surface 20b, a boundary of the concave surface 20b is a limiting region 20a, the boundary of the concave surface 20b is used for limiting the actual amount of the gel 50, a limiting member 30 is disposed on a periphery of the limiting region 20a, the limiting member 30 is limited to be disposed corresponding to the concave surface 20b and is set into a rectangular ring shape, the gel 50 abuts against the limiting member 30 after being pressed, and the limiting member 30 can absorb oil spilling of the gel 50. In this embodiment, the concave surface 20b is formed on one surface of the heat dissipation plate 20, so that the friction between the concave surface 20b and the gel 50 is increased, the connection strength between the gel 50 and the heat dissipation plate 20 can be further improved, and the stability is enhanced. Of course, in other embodiments, the concave surface 20b may also be a triangular ring, a circular ring, a polygonal ring, etc.
Further, referring to fig. 6, the inner plate 10 includes a chip and a main board, the chip is attached to a surface of the heat dissipation plate 20 away from the limiting member 30, the chip is opposite to the limiting region 20a, an orthographic projection of the chip in the limiting region 20a is located in the limiting region 20a, a distance exists between the orthographic projection of the chip and the edge of the limiting region 20a, and the main board is attached to a surface of the chip away from the heat dissipation plate 20.
Specifically, the inner panel 10 is laminated structure, the chip weld in on the mainboard, the area of chip is less than spacing regional 20 a's on the heating panel 20 area, the chip is the rectangle form, through with the chip subsides are located heating panel 20 dorsad the one side of locating part 30, gel 50 can be more direct will the heat of chip distributes away, improves the life of chip.
In this embodiment, the limiting region 20a is disposed on one surface of the heat dissipation plate 20 away from the inner plate 10, and the limiting member 30 is attached to the periphery of the limiting region 20a, so that the gel 50 does not overflow from the limiting region 20a after being pressed, and the limiting member 30 also has an oil adsorbing effect, so that grease overflowing after the gel 50 is pressed can be adsorbed, and the gel 50 is prevented from overflowing to other electronic components or parts.
Referring to fig. 7, the present application further provides a manufacturing method of the electronic device 100, and the manufacturing method of the electronic device 100 is used for manufacturing the electronic device 100. The manufacturing method of the electronic device 100 comprises the following steps:
110: an inner plate 10 is provided, which is a circuit board located on one side of the inner wall of the housing 40 and used for placing electronic components.
120: providing a heat dissipation plate 20, fixedly connecting the heat dissipation plate 20 to the inner plate 10, and forming a limit area 20a on the heat dissipation plate 20.
Specifically, the chip is far away from one side of the mainboard and is welded to the heat dissipation plate 20 through the electric welding machine, so that the chip and the mainboard can be fixedly connected, the heat dissipation plate 20 can be made of copper sheets or aluminum alloys and the like, and the heat dissipation plate 20 has good heat dissipation performance. And arranging a limiting area 20a on one surface of the heat dissipation plate 20, which is opposite to the inner plate 10, in a laser or silk-screen printing mode, wherein the limiting area 20a is rectangular. Of course, in other embodiments, the limiting region may also be a triangle, a circle, a polygon, or the like.
130: providing a limiting piece 30, forming the limiting piece 30 on one surface of the heat dissipation plate 20 far away from the inner plate 10, and arranging along the periphery aligned with the limiting area 20 a.
Specifically, the limiting member 30 is attached to one surface of the heat dissipation plate 20 away from the inner plate 10, the limiting member 30 is disposed around the periphery of the limiting region 20a, the limiting member 30 may be foam rubber, the foam rubber further has excellent compression deformation resistance, and the limiting member 30 forms a sealing region by disposing the foam rubber around the limiting region 20 a.
140: providing a gel 50, and dripping the gel 50 into the limiting area 20 a.
Specifically, the gel 50 is generally a heat-conducting silica gel, which has a fast curing speed, a good bonding strength, and a good heat dissipation effect. The gel 50 is dripped into the limiting area 20a according to the actual budget amount, so that the situation of expansion crack or shortage after the gel 50 is pressed again is avoided.
In the embodiment of the application, through spacing regional 20a is seted up to the one side of heating panel 20, prescribes a limit to the quantity of gel 50 has increased electronic equipment 100's joint strength prevents gel 50 overflows, adds simultaneously again limit part 30, further fixed gel 50 after the pressfitting because the sealed glue of silica gel the inside contains silicone oil, and silica gel after the pressfitting can the grease, consequently limit part 30 can also adsorb gel 50's grease avoids overflowing the life who influences electronic equipment 100 in oil to other electronic components.
Further, the manufacturing method of the electronic device 100 further includes:
150: providing a housing 40, and covering the housing 40 on the side of the limiting member 30 away from the heat dissipation plate 20.
Specifically, the housing 40 is horizontally aligned with the limiting member 30, the outer plate is pressed on the limiting member 30 by a pressing machine, the housing 40 is bonded to the heat dissipation plate 20 through the gel 50 in the limiting region 20a, the gel 50 overflows around after the housing 40 is pressed, and when the gel 50 abuts against the limiting member 30, the limiting member 30 limits the overflow of the gel 50.
In step 120 of the present embodiment, a concave surface 20b is formed on the heat sink 20, and the concave surface 20b forms the stopper region 20 a.
Specifically, a concave surface 20b is processed on a surface of the heat dissipation plate 20 opposite to the inner plate 10 by a screen printing method, a region surrounded by a boundary of the concave surface 20b is the limiting region 20a, the limiting member 30 is attached along the boundary of the concave surface 20b, the gel 50 is dropped on the concave surface 20b, and then the housing 40 is pressed on the concave surface 20b to be attached to the gel 50, so as to form the electronic device 100.
In this embodiment, the concave surface 20b is formed on one surface of the heat sink 20, so that the friction between the concave surface 20b and the gel 50 is increased, the connection strength between the gel 50 and the heat sink 20 can be further improved, and the stability can be enhanced.
Further, referring to fig. 8, the method for manufacturing the inner plate 10 includes:
111: a chip is provided.
112: providing a main board, soldering the chip on the main board, and attaching the chip to the heat dissipation plate 20 to face the limiting area 20 a.
Specifically, will the chip is fixed in through the welded mode on the mainboard, the chip with mainboard fixed connection forms inner panel 10, will the chip dorsad the one side subsides of mainboard are located in heating panel 20 in the orthographic projection of spacing region 20a, because gel 50 is heat conduction silica gel, gel 50 can further help the chip dispels the heat.
In the manufacturing method of the electronic device 100 provided in this embodiment, the heat dissipation plate 20 is provided with a limiting area 20a, the limiting area 20a is used for accommodating the gel 50 and can also preset the amount of the gel 50, and meanwhile, the chip is attached to the orthographic projection of the limiting area 20a in the heat dissipation plate 20, so that the gel 50 improves the heat dissipation of the chip, and the service life of the chip is prolonged; further, in order to prevent the gel 50 from overflowing the limiting region 20a, a limiting member 30 is arranged on a peripheral ring of the limiting region 20a, the limiting member 30 can limit the gel 50 from overflowing the limiting region 20a after being pressed, and meanwhile, the limiting member 30 can adsorb oil spilling after the gel 50 is pressed, so that the situation that the function of the component is abnormal and the like due to oil spilling to other electronic components is avoided.
The foregoing is a preferred embodiment of the present application, and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
Claims (10)
1. The utility model provides an electronic equipment, its characterized in that, electronic equipment includes inner panel, heating panel, locating part, gel, the inner panel with the heating panel laminating, the heating panel dorsad the one side of inner panel is equipped with spacing region, the gel drips to be arranged in spacing region, the locating part is fixed in on the heating panel, and follows the periphery of spacing region aligns and arranges, the locating part is used for restricting the gel overflows spacing region.
2. The electronic device according to claim 1, further comprising a housing, wherein a surface of the position-limiting member away from the heat dissipation plate abuts against an inner wall of the housing.
3. The electronic device of claim 2, wherein the retaining member is a continuous closed loop-shaped member.
4. The electronic device of claim 3, wherein the position limiter comprises an inner ring and an outer ring surrounding the inner ring, and an inner diameter of the inner ring is greater than or equal to an inner diameter of the position limiting region.
5. The electronic device according to claim 4, wherein the heat dissipation plate is provided with a concave surface, the concave surface forming the stopper region.
6. The electronic device according to claim 5, wherein the inner board includes a chip and a main board, the chip is attached to a surface of the heat dissipation plate away from the position-limiting element, the chip is opposite to the position-limiting area, an orthographic projection of the chip in the position-limiting area is located in the position-limiting area, and a distance is formed between the orthographic projection of the chip and an edge of the position-limiting area, and the main board is attached to a surface of the chip away from the heat dissipation plate.
7. A method for manufacturing an electronic device, the method being used for manufacturing the electronic device of any one of claims 1-6, the method comprising the steps of:
providing an inner plate;
providing a heat dissipation plate, fixedly connecting the heat dissipation plate with the inner plate, and forming a limiting area on the heat dissipation plate;
providing a limiting piece, wherein the limiting piece is formed on one surface, far away from the inner plate, of the heat dissipation plate and is arranged along the periphery aligned with the limiting area;
providing a gel, and placing the gel drop in the limiting region.
8. The method of manufacturing an electronic device according to claim 7, wherein after "placing the gel drop in the stopper on the heat dissipation plate", the method of manufacturing an electronic device further comprises:
and providing a shell, and pressing the shell cover on one side of the limiting piece away from the heat dissipation plate.
9. The method of manufacturing an electronic device according to claim 7, wherein in the step of providing a heat-dissipating plate,
and processing a concave surface on the heat dissipation plate, wherein the concave surface forms the limiting area.
10. The method of manufacturing an electronic device according to claim 7, wherein, in the step of providing an inner board,
providing a chip;
and providing a mainboard, welding the chip on the mainboard, and attaching the chip to the heat dissipation plate to be opposite to the limiting area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911107383.1A CN110868840B (en) | 2019-11-13 | 2019-11-13 | Electronic equipment and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911107383.1A CN110868840B (en) | 2019-11-13 | 2019-11-13 | Electronic equipment and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN110868840A true CN110868840A (en) | 2020-03-06 |
| CN110868840B CN110868840B (en) | 2021-05-04 |
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| CN201911107383.1A Active CN110868840B (en) | 2019-11-13 | 2019-11-13 | Electronic equipment and manufacturing method thereof |
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| CN208431978U (en) * | 2018-05-07 | 2019-01-25 | 南京中新赛克科技有限责任公司 | A kind of electronic equipment radiating module |
| CN208936211U (en) * | 2018-09-26 | 2019-06-04 | 浙江绍兴苏泊尔生活电器有限公司 | Electromagnetic oven |
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| CN203590660U (en) * | 2013-11-12 | 2014-05-07 | 惠州大亚湾华北工控实业有限公司 | Heat radiation device |
| CN204925982U (en) * | 2015-09-16 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | Radiating fin |
| CN105472947A (en) * | 2015-12-15 | 2016-04-06 | 联想(北京)有限公司 | Electronic device |
| CN106446842A (en) * | 2016-09-29 | 2017-02-22 | 广东欧珀移动通信有限公司 | Fingerprint module assembly, processing method thereof, and terminal having the same |
| CN206497881U (en) * | 2017-01-25 | 2017-09-15 | 深圳市森邦半导体有限公司 | A kind of chip-packaging structure |
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| CN110868840B (en) | 2021-05-04 |
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