CN203590660U - Heat radiation device - Google Patents
Heat radiation device Download PDFInfo
- Publication number
- CN203590660U CN203590660U CN201320712568.7U CN201320712568U CN203590660U CN 203590660 U CN203590660 U CN 203590660U CN 201320712568 U CN201320712568 U CN 201320712568U CN 203590660 U CN203590660 U CN 203590660U
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- Prior art keywords
- heat
- groove
- overflow
- plate
- accepting groove
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Abstract
Disclosed is a heat radiation device. The device comprises a bottom plate, a middle plate, an upper cover plate, a conductive pipe and a conductive adhesive. The bottom plate is provided with a first storing groove and a first anti-overflow groove that are parallelly arranged. The first anti-overflow groove is disposed at the periphery of the bottom plate. The middle plate is attached to the bottom plate and provided with a second storing groove corresponding to the first storing groove. The upper cove plate is attached to the middle plate and provided with a second anti-overflow groove. One end of the conductive pipe is stored between the first storing groove and the first anti-overflow groove, and the other end of the conductive pipe extends outside the first storing groove and the first anti-overflow groove. The conductive adhesive coats the conductive pipe disposed between the first storing groove and the second storing groove. The conductive adhesive further coats a part between the middle plate and the upper cover plate, and is stored in the second anti-overflow groove. The first anti-overflow groove stores to-be-overflew conductive adhesive to prevent the conductive adhesive from overflowing the bottom plate and the middle plate. The conductive adhesive coats the part between the middle plate and the upper cover plate, and is stored in the second anti-overflow groove. The second anti-overflow groove is provided with a storage chamber to prevent the conductive adhesive from overflowing.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly relates to a kind of heat abstractor for electronic component is dispelled the heat.
Background technology
The parts such as the central processing unit of computer can produce heat in the process of running up, and the caloric requirement of generation in time, effectively conduct, makes within the working temperature of central processing unit remains on a stable scope.Otherwise a large amount of heat build-up can make central processing unit occur that the problems such as operating efficiency reduces, the life-span shortens occur, and then affects the ruuning situation of whole computer.
Conventionally adopt the heat abstractor of mechanical structure formula, by heat abstractor, directly contact with central processing unit and heat is conducted.The heat abstractor of mechanical structure formula, needs to be coated with heat-conducting glue between its inner parts, to realize heat radiation better.When coating heat-conducting glue, because heat-conducting glue has mobility, easily spill into heat abstractor outside, not only can cause waste, and the computer-internal electronic component of can making dirty, when the heat-conducting glue overflowing is when contacting with other electron component, very easily make electronic component go wrong, thereby affect the quality of whole computer.
Utility model content
Based on this, be necessary to provide a kind of heat-transfer device that better prevents that heat-conducting glue from overflowing.
A heat abstractor, comprising:
Base plate, on one side of described base plate, offer many strips the first accepting groove and many anti-overflow grooves of strip first, many described the first accepting grooves and many described the first anti-overflow grooves are arranged side by side, and many described the first anti-overflow grooves are positioned at the edge of the side of described base plate;
Intermediate plate, described intermediate plate and the laminating of described base plate offer many strips the second accepting groove on described intermediate plate on a side of described base plate, and many described the second accepting grooves are corresponding one by one with many described the first accepting grooves;
Upper cover plate, described upper cover plate and the laminating of described intermediate plate offer the second anti-overflow groove on described upper cover plate on a side of described intermediate plate;
Heat pipe, described heat pipe one end is contained between described the first accepting groove and described the second accepting groove, and the other end stretches out in outside described the first accepting groove and described the second accepting groove; And
Heat-conducting glue, described heat-conducting glue is coated on the described heat pipe between described the first accepting groove and described the second accepting groove, and described heat-conducting glue is also coated between described intermediate plate and described upper cover plate and is contained in described the second anti-overflow groove.
In an embodiment, the cross section of described the first accepting groove is semicircle therein.
In an embodiment, described the second anti-overflow groove is square groove therein.
In an embodiment, described heat pipe is " L " font therein.
In an embodiment, the quantity of described the first accepting groove and described the second accepting groove is respectively four therein.
In an embodiment, the quantity of described heat pipe is four therein, and the external part of four described heat pipes is evenly distributed in the both sides of described base plate.
In an embodiment, described heat pipe is copper pipe therein.
In an embodiment, also comprise fixed block therein, described fixed block is located at the end of the external part of described heat pipe.
In an embodiment, the quantity of described the first anti-overflow groove is four therein, and four described the first anti-overflow grooves are evenly distributed in two edges relative on described base plate.
In an embodiment, described base plate, described intermediate plate and described upper cover plate are bolted connection therein.
On described base plate, offer described the first anti-overflow groove, described the first anti-overflow groove can be contained in the described heat-conducting glue that will overflow wherein, has prevented that described heat-conducting glue from overflowing outside described base plate and described intermediate plate.Described heat-conducting glue is coated between described intermediate plate and described upper cover plate and be contained in described the second anti-overflow groove, because described intermediate plate and described upper cover plate fit tightly, described the second anti-overflow groove has certain accommodation space, and described heat-conducting glue just can be under the extruding of described intermediate plate and described upper cover plate and overflowed.
Accompanying drawing explanation
Fig. 1 is the stereogram of the heat-transfer device of an embodiment;
Fig. 2 is the exploded view of the heat-transfer device shown in Fig. 1;
Fig. 3 is the structure chart of the base plate of the heat-transfer device shown in Fig. 1;
Fig. 4 is the structure chart of the intermediate plate of the heat-transfer device shown in Fig. 1;
Fig. 5 is the structure chart of the upper cover plate of the heat-transfer device shown in Fig. 1.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provided preferred embodiment of the present utility model.But the utility model can be realized in many different forms, be not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to the understanding of disclosure of the present utility model more thoroughly comprehensively.
As shown in Figure 1, it is the stereogram of the heat-transfer device 10 of an embodiment.See also Fig. 2, it is the exploded view of the heat-transfer device 10 shown in Fig. 1.Heat-transfer device 10 comprises: base plate 100, intermediate plate 200, upper cover plate 300, heat pipe 400, heat-conducting glue 500 and fixed block 600.
As shown in Figure 3, it is the structure chart of the base plate 100 of the heat-transfer device 10 shown in Fig. 1.On one side of base plate 100, offer many strips the first accepting groove 110 and many anti-overflow grooves 120 of strip first, many first accepting grooves 110 and many first anti-overflow grooves 120 are arranged side by side, and many first anti-overflow grooves 120 are positioned at the edge of the side of base plate 100.
In the present embodiment, the cross section of the first accepting groove 110 is semicircle, and the quantity of the first accepting groove 110 is four.
In the present embodiment, the quantity of the first anti-overflow groove 120 is four, and four the first anti-overflow grooves 120 are evenly distributed in two edges relative on base plate 100.
As shown in Figure 4, it is the structure chart of the intermediate plate 200 of the heat-transfer device 10 shown in Fig. 1.Intermediate plate 200 and base plate 100 laminatings offer many strips the second accepting groove 210 on intermediate plate 200 on a side of base plate 100, and many second accepting grooves 210 are corresponding one by one with many first accepting grooves 110.
In the present embodiment, the cross section of the second accepting groove 210 is semicircle, and the quantity of the second accepting groove 210 is four.
As shown in Figure 5, it is the structure chart of the upper cover plate 300 of the heat-transfer device 10 shown in Fig. 1.Upper cover plate 300 and intermediate plate 200 laminatings, upper cover plate 300 offers the second anti-overflow groove 310 on a side of intermediate plate 200.In the present embodiment, the second anti-overflow groove 310 is square groove.In other embodiments, the second anti-overflow groove 310 can also be circular groove.
In the present embodiment, heat pipe 400 is " L " font, and the quantity of heat pipe 400 is four, and the external part of four heat pipes 400 is evenly distributed in the both sides of base plate 100.
Heat-conducting glue 500 is coated on the heat pipe 400 between the first accepting groove 110 and the second accepting groove 210, and heat-conducting glue 500 is also coated between intermediate plate 200 and upper cover plate 300 and is contained in the second anti-overflow groove 310.
Fixed block 600 fixed blocks are located at the end of the external part of heat pipe 400, on fixed block 600, offer through hole, and bolt passes described through hole by fixed block 600 and exterior object bolt.In the present embodiment, the quantity of fixed block 600 is four.
Heat-conducting glue 500 is coated on the heat pipe 400 between the first accepting groove 110 and the second accepting groove 210, heat-conducting glue 500 is when the affecting of extraneous factors such as being given a shock, because heat-conducting glue 500 has mobility, heat-conducting glue 500 is easy to overflow from base plate 100 and the laminating gap of intermediate plate 200.And on base plate 100, offer the first anti-overflow groove 120, the first anti-overflow groove 120 can be contained in the heat-conducting glue 500 that will overflow wherein just, prevented that heat-conducting glue 500 from overflowing outside base plate 100 and intermediate plate 200, and then prevented that heat-conducting glue 500 from contacting with other electron component, avoid causing the bad of whole computer.
Heat-conducting glue 500 is coated between intermediate plate 200 and upper cover plate 300 and be contained in the second anti-overflow groove 310, because intermediate plate 200 and upper cover plate 300 fit tightly, the second anti-overflow groove 310 has certain accommodation space, heat-conducting glue 500 just can be under the extruding of intermediate plate 200 and upper cover plate 300 and overflow, and the second anti-overflow groove 310 has played the effect that heat-conducting glue 500 overflows that prevents preferably.
As from the foregoing, on the base plate 100 of heat-transfer device 10, offer the first anti-overflow groove 120, on upper cover plate 300, offer the second anti-overflow groove 310, can prevent preferably that heat-conducting glue 500 from overflowing.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a heat abstractor, is characterized in that, comprising:
Base plate, on one side of described base plate, offer many strips the first accepting groove and many anti-overflow grooves of strip first, many described the first accepting grooves and many described the first anti-overflow grooves are arranged side by side, and many described the first anti-overflow grooves are positioned at the edge of the side of described base plate;
Intermediate plate, described intermediate plate and the laminating of described base plate offer many strips the second accepting groove on described intermediate plate on a side of described base plate, and many described the second accepting grooves are corresponding one by one with many described the first accepting grooves;
Upper cover plate, described upper cover plate and the laminating of described intermediate plate offer the second anti-overflow groove on described upper cover plate on a side of described intermediate plate;
Heat pipe, described heat pipe one end is contained between described the first accepting groove and described the second accepting groove, and the other end stretches out in outside described the first accepting groove and described the second accepting groove; And
Heat-conducting glue, described heat-conducting glue is coated on the described heat pipe between described the first accepting groove and described the second accepting groove, and described heat-conducting glue is also coated between described intermediate plate and described upper cover plate and is contained in described the second anti-overflow groove.
2. heat abstractor according to claim 1, is characterized in that, the cross section of described the first accepting groove is semicircle.
3. heat abstractor according to claim 1, is characterized in that, described the second anti-overflow groove is square groove.
4. heat abstractor according to claim 1, is characterized in that, described heat pipe is " L " font.
5. heat abstractor according to claim 1, is characterized in that, the quantity of described the first accepting groove and described the second accepting groove is respectively four.
6. heat abstractor according to claim 5, is characterized in that, the quantity of described heat pipe is four, and the external part of four described heat pipes is evenly distributed in the both sides of described base plate.
7. heat abstractor according to claim 1, is characterized in that, described heat pipe is copper pipe.
8. heat abstractor according to claim 1, is characterized in that, also comprises fixed block, and described fixed block is located at the end of the external part of described heat pipe.
9. heat abstractor according to claim 1, is characterized in that, the quantity of described the first anti-overflow groove is four, and four described the first anti-overflow grooves are evenly distributed in two edges relative on described base plate.
10. heat abstractor according to claim 1, is characterized in that, described base plate, described intermediate plate and described upper cover plate are bolted connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320712568.7U CN203590660U (en) | 2013-11-12 | 2013-11-12 | Heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320712568.7U CN203590660U (en) | 2013-11-12 | 2013-11-12 | Heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203590660U true CN203590660U (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320712568.7U Expired - Lifetime CN203590660U (en) | 2013-11-12 | 2013-11-12 | Heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203590660U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208831A (en) * | 2015-09-24 | 2015-12-30 | 小米科技有限责任公司 | Composite heat conduction structure and mobile device |
| CN110868840A (en) * | 2019-11-13 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
| CN111315183A (en) * | 2018-12-12 | 2020-06-19 | 成都鼎桥通信技术有限公司 | Heat conduction assembly for electronic component, refrigerating device and electronic equipment |
-
2013
- 2013-11-12 CN CN201320712568.7U patent/CN203590660U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208831A (en) * | 2015-09-24 | 2015-12-30 | 小米科技有限责任公司 | Composite heat conduction structure and mobile device |
| CN105208831B (en) * | 2015-09-24 | 2019-03-01 | 小米科技有限责任公司 | Composite heat-conducting structure and mobile device |
| CN111315183A (en) * | 2018-12-12 | 2020-06-19 | 成都鼎桥通信技术有限公司 | Heat conduction assembly for electronic component, refrigerating device and electronic equipment |
| CN111315183B (en) * | 2018-12-12 | 2022-02-01 | 成都鼎桥通信技术有限公司 | Heat conduction assembly for electronic component, refrigerating device and electronic equipment |
| CN110868840A (en) * | 2019-11-13 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
| CN110868840B (en) * | 2019-11-13 | 2021-05-04 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |