CN205249597U - Novel heat radiation PCB - Google Patents
Novel heat radiation PCB Download PDFInfo
- Publication number
- CN205249597U CN205249597U CN201520925124.0U CN201520925124U CN205249597U CN 205249597 U CN205249597 U CN 205249597U CN 201520925124 U CN201520925124 U CN 201520925124U CN 205249597 U CN205249597 U CN 205249597U
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat
- pcb board
- base plate
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a novel heat radiation PCB, including first base plate and second base plate, be provided with the heating panel between first base plate and the second base plate, a plurality of through -holes have been seted up respectively with the lateral wall of second base plate to first base plate, the through -hole inner wall covers there is the heat sink material. Through the utility model discloses a PCB plate structure that heat conduction radiation nature is strong can provide the thermal diffusivity and the heat conductivity of PCB board greatly, reduces the PCB board leads to the damage because of over heating issue the condition.
Description
Technical field
The utility model relates to PCB field, especially a kind of heat sinking pcb board.
Background technology
The general thermal diffusivity of pcb board that enterprise produces is now all bad, the process using at pcb boardIn tend to produce problems of excessive heat because of various situations, and problems of excessive heat is to cause PCBThe main cause that plate damages, therefore problems of excessive heat now also becomes restriction PCB application oneIndividual very urgent problem, now on market in the urgent need to the more intense pcb board of a kind of thermal diffusivityStructure.
Summary of the invention
The technical problem that the utility model mainly solves is to provide a kind of heat sinking PCBPlate.
The utility model is that the technical scheme that solves the problems of the technologies described above employing is:
A kind of heat sinking pcb board, includes first substrate and second substrate, described the first baseBetween plate and second substrate, be provided with heat sink, the sidewall of described first substrate and second substrate dividesDo not offer some through holes, described through-hole wall is coated with heat sink material.
Further, described heat sink material is nano-sized carbon heat dissipation film.
Further, described nano-sized carbon heat dissipation film offers some through holes.
Further, between described first substrate and second substrate, be also provided with graphite flake.
The beneficial effects of the utility model are:
1. by the strong pcb board structure of heat conduction and heat radiation of the present utility model, can greatly carryFor thermal diffusivity and the thermal conductivity of pcb board, reduce pcb board and cause because of problems of excessive heat damagingSituation.
2. by pcb board being divided into first substrate and second substrate, can strengthen pcb boardThermal diffusivity, by the heat sink between first substrate and second substrate and graphite flake, can be byThe heat of pcb board on average conducts out, finally by opening at first substrate and second substrate sidewallIf through hole, the nano-sized carbon heat dissipation film covering at through-hole wall, increases first substrate and second againThe thermal diffusivity of substrate.
Brief description of the drawings
Referring to Fig. 1, is the structural representation of a kind of detailed description of the invention of the utility model.
In figure: 1 is first substrate, 2 is through hole, and 3 is heat sink, and 4 is graphite flake, and 5 areSecond substrate.
Detailed description of the invention
Referring to Fig. 1, is a kind of detailed description of the invention of the utility model.
Heat radiation pcb board of the present utility model, in the time of assembling, is chosen first substrate 1 and second substrate5, heat sink 3 and graphite flake 4 are set between first substrate 1 and second substrate 5, simultaneouslyOffer respectively some through holes 2, through hole 2 at first substrate 1 sidewall and second substrate 5 sidewallsInwall covers nano-sized carbon heat dissipation film, also offers some through holes at nano-sized carbon heat dissipation film.
Pcb board of the present utility model in use because by substrate be divided into first substrate 1 withSecond substrate 5, heat can not hoarded in PCB substrate, simultaneously by heat sink 3 and graphiteSheet 4, discharge that can accelerated heat.
Offer respectively through hole, through-hole wall at first substrate 1 sidewall and second substrate 5 sidewallsCover nano-sized carbon heat dissipation film, also offer some through holes 2 at nano-sized carbon heat dissipation film, can help PCBThe heat of substrate inside sheds, and pcb board is maintained in relatively normal temperature environment.
Claims (4)
1. a heat sinking pcb board, includes first substrate and second substrate, and described firstBetween substrate and second substrate, be provided with heat sink, it is characterized in that: described first substrate andThe sidewall of two substrates offers respectively some through holes, and described through-hole wall is coated with heat sink material.
2. heat sinking pcb board according to claim 1, is characterized in that: described looseHot material is nano-sized carbon heat dissipation film.
3. heat sinking pcb board according to claim 2, is characterized in that: described in receiveRice carbon heat dissipation film offers some through holes.
4. heat sinking pcb board according to claim 1, is characterized in that: describedBetween one substrate and second substrate, be also provided with graphite flake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520925124.0U CN205249597U (en) | 2015-11-18 | 2015-11-18 | Novel heat radiation PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520925124.0U CN205249597U (en) | 2015-11-18 | 2015-11-18 | Novel heat radiation PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205249597U true CN205249597U (en) | 2016-05-18 |
Family
ID=55948655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520925124.0U Expired - Fee Related CN205249597U (en) | 2015-11-18 | 2015-11-18 | Novel heat radiation PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205249597U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455299A (en) * | 2016-10-31 | 2017-02-22 | 张昊辰 | Heat dissipation type double-layer PCB |
-
2015
- 2015-11-18 CN CN201520925124.0U patent/CN205249597U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455299A (en) * | 2016-10-31 | 2017-02-22 | 张昊辰 | Heat dissipation type double-layer PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160518 Termination date: 20161118 |