CN202103994U - Heat dissipation assembly structure - Google Patents
Heat dissipation assembly structure Download PDFInfo
- Publication number
- CN202103994U CN202103994U CN2011201549785U CN201120154978U CN202103994U CN 202103994 U CN202103994 U CN 202103994U CN 2011201549785 U CN2011201549785 U CN 2011201549785U CN 201120154978 U CN201120154978 U CN 201120154978U CN 202103994 U CN202103994 U CN 202103994U
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- CN
- China
- Prior art keywords
- heat
- heat dissipation
- dissipation element
- radiating subassembly
- thermal source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a heat dissipation assembly structure, wherein a heat dissipation pedestal is arranged on a heat source, a large-area heat dissipation element is arranged on the heat dissipation pedestal and at the side far from the heat source, the surface of the heat dissipation element is provided with a heat conduction layer with excellent heat conduction effect, and a diffusion sheet with excellent heat conduction effect is arranged between the heat dissipation pedestal and the heat dissipation element. The heat dissipation assembly structure can make the heat of the heat source conduct and diffuse uniformly and radiate outward, thereby achieving optimum heat dissipation effect. When the heat dissipation assembly structure is used, the heat of the heat source is conducted to the heat dissipation pedestal and is concentrated in the scope area on the heat dissipation pedestal and corresponding to the heat source, the heat is further laterally diffused and conducted to a surface in corresponding contact with the heat dissipation element via the diffusion sheet, and the heat of the heat source is rapidly radiated outward by using the relatively large heat dissipation area of the heat dissipation element so as to avoid that the heat is concentrated nearby the heat source, thus the optimum heat dissipation effect is achieved.
Description
Technical field
The utility model relates to a kind of structure of radiating subassembly.
Background technology
In each heat radiation assembly structure that is widely used at present; More common having is as shown in Figure 1; Its thermal source 5 (can be the IC or the large-scale power crystal of central processing unit) can be arranged on the circuit board 6; On the heat generation position of this thermal source 5, be provided with a heat dissipation element 30 (fin); And between this thermal source 5 and heat dissipation element 30, be provided with the conducting strip 51 (also can be a heat radiation grease) of a soft and splendid heat-conducting effect of tool, contact closely so that be able to maintenance between this thermal source 5 and the heat dissipation element 30, and then reach preferable radiating effect.
Yet; Above-mentioned this kind structure its when practical application; Though this conducting strip 51 (heat radiation grease) can promptly be directed to the heat of thermal source 5 on the heat dissipation element 30 (fin); But because mostly the material of this heat dissipation element 30 (fin) is metal; Be subject to its coefficient of heat conduction and make the heat that conducts to heat dissipation element 30 (fin) by this conducting strip 51 (heat radiation grease) concentrate on this heat dissipation element 30 (fin) easily corresponding near the position the conducting strip 51 (heat radiation grease), and can't be by guiding diffusion apace, and then influence its whole radiating efficiency and effect; Simultaneously,, then can make heat can't effectively be dispersed and pile up, cause the continuous electronic component generation damage that raises and make this thermal source 5 of temperature if the phenomenon that this kind heat is concentrated is too serious.
The utility model content
The technical problem that the utility model will solve provides a kind of structure of radiating subassembly, and it can make the heat of thermal source evenly conduct diffusion and externally disperse, and reaches best radiating effect.
For solving the problems of the technologies described above, the structure of the radiating subassembly of the utility model comprises at least:
One cooling base is arranged on the thermal source, for the guiding heat that this thermal source produced;
One heat dissipation element has the area of dissipation that is not less than cooling base, and this heat dissipation element is located at a side of this cooling base stow away from heat;
The diffusion sheet of the splendid horizontal heat-conducting effect of one tool is located between this cooling base and the heat dissipation element, the heat on this cooling base evenly being spread and conduct on the heat dissipation element, and is externally dispersed by this heat dissipation element.
At least the local surfaces of said heat dissipation element be provided with one have a splendid radiating effect heat-conducting layer, use making this heat dissipation element have splendid heat conduction and disperse ability, with effective enhancement radiating effect.
The area of said diffusion sheet is between this heat dissipation element and thermal source, and its central authorities are corresponding to the central authorities of this thermal source.
Be provided with between said heat dissipation element and the diffusion sheet one have powerful adhesion strength binder course.
Be provided with between said thermal source and the cooling base one have splendid heat-conducting effect conducting strip.
Said heat-conducting layer is molded over this heat dissipation element surface with one of them kind modes such as spraying, printing, vacuum splashing and plating and pasters.
The structure of the radiating subassembly of the utility model; To concentrate near the thermal source heat horizontal proliferation through diffusion sheet conducts on the surface with the corresponding contact of heat dissipation element; Utilize the bigger area of dissipation of heat dissipation element again, heat is outwards dispersed apace, thereby promoted whole radiating efficiency.
Description of drawings
Fig. 1 is the cross-sectional view of existing radiating subassembly;
Fig. 2 is the structure decomposition map of the utility model;
Fig. 3 is the combination section of the utility model.
Description of reference numerals is following among the figure:
1: cooling base
2: diffusion sheet
3,30: heat dissipation element
31: binder course
4: heat-conducting layer
5: thermal source
51: conducting strip
6: circuit board
61: the copper post
62: bolt
Embodiment
Understand for technology contents, characteristics and effect to the utility model have more specifically, combine illustrated execution mode at present, details are as follows:
See also Fig. 2, shown in 3; But the structure of knowledge capital utility model mainly comprises: parts such as cooling base 1, diffusion sheet 2, heat dissipation element 3 and heat-conducting layer 4; Wherein this cooling base 1 is arranged at a thermal source 5 (this thermal source 5 can be one to be arranged on the electronic component on the circuit board 6; As: central processing unit or large-scale power crystal) on; Between this thermal source 5 and cooling base 1 can according to need be provided with one have splendid heat-conducting effect conducting strip 51, be directed to cooling base 1 with heat with this thermal source 5, in addition the side at this cooling base 1 stow away from heat 5 is provided with a diffusion sheet 2; This diffusion sheet 2 can be that sheet or liquid state with nano-sized carbon, graphite (native graphite or electrographite) or graphite synthetic (Graphene) composition are coated with and moulding; It has the effect of splendid heat conduction, and the area of this diffusion sheet 2 can be between this heat dissipation element 3 and thermal source 5, or just equates with the area of heat dissipation element 3; And its central authorities are corresponding to the central authorities of this thermal source 5; Again on this diffusion sheet 2 via one have powerful adhesion strength binder course 31 (can be viscose glue) combine an area of dissipation to be not less than the heat dissipation element 3 of cooling base 1 in addition, and the local surfaces at least of this heat dissipation element 3 be provided with one have splendid heat-conducting effect heat-conducting layer 4, this heat-conducting layer 4 can be molded over this heat dissipation element 3 surfaces via modes such as spraying, printing, vacuum splashing and plating or pasters.
In the said structure; The copper post 61 (or other binding member) of plural tool screw can be set in thermal source 5 all sides on this circuit board 6; In addition plural number can be set to perforation that should copper post 61 at cooling base 1 and heat dissipation element 3 peripheries; Utilize plural bolt 62 to pass the perforation of this cooling base 1 and heat dissipation element 3 again and be screwed in the screw of this copper post 61, can make this cooling base 1, heat dissipation element 3 and each assembly therebetween be able to be positioned on the thermal source 5; And when practical application; In the heat of this thermal source 5 conducts on the cooling base 1 via this conducting strip 51; Be subject to the transverse heat transfer efficient of this cooling base 1 itself, make its heat be easier to concentrate on the scope area of cooling base 1, therefore corresponding to thermal source 5; Again by the diffusion sheet 2 of the splendid horizontal heat-conducting effect of a tool; This further horizontal proliferation of heat of concentrating is conducted on the surface with the 3 corresponding contacts of this heat dissipation element, utilize this heat dissipation element 3 to have big area of dissipation again, and be arranged on the heat-conducting layer 4 that these heat dissipation element 3 surfaces have splendid radiating effect; The heat of this thermal source 5 is outwards dispersed apace, to reach best radiating effect.
Comprehensive the above, the structure of the radiating subassembly of the utility model can be reached even conduction dissipate heat, and effectively promotes the effect of radiating efficiency; The content of above-mentioned explanation is merely the preferred embodiment explanation of the utility model, and all variation, modification, change or equivalent replacements that is extended according to the technological means and the category of the utility model also all should fall in the patent claim of the utility model.
Claims (13)
1. the structure of a radiating subassembly is characterized in that, comprises at least:
One is used to guide the cooling base of heat that thermal source produces, and is arranged on the thermal source;
One heat dissipation element has the area of dissipation that is not less than cooling base, and this heat dissipation element is located at a side of this cooling base stow away from heat;
The diffusion sheet of the splendid horizontal heat-conducting effect of one tool is located between this cooling base and the heat dissipation element, and this diffusion sheet evenly spreads the heat on the cooling base and conducts on the heat dissipation element, and is externally dispersed by this heat dissipation element.
2. the structure of radiating subassembly as claimed in claim 1 is characterized in that: the local surfaces at least of said heat dissipation element be provided with one have a splendid radiating effect heat-conducting layer.
3. according to claim 1 or claim 2 the structure of radiating subassembly, it is characterized in that: the area of said diffusion sheet is between this heat dissipation element and thermal source, and its central authorities are corresponding to the central authorities of this thermal source.
4. according to claim 1 or claim 2 the structure of radiating subassembly is characterized in that: be provided with between said heat dissipation element and the diffusion sheet one have powerful adhesion strength binder course.
5. the structure of radiating subassembly as claimed in claim 3 is characterized in that: be provided with between said heat dissipation element and the diffusion sheet one have powerful adhesion strength binder course.
6. according to claim 1 or claim 2 the structure of radiating subassembly is characterized in that: be provided with between said thermal source and the cooling base one have splendid heat-conducting effect conducting strip.
7. the structure of radiating subassembly as claimed in claim 3 is characterized in that: be provided with between said thermal source and the cooling base one have splendid heat-conducting effect conducting strip.
8. the structure of radiating subassembly as claimed in claim 4 is characterized in that: be provided with between said thermal source and the cooling base one have splendid heat-conducting effect conducting strip.
9. the structure of radiating subassembly as claimed in claim 5 is characterized in that: be provided with between said thermal source and the cooling base one have splendid heat-conducting effect conducting strip.
10. according to claim 1 or claim 2 the structure of radiating subassembly, it is characterized in that: said heat-conducting layer is molded over this heat dissipation element surface with one of them kind mode of spraying, printing, vacuum splashing and plating and paster.
11. the structure of radiating subassembly as claimed in claim 3 is characterized in that: said heat-conducting layer is molded over this heat dissipation element surface with one of them kind mode of spraying, printing, vacuum splashing and plating and paster.
12. the structure of radiating subassembly as claimed in claim 4 is characterized in that: said heat-conducting layer is molded over this heat dissipation element surface with one of them kind mode of spraying, printing, vacuum splashing and plating and paster.
13. the structure of radiating subassembly as claimed in claim 6 is characterized in that: said heat-conducting layer is molded over this heat dissipation element surface with one of them kind mode of spraying, printing, vacuum splashing and plating and paster.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201549785U CN202103994U (en) | 2011-05-16 | 2011-05-16 | Heat dissipation assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201549785U CN202103994U (en) | 2011-05-16 | 2011-05-16 | Heat dissipation assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202103994U true CN202103994U (en) | 2012-01-04 |
Family
ID=45389991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201549785U Expired - Fee Related CN202103994U (en) | 2011-05-16 | 2011-05-16 | Heat dissipation assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202103994U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610737A (en) * | 2012-03-21 | 2012-07-25 | 广州市鸿利光电股份有限公司 | Heat-radiating device of high-power LED (Light Emitting Diode) |
-
2011
- 2011-05-16 CN CN2011201549785U patent/CN202103994U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610737A (en) * | 2012-03-21 | 2012-07-25 | 广州市鸿利光电股份有限公司 | Heat-radiating device of high-power LED (Light Emitting Diode) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20160516 |