CN208175089U - A kind of heavy current circuit plate convenient for heat dissipation - Google Patents
A kind of heavy current circuit plate convenient for heat dissipation Download PDFInfo
- Publication number
- CN208175089U CN208175089U CN201820091480.0U CN201820091480U CN208175089U CN 208175089 U CN208175089 U CN 208175089U CN 201820091480 U CN201820091480 U CN 201820091480U CN 208175089 U CN208175089 U CN 208175089U
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- Prior art keywords
- copper
- thermally conductive
- heat dissipation
- convenient
- basal plate
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Abstract
The utility model discloses a kind of heavy current circuit plates convenient for heat dissipation, including basal plate, electronic component, thermally conductive colloid layer, heat release hole, copper-based surface layer, groove, radiating fin, the top of the basal plate is provided with several electronic components, the two sides of the basal plate are evenly arranged with several radiating fins, the bottom end of the basal plate is provided with thermally conductive colloid layer, the inside of the thermally conductive colloid layer is evenly arranged with several heat release holes, the bottom end of the thermally conductive colloid layer is provided with copper-based surface layer, and the bottom of the copper-based surface layer is evenly arranged with several grooves.The utility model beneficial effect：Several radiating fins are evenly arranged with by the two sides in basal plate, the inside of thermally conductive colloid layer is evenly arranged with several heat release holes, convenient for heat dissipation, the bottom of copper-based surface layer is evenly arranged with several grooves, groove section length and width are 0.1mm, it is not only convenient for air circulation heat dissipation, and increases the area of copper-based laminate contacted with air, convenient for the diffusion of heat.
Description
Technical field
The utility model relates to wiring board technology fields, and in particular to a kind of heavy current circuit plate convenient for heat dissipation.
Background technique
Wiring board is important electronic component, is the supporter of electronic component, is mentioning for electronic component electrical connection
Donor.With the high speed development of electronic industry, more and more answered in industrial circles such as electronics, communication, power supply, automobile, motors
Use wiring board.With the development of very large scale integration technology, had been able on one block of heavy current circuit plate integrated more next
More chips, correspondingly, the power of electronic cost is also increasing on heavy current circuit plate.It is generated when chip operation
Heat increases corresponding heavy current circuit plate regional temperature sharply, influences the working efficiency and service life of chip indirectly.Mesh
Before, heavy current circuit plate in the prior art is mainly to pass through what intermediate insulating medium layer radiated, and heat dissipation effect is poor, shadow
Ring the using effect of heavy current circuit plate.
Utility model content
The utility model provides a kind of heavy current circuit plate convenient for heat dissipation, solves the mesh encountered in above-mentioned background technique
Before, heavy current circuit plate in the prior art is mainly to pass through what intermediate insulating medium layer radiated, and heat dissipation effect is poor, shadow
The problem of ringing the using effect of heavy current circuit plate.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution：
A kind of heavy current circuit plate convenient for heat dissipation of the utility model, including basal plate, electronic component, thermally conductive colloid layer,
Heat release hole, copper-based surface layer, groove, radiating fin, the top of the basal plate are provided with several electronic components, the basal plate
Two sides be evenly arranged with several radiating fins, the bottom end of the basal plate is provided with thermally conductive colloid layer, the thermally conductive colloid
The inside of layer is evenly arranged with several heat release holes, and the bottom end of the thermally conductive colloid layer is provided with copper-based surface layer, the copper-based face
The bottom of layer is evenly arranged with several grooves.
As a kind of optimal technical scheme of the utility model, the basal plate is carbon materials flitch, and the basal plate
With a thickness of 0.2mm.
As a kind of optimal technical scheme of the utility model, the thermally conductive colloid layer with a thickness of 0.2mm, and described dissipate
The diameter of hot hole is 0.1mm.
As a kind of optimal technical scheme of the utility model, the copper-based surface layer with a thickness of 0.2mm, and it is described copper-based
The groove section length and width of surface layer bottom are 0.1mm.
As a kind of optimal technical scheme of the utility model, the radiating fin is made of Al-alloy metal material.
The utility model beneficial effect achieved is：This kind is convenient for the heavy current circuit plate of heat dissipation, by basal plate
Two sides be evenly arranged with several radiating fins, the inside of thermally conductive colloid layer is evenly arranged with several heat release holes, convenient for dissipate
Heat, while the bottom of copper-based surface layer is evenly arranged with several grooves, groove section length and width are 0.1mm, are not only convenient for air
Circulation heat dissipation, and increase the area of copper-based surface layer contacted with air, convenient for the diffusion of heat.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.
In the accompanying drawings：
Fig. 1 is a kind of overall structure figure of the heavy current circuit plate convenient for heat dissipation of the utility model；
Fig. 2 is a kind of plane structure chart of the heavy current circuit plate convenient for heat dissipation of the utility model；
In figure：1, basal plate；2, electronic component；3, thermally conductive colloid layer；4, heat release hole；5, copper-based surface layer；6, groove； 7,
Radiating fin.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
Embodiment：As shown in Figs. 1-2, a kind of heavy current circuit plate convenient for heat dissipation of the utility model, including basal plate 1,
Electronic component 2, thermally conductive colloid layer 3, heat release hole 4, copper-based surface layer 5, groove 6, radiating fin 7, if the top of basal plate 1 is provided with
Dry electronic component 2, the two sides of basal plate 1 are evenly arranged with several radiating fins 7, and the bottom end of basal plate 1 is provided with thermally conductive
Colloid layer 3, the inside of thermally conductive colloid layer 3 are evenly arranged with several heat release holes 4, and the bottom end of thermally conductive colloid layer 3 is provided with copper-based
Surface layer 5, the bottom of copper-based surface layer 5 are evenly arranged with several grooves 6.
Basal plate 1 is carbon materials flitch, and basal plate 1 with a thickness of 0.2mm, base made of the carbon materials flitch of 0.2mm thickness
Plate 1 is convenient for thermally conductive.
Thermally conductive colloid layer 3 with a thickness of 0.2mm, and the diameter of heat release hole 4 is 0.1mm, the thermally conductive colloid layer of 0.2mm thickness
3 convenient for thermally conductive, and the heat on absorption basal plate 1, the heat release hole 4 of 0.1mm diameter is convenient for dispersing the heat on thermally conductive colloid layer 3.
Copper-based surface layer 5 with a thickness of 0.2mm, and the 6 section length and width of groove of 5 bottom of copper-based surface layer are 0.1mm, 0.2mm
The copper-based surface layer 5 of thickness is hardly damaged, and copper metal, convenient for heat dissipation, the 6 section length and width of groove of copper-based 5 bottom of surface layer are
0.1mm is not only convenient for air circulation heat dissipation, and increases the area of copper-based surface layer 5 contacted with air, convenient for heat dissipation.
Radiating fin 7 is made of Al-alloy metal material, and radiating fin 7 made of aluminum alloy materials is convenient for heat dissipation.
Specifically, the top of basal plate 1 is provided with several electronic components 2, electronic component 2 can generate a large amount of when working
Heat, the two sides of basal plate 1 are evenly arranged with several radiating fins 7, and radiating fin 7 is made of Al-alloy metal material, aluminium
For radiating fin 7 made of alloy material convenient for heat dissipation, basal plate 1 is carbon materials flitch, and basal plate 1 with a thickness of 0.2mm,
For basal plate 1 made of the carbon materials flitch of 0.2mm thickness convenient for thermally conductive, the bottom end of basal plate 1 is provided with thermally conductive colloid layer 3, heat-conducting glue
The inside of body layer 3 is evenly arranged with several heat release holes 4, thermally conductive colloid layer 3 with a thickness of 0.2mm, and the diameter of heat release hole 4 is
The thermally conductive colloid layer 3 of 0.1mm, 0.2mm thickness is convenient for thermally conductive heat on absorption basal plate 1, and the heat release hole 4 of 0.1mm diameter is just
In dispersing the heat on thermally conductive colloid layer 3, the bottom end of thermally conductive colloid layer 3 is provided with copper-based surface layer 5, and the bottom of copper-based surface layer 5 is equal
It is even to be provided with several grooves 6, copper-based surface layer 5 with a thickness of 0.2mm, and the 6 section length and width of groove of 5 bottom of copper-based surface layer are
The copper-based surface layer 5 of 0.1mm, 0.2mm thickness is hardly damaged, and copper metal, convenient for heat dissipation, the groove 6 of copper-based 5 bottom of surface layer is cut
Face length and width are 0.1mm, are not only convenient for air circulation heat dissipation, and increase the area that copper-based surface layer 5 is contacted with air, convenient for dissipating
Heat.
This kind is convenient for the heavy current circuit plate of heat dissipation, by being evenly arranged with several radiating fins in the two sides of basal plate 1
Piece 7, the inside of thermally conductive colloid layer 3 are evenly arranged with several heat release holes 4, and convenient for heat dissipation, while the bottom of copper-based surface layer 5 is uniform
Several grooves 6 are provided with, 6 section length and width of groove are 0.1mm, are not only convenient for air circulation heat dissipation, and increase copper-based face
The area of layer 5 contacted with air, convenient for the diffusion of heat.
Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of heavy current circuit plate convenient for heat dissipation, including basal plate (1), electronic component (2), thermally conductive colloid layer (3), heat dissipation
Hole (4), copper-based surface layer (5), groove (6), radiating fin (7), which is characterized in that the basal plate (1) if top be provided with
Dry electronic component (2), the two sides of the basal plate (1) are evenly arranged with several radiating fins (7), the basal plate (1)
Bottom end be provided with thermally conductive colloid layer (3), the inside of the thermally conductive colloid layer (3) is evenly arranged with several heat release holes (4), institute
The bottom end for stating thermally conductive colloid layer (3) is provided with copper-based surface layer (5), and the bottom of the copper-based surface layer (5) is evenly arranged with several
Groove (6).
2. a kind of heavy current circuit plate convenient for heat dissipation according to claim 1, which is characterized in that the basal plate (1)
For carbon materials flitch, and the basal plate (1) with a thickness of 0.2mm.
3. a kind of heavy current circuit plate convenient for heat dissipation according to claim 1, which is characterized in that the thermally conductive colloid layer
(3) with a thickness of 0.2mm, and the diameter of the heat release hole (4) is 0.1mm.
4. a kind of heavy current circuit plate convenient for heat dissipation according to claim 1, which is characterized in that the copper-based surface layer
(5) with a thickness of 0.2mm, and groove (6) section length and width of the copper-based surface layer (5) bottom are 0.1mm.
5. a kind of heavy current circuit plate convenient for heat dissipation according to claim 1, which is characterized in that the radiating fin
(7) it is made of Al-alloy metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820091480.0U CN208175089U (en) | 2018-01-19 | 2018-01-19 | A kind of heavy current circuit plate convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820091480.0U CN208175089U (en) | 2018-01-19 | 2018-01-19 | A kind of heavy current circuit plate convenient for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208175089U true CN208175089U (en) | 2018-11-30 |
Family
ID=64387695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820091480.0U Expired - Fee Related CN208175089U (en) | 2018-01-19 | 2018-01-19 | A kind of heavy current circuit plate convenient for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208175089U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587940A (en) * | 2019-01-23 | 2019-04-05 | 刘昊 | A kind of high heat radiating metal aluminum-based copper-clad plate |
-
2018
- 2018-01-19 CN CN201820091480.0U patent/CN208175089U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587940A (en) * | 2019-01-23 | 2019-04-05 | 刘昊 | A kind of high heat radiating metal aluminum-based copper-clad plate |
| CN109587940B (en) * | 2019-01-23 | 2021-08-17 | 江西倍韬新材料科技有限公司 | High-heat-dissipation aluminum-based copper-clad plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181130 Termination date: 20210119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |