CN212183801U - Multilayer printed wiring board with heat dissipation function - Google Patents
Multilayer printed wiring board with heat dissipation function Download PDFInfo
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- CN212183801U CN212183801U CN201922300724.9U CN201922300724U CN212183801U CN 212183801 U CN212183801 U CN 212183801U CN 201922300724 U CN201922300724 U CN 201922300724U CN 212183801 U CN212183801 U CN 212183801U
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- heat
- heat dissipation
- printed wiring
- wiring board
- multilayer printed
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Abstract
The utility model belongs to the technical field of multilayer printed wiring board and specifically relates to a multilayer printed wiring board with heat dissipation function. The heat-conducting tube type printed circuit board comprises a printed circuit board body, insulating columns are arranged on the periphery of the body, the insulating columns are connected with heat-conducting tubes and are arranged on the back of the body, the insulating columns and the heat-conducting tubes are fixed through screws, threads are arranged inside the insulating columns, the heat-conducting tubes are connected with radiating fins, and the radiating fins are arranged at the center of the back of the body. The heat-conducting pipe and the radiating fin are additionally arranged behind the printed circuit board, so that the heat dissipation condition of the printed circuit board at a position with larger heat generation is solved, the normal work of the printed circuit board cannot be hindered due to the interaction of the heat-conducting pipe and the radiating fin, the heat dissipation effect is improved, and the service life of the printed circuit board is prolonged.
Description
Technical Field
The utility model belongs to the technical field of multilayer printed wiring board and specifically relates to a multilayer printed wiring board with heat dissipation function.
Background
With the development of electronic products in the direction of multifunction, short, thin and light, the design space of printed circuit boards for carrying electronic products is more and more dense, the requirements on signal frequency and transmission rate are higher and higher, the power and chip operation speed of used electronic components are also higher and higher, and most of electric energy of the electronic components or chips during working is converted into heat to be dissipated, which inevitably puts higher requirements on the heat dissipation performance of the circuit board.
Generally, the metal base is added on the printed circuit board to realize heat dissipation, but the metal base can only dissipate heat generated by circuit pattern transmission of the printed circuit board, and the multiple dielectric layers are arranged between the electrical components mounted on the printed circuit board and the metal base, so that the generated heat is difficult to transfer to the metal base to dissipate. The substrate structure is used for heat dissipation, the heat dissipation effect is not ideal, and the circuit board is easy to be damaged due to overheating.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a multilayer printed wiring board with heat dissipation function through adding at the back at printed wiring board and establishing heat pipe and fin, has solved the circuit board in the heat dissipation condition at the great position that generates heat to the normal work of printed wiring board can not hindered to the interact of heat pipe and fin, not only improves the radiating effect, has strengthened the life of printed wiring template moreover.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a multilayer printed wiring board with heat dissipation function, includes the printed wiring board body, be equipped with the insulating column around the body, the body back is arranged in to the insulating column connection heat pipe, fix through the screw between insulating column and the heat pipe, the screw thread of this screw sets up inside the insulating column, the fin is connected to the heat pipe, body back central point is located to the fin.
The utility model discloses further improve, the heat pipe is four, and is connected to the fin in order to disperse the type mode. The heat pipe is connected with the radiating fins, so that heat on the circuit board can be quickly conducted to the radiating fins, and then the heat is radiated out through the radiating fins, and the heat radiating structure is simple and good in heat radiating effect.
The utility model discloses further improve, the insulating column is connected by the spring with the heat pipe connector, the spring suit is outside the heat pipe. The connection mode of spring can promote the initiative of heat pipe for the heat pipe can not be too harsh and lead to the condition of damaging the circuit board.
The utility model discloses further improve, the both ends side of body is equipped with the insulation board, insulation board length is slightly longer than the body. The effect of insulation board not only can with the body with the contact surface direct contact outside to also promoted the ability of body in the aspect of the heat dissipation, and the insulation board can regard as the handle to use, increase the convenience of using.
The utility model discloses further improve, bond through glue between insulation board and the body. The glue bonding not only enhances the insulating ability, but also the glue does not damage the body and is used in other aspects.
The utility model discloses further improve, still be equipped with a plurality of heat dissipation posts on the body. The heat dissipation column can dissipate heat of other less-high-heat areas on the front surface of the body.
The utility model discloses the further improvement, the heat dissipation post surface has all wrapped up the insulating layer. The insulating layer can improve the insulating capability of the heat dissipation post.
The utility model has the advantages that: the heat-conducting pipe and the radiating fin are additionally arranged behind the printed circuit board, so that the heat dissipation condition of the printed circuit board at a position with larger heat generation is solved, the normal work of the printed circuit board cannot be hindered due to the interaction of the heat-conducting pipe and the radiating fin, the heat dissipation effect is improved, and the service life of the printed circuit board is prolonged.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the back structure of the present invention.
In the figure, 1-body, 2-insulating column, 3-heat conducting pipe, 4-radiating fin, 5-spring, 6-insulating plate, 7-radiating column and 8-insulating layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example, as shown in fig. 1 and 2: the utility model provides a multilayer printed wiring board with heat dissipation function, its characterized in that, includes printed wiring board body 1, body 1 is equipped with insulating column 2 all around, insulating column 2 is connected heat pipe 3 and is arranged in 1 back of body, fix through the screw between insulating column 2 and the heat pipe 3, the screw thread of screw sets up inside insulating column 2, heat pipe 3 connects fin 4, 1 back central point of body puts is located to fin 4.
In this embodiment, the number of the heat pipes 3 is four, and the heat pipes are connected to the heat sink 4 in a divergent mode. The heat conduction pipe 3 is connected with the radiating fin 4, so that heat on the circuit board can be quickly conducted to the radiating fin 4, and then the heat is radiated out through the radiating fin 4, and the heat radiating structure is simple and good in heat radiating effect.
In this embodiment, the connection port between the insulating column 2 and the heat pipe 3 is connected by a spring 5, and the spring 5 is sleeved outside the heat pipe 3. The connection mode of the spring 5 can improve the activity of the heat conduction pipe 3, so that the heat conduction pipe 3 is not too hard to damage the circuit board.
In this embodiment, the side edges of the two ends of the body 1 are provided with insulating plates 6, and the length of the insulating plates 6 is slightly longer than that of the body 1. The effect of insulation board not only can with the body with the contact surface direct contact outside to also promoted the ability of body in the aspect of the heat dissipation, and the insulation board can regard as the handle to use, increase the convenience of using.
In this embodiment, the insulating plate 6 and the body 1 are bonded by glue. The glue bonding not only enhances the insulating ability, but also the glue does not damage the body 1 in other aspects of use.
In this embodiment, the body 1 is further provided with a plurality of heat dissipation columns 7. The heat dissipation column 7 can dissipate heat of other less high heat areas on the front surface of the body 1.
In this embodiment, the surface of the heat dissipation pillar 7 is wrapped by the insulating layer 8. The insulating layer 8 may improve the insulating ability of the heat-dissipating stud 7.
The above description is only an example of the present invention, and the common general knowledge of the known specific structures and characteristics of the embodiments is not described herein. It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The utility model provides a multilayer printed wiring board with heat dissipation function, its characterized in that, includes the printed wiring board body, be equipped with the insulating column around the body, the body back is arranged in to insulating column connection heat pipe, fix through the screw between insulating column and the heat pipe, the screw thread of screw sets up inside the insulating column, the fin is connected to the heat pipe, the body back central point is located to the fin.
2. The multilayer printed wiring board having a heat dissipating function according to claim 1, wherein the number of the heat pipes is four, and the heat pipes are connected to the heat sink in a divergent pattern.
3. The multilayer printed circuit board with the heat dissipation function as claimed in claim 1, wherein the insulating columns and the heat pipe connection ports are connected by springs, and the springs are sleeved outside the heat pipe.
4. The multilayer printed wiring board with a heat dissipation function as claimed in claim 1, wherein the body is provided with insulating plates at both ends thereof, and the length of the insulating plates is slightly longer than that of the body.
5. The multilayer printed wiring board with a heat dissipation function according to claim 4, wherein the insulating plate and the body are bonded by glue.
6. The multilayer printed wiring board with a heat dissipation function as claimed in claim 1, wherein the body is further provided with a plurality of heat dissipation posts.
7. The multilayer printed wiring board with heat dissipation function of claim 6, wherein the surface of the heat dissipation pillar is covered with an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922300724.9U CN212183801U (en) | 2019-12-20 | 2019-12-20 | Multilayer printed wiring board with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922300724.9U CN212183801U (en) | 2019-12-20 | 2019-12-20 | Multilayer printed wiring board with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212183801U true CN212183801U (en) | 2020-12-18 |
Family
ID=73763134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922300724.9U Active CN212183801U (en) | 2019-12-20 | 2019-12-20 | Multilayer printed wiring board with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212183801U (en) |
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2019
- 2019-12-20 CN CN201922300724.9U patent/CN212183801U/en active Active
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