CN209151416U - Flange-cooled aluminum substrate and data processing equipment - Google Patents
Flange-cooled aluminum substrate and data processing equipment Download PDFInfo
- Publication number
- CN209151416U CN209151416U CN201821165547.7U CN201821165547U CN209151416U CN 209151416 U CN209151416 U CN 209151416U CN 201821165547 U CN201821165547 U CN 201821165547U CN 209151416 U CN209151416 U CN 209151416U
- Authority
- CN
- China
- Prior art keywords
- aluminum substrate
- flange
- cooling fin
- cooled
- data processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of flange-cooled aluminum substrate and data processing equipments, it is related to aluminum substrate technical field, main purpose is the better heating conduction for improving aluminum substrate, and then improves the heat dissipation effect of aluminum substrate, to guarantee the normal work of aluminum substrate and data processing equipment.The flange-cooled aluminum substrate of the utility model is applied to ideal money and digs mine machine, comprising: aluminum substrate and cooling fin, the cooling fin are integrated cooling fin, and the aluminum substrate is fixedly connected with the integrated cooling fin.Scheme provided by the utility model can distribute rapidly the heat of component generation, guarantee the stabilization and normal work of component electric property on aluminum substrate.
Description
Technical field
The utility model relates to aluminum substrate technical fields more particularly to a kind of flange-cooled aluminum substrate and data processing to set
It is standby.
Background technique
Aluminum substrate is a kind of metal-based copper-clad plate with good heat radiating function, and general single sided board is by three-decker institute group
At being circuit layer (copper foil), insulating layer and metal-based layer respectively.For it is high-end use be also designed as dual platen, structure is
Circuit layer, insulating layer, aluminium base, insulating layer, circuit layer.It is multi-layer board that only a few, which is applied, can be by common multi-layer board and insulation
Layer, aluminium base are bonded.Radiator aluminium base plate mainly utilizes its heat-radiating substrate material itself to have preferable heat conductivity, will be hot
Source exports well.
Along with the continuous development of electronics industry technology, there is very high requirement to the production production of wiring board and technique,
Substrate using aluminum substrate as route, thermally conductive, perfect heat-dissipating can substantially reduce the temperature of component.But current aluminium
The structure of substrate is too simple, and often resulting in wiring board cannot radiate in time, when especially component power consumption is higher on aluminum substrate, meeting
Influence the normal work of circuit.
Utility model content
In view of this, the utility model embodiment provides a kind of flange-cooled aluminum substrate and data processing equipment, mainly
Purpose is better help aluminum substrate heat dissipation, is avoided because being unable to rapid cooling bring wiring board cisco unity malfunction.
In order to achieve the above objectives, the utility model mainly provides the following technical solutions:
In one embodiment, a kind of flange-cooled aluminum substrate is applied to ideal money and digs mine machine, comprising:
Aluminum substrate and cooling fin, the cooling fin are integrated cooling fin, and the aluminum substrate is fixed with the integrated cooling fin
Connection.
In one embodiment, the aluminum substrate is fixedly connected with the integrated cooling fin including at least one of:
It is threadedly coupled, crimping, is bonded and welds.
In one embodiment, heat-conducting medium is filled between the aluminum substrate and the integrated cooling fin.
Specifically, the heat-conducting medium includes at least one of:
Thermally conductive gel, heat-conducting silicone grease, thermal conductive silicon rubber mat and thermally conductive mud.
In order to achieve the above object, the utility model embodiment additionally provides a kind of data processing equipment, including such as aforementioned
Flange-cooled aluminum substrate described in any embodiment.
On the other hand, in one embodiment, a kind of flange-cooled aluminum substrate is applied to ideal money and digs mine machine, packet
Include: aluminum substrate and cooling fin, the cooling fin are integrated cooling fin, and the aluminum substrate is fixedly connected with the integrated cooling fin.
In one embodiment, aluminum substrate lower surface copper facing or copper alloy, the one heatsink upper surface plating
Copper or copper alloy, the aluminum substrate lower surface and the integrated heatsink upper surface welding.
In one embodiment, aluminum substrate lower surface copper facing or copper alloy and then gold-plated.
Specifically, the one heatsink upper surface copper facing or copper alloy and then gold-plated.
In order to achieve the above object, the utility model embodiment also provides a kind of data processing equipment, including such as aforementioned
Flange-cooled aluminum substrate described in one embodiment.
The flange-cooled aluminum substrate and data that are applied to ideal money and dig mine machine that the utility model embodiment is proposed
Processing equipment is integrally connected cooling fin in aluminum substrate on one side, to improve the heat dissipation effect of aluminum substrate, can distribute member rapidly
The heat that device generates to guarantee the stabilization of component electric property, and then guarantees aluminum substrate and data processing equipment just
Often work.
Referring to following description and accompanying drawings, the particular implementation of the utility model is disclosed in detail, specifies practical
Novel principle can be in a manner of adopted.It should be understood that the embodiments of the present invention in range not thus by
Limitation.In the range of the spirit and terms of appended claims, the embodiments of the present invention includes many changes, modifications
With it is equivalent.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
It uses in a other embodiment, is combined with the feature in other embodiment, or the feature in substitution other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when using herein, but simultaneously
It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those skilled in the art, without any creative labor,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of flange-cooled aluminum substrate provided by the embodiment of the utility model；
Fig. 2 is a kind of structural schematic diagram of flange-cooled aluminum substrate in example provided by the embodiment of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Below with reference to several representative embodiments of the utility model, the principles of the present invention and essence are illustrated in detail
Mind.
The utility model embodiment discloses a kind of flange-cooled aluminum substrate sum number that mine machine is dug applied to virtual digit
The heat dissipation effect of aluminum substrate is improved, to guarantee at aluminum substrate and data for improving the heating conduction of aluminum substrate according to processing equipment
Manage the normal work of equipment.
Further to illustrate that the utility model is the technical means and efficacy reaching predetermined purpose of utility model and being taken,
Below in conjunction with attached drawing and preferred embodiment, to the flange-cooled aluminum substrate and data processing equipment of the present utility model application.
Fig. 1 is the flange-cooled aluminum substrate of the utility model embodiment and the structural schematic diagram of data processing equipment.Such as
Shown in Fig. 1, the disclosed flange-cooled aluminum substrate that mine machine is dug applied to ideal money of the present embodiment, comprising: aluminum substrate and dissipate
Backing, the cooling fin are integrated cooling fin, and the aluminum substrate is fixedly connected with the integrated cooling fin.
In the present embodiment, as shown in Figure 1, being dug in mine machine in virtual digit currency, the side of aluminum substrate 1 is fixedly connected with one
The cooling fin 2 of body, the size and aluminum substrate of integrated cooling fin are suitable, can rapidly distribute the heat that component generates on aluminum substrate
Amount guarantees the stabilization of component electric property on aluminum substrate, and then guarantees the normal work of aluminum substrate.It should be noted that this
In embodiment, integrated cooling fin is to be fitted in aluminum substrate as a whole according to made of the size and shape of aluminum substrate
Side.In this way, can be with limits, the heat with aluminum substrate of high speed.Wherein, described to be fixedly connected with main purpose
It is the efficiency in order to accelerate integrated cooling fin, then in specific application, it can be using threaded connection, crimping, bonding and welding.
In a kind of preferably embodiment, integrated cooling fin is the cooling fin of an entirety, and side is provided with multiple saws
Tooth.Ideal money can be dug aluminium base in mine machine by integrated cooling fin, cooling fin device heat dissipation effect Quick uniform as a whole
The temperature of component on plate, especially multiple high-speed computation chips quickly conducts, multiple high-speed cruisings on entire aluminum substrate
The temperature of chip, which is stablized, to maintain an equal level.It is low to effectively prevent the digging of ideal money caused by the cooling fin of monomer mine machine air intake vent temperature, and
Air outlet temperature is high, so it is different at a temperature of go out the chip operation of air intake vent in different temperature, characteristic is also different, can not
It is played conducive to stablizing for electrical characteristic.
For example, filling heat-conducting medium between aluminum substrate and integrated cooling fin.Common heat-conducting medium has thermally conductive solidifying
Glue, heat-conducting silicone grease, thermal conductive silicon rubber mat and thermally conductive mud.If Fig. 2 gets through hole 3 on aluminum substrate 1 and integrated cooling fin, by screw thread and
Spiral shell button is twisted together.Integrated cooling fin considers heat dissipation performance and cost problem, and what is generallyd use is aluminium material.This scheme can be with
Applied on the aluminum substrate heat sink conception of mainstream, radiating mode is aluminum substrate+heat-conducting silicone grease+one cooling fin, by screwing
Hole is fixed together aluminum substrate and cooling fin.In specific application, the heat sink conception can quickly be taken away on aluminum substrate
Heat.When heat height to a certain extent when, can have such a phenomenon, aluminium base plate has deformation and song during patch
It sticks up, when fixed by the screw on plate, middle section can be had the gap, and due to the presence in gap, participant may cause aluminum substrate simultaneously
No and cooling fin all fits closely, and then leads to there is a situation where that non-uniform part heat dissipation effect is bad in whole plate.
Based on same design, the invention also discloses a kind of data processing equipments, including such as previous embodiment institute
Disclosed flange-cooled aluminum substrate.Wherein, the flange-cooled aluminum substrate structure in the data processing equipment embodiment is as before
It states described in flange-cooled aluminum substrate embodiment, therefore details are not described herein.
With the further improvement of product, technologic optimization processing carried out to such product, in another embodiment,
In the aluminium face of aluminum substrate and the aluminium face of cooling fin, the technique for being added to copper facing or copper-beryllium, since two contact surfaces plate
Copper, can be uniformly applied in the plane of whole plate by way of brush tin cream, can be by aluminum substrate and heat dissipation after crossing furnace
Piece fits closely together, and heat dissipation effect is made to reach best.Wherein, the copper facing and copper-beryllium are relatively common realizations
Means.For there is the special product being required, it is also contemplated that gold-plated.
Based on same design, the invention also discloses a kind of data processing equipments, including such as previous embodiment institute
Disclosed flange-cooled aluminum substrate.Wherein, the flange-cooled aluminum substrate structure in the data processing equipment embodiment is as before
It states described in flange-cooled aluminum substrate embodiment, therefore details are not described herein.
Specific embodiment is applied in the utility model to be expounded the principles of the present invention and embodiment, with
The explanation of upper embodiment is merely used to help understand the method and its core concept of the utility model；Meanwhile for this field
Those skilled in the art, based on the idea of the present invention, there will be changes in the specific implementation manner and application range, comprehensive
Upper described, the content of the present specification should not be construed as a limitation of the present invention.
Claims (9)
1. a kind of flange-cooled aluminum substrate is applied to ideal money and digs mine machine characterized by comprising
Aluminum substrate and cooling fin, the cooling fin are integrated cooling fin, and the aluminum substrate is fixedly connected with the integrated cooling fin,
Heat-conducting medium is filled between the aluminum substrate and the integrated cooling fin.
2. flange-cooled aluminum substrate according to claim 1, which is characterized in that
The one cooling fin is the cooling fin of an entirety, and side is provided with multiple sawtooth.
3. flange-cooled aluminum substrate according to claim 1, which is characterized in that
The aluminum substrate is fixedly connected with the integrated cooling fin including at least one of:
It is threadedly coupled, crimping, is bonded and welds.
4. flange-cooled aluminum substrate according to claim 1, which is characterized in that
The heat-conducting medium includes at least one of:
Thermally conductive gel, heat-conducting silicone grease, thermal conductive silicon rubber mat and thermally conductive mud.
5. the flange-cooled aluminum substrate according to requiring 1 or 2, which is characterized in that
Aluminum substrate lower surface copper facing or copper alloy, the one heatsink upper surface copper facing or copper alloy, the aluminum substrate
Lower surface and the integrated heatsink upper surface welding.
6. flange-cooled aluminum substrate according to claim 5, which is characterized in that
Aluminum substrate lower surface copper facing or copper alloy and then gold-plated.
7. flange-cooled aluminum substrate according to claim 5, which is characterized in that
The one heatsink upper surface copper facing or copper alloy and then gold-plated.
8. a kind of data processing equipment, which is characterized in that including the described in any item flange-cooled aluminium of such as Claims 1-4
Substrate.
9. a kind of data processing equipment, which is characterized in that including the described in any item flange-cooled aluminium of such as claim 5 to 7
Substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821165547.7U CN209151416U (en) | 2018-07-23 | 2018-07-23 | Flange-cooled aluminum substrate and data processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821165547.7U CN209151416U (en) | 2018-07-23 | 2018-07-23 | Flange-cooled aluminum substrate and data processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209151416U true CN209151416U (en) | 2019-07-23 |
Family
ID=67264989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821165547.7U Active CN209151416U (en) | 2018-07-23 | 2018-07-23 | Flange-cooled aluminum substrate and data processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209151416U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225934A (en) * | 2021-05-07 | 2021-08-06 | 北京比特大陆科技有限公司 | Force calculating board and manufacturing method thereof |
-
2018
- 2018-07-23 CN CN201821165547.7U patent/CN209151416U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225934A (en) * | 2021-05-07 | 2021-08-06 | 北京比特大陆科技有限公司 | Force calculating board and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7367195B2 (en) | Application and removal of thermal interface material | |
| CN101556941B (en) | Heat radiation structure of surface mounting high-power element | |
| CN107896421B (en) | PCB capable of fast radiating | |
| TWM507138U (en) | Heat dissipation circuit board | |
| CN201845759U (en) | Radiator and radiating system | |
| CN113097162A (en) | Heat dissipation sheet, chip and circuit board | |
| EP3589102B1 (en) | Heat transfer structure, power electronics module, cooling element, method of manufacturing a heat transfer structure and method of manufacturing a power electronics component | |
| JP3128955U (en) | Electric circuit board structure with heat dissipation sheet | |
| TWI272053B (en) | A heat sink and method for constructing the same | |
| CN107734837B (en) | PCB capable of fast radiating | |
| US20210066157A1 (en) | Power electronics module and a method of producing a power electronics module | |
| CN209151416U (en) | Flange-cooled aluminum substrate and data processing equipment | |
| CN108886031A (en) | The method of power module and manufacture power module | |
| CN201397814Y (en) | Radiating structure of chip type high-power element | |
| CN104934386A (en) | Packaging structure and optical module | |
| CN107734838B (en) | PCB capable of fast radiating | |
| CN209787545U (en) | Printed circuit board | |
| CN209029362U (en) | Chip cooling structure, chip structure, circuit board and supercomputer equipment | |
| CN209029363U (en) | Chip cooling structure, chip structure, circuit board and supercomputer equipment | |
| CN110098153B (en) | Power electronic module and method of manufacturing a power electronic module | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN208781834U (en) | Heat radiation structure | |
| CN206432253U (en) | Semiconductor devices | |
| CN105764239B (en) | A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof | |
| CN210405765U (en) | Metal substrate with good heat conductivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |