CN101556941B - Heat radiation structure of surface mounting high-power element - Google Patents
Heat radiation structure of surface mounting high-power element Download PDFInfo
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- CN101556941B CN101556941B CN 200910103838 CN200910103838A CN101556941B CN 101556941 B CN101556941 B CN 101556941B CN 200910103838 CN200910103838 CN 200910103838 CN 200910103838 A CN200910103838 A CN 200910103838A CN 101556941 B CN101556941 B CN 101556941B
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- heat
- power element
- heat radiation
- circuit board
- surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat radiation structure of a surface mounting high-power element for conducting heat energy radiated by the high-power element, comprising a heat-conducting copper block, an aluminum base heat radiation panel, a heat radiation shell. The heat-conducting copper block is embedded in a circuit board and has thickness the same as that of the circuit board; the aluminum base heat radiation panel is plated with a copper welding pan at one surface, while the other surface thereof is connected with the heat radiation shell; and the heat radiation shell radiates heat energy toair in a way of natural convection. The high-power element is enveloped in a way of surface mounting. The installation of the high-power element is characterized in that the high-power element is con nected with the front surface of the heat-conducting copper block embedded on the circuit board by welding. The installation of the aluminum base heat radiation panel is characterized in that the aluminum base heat radiation panel is connected with the reverse surface of the heat-conducting copper block embedded on the circuit board by welding. The invention adopts a following heat radiation access: the high-power element-the heat-conducting copper block-the aluminum base heat radiation panel-the air, effectively reduces the work temperature of the high-power element, remains the work temperature of the high-power element at a rated range, and meets the technical requirement of on-vehicle electronic equipment. The heat radiation structure has the advantages of good heat radiation effect, simple structure, low cost, and the like.
Description
Technical field
The present invention relates to install on the circuit board radiator structure of surface mounting high-power element, be specifically related to a kind of heat abstractor of surface mounting high-power element.
Background technology
Along with the continuous development of automobile electronics, the motor control unit of high-power, miniaturization and lightness is a developing direction.Amplify and come drive motors because existing a lot of motor drive ics carry out electric current by high power transistor, and the fin area of single high-power crystal die and limited in one's ability, must be aided with radiator structure and eliminate heat too much on the chip and rapidly heat being discharged, to prolong the useful life of high-power crystal die.Thereby, on the automobile electrically-controlled product of producing in batches, more high power transistor product has used the paster packing forms, and the high-power components of paster encapsulation how with the circuit board welding of nonmetallic materials, and to conduct heat on the fin of circuit board back be a difficult problem.
The type of existing high-power components radiator structure is more, normally some through holes and metallization are played in the position of bonding power pipe on circuit board, fill up with scolding tin then, because these have the capacity of heat transmission of a lot of through holes that scolding tin fills up more much better than the insulation board base heat conductivility of circuit board, so can play the effect of transistorized heat being led the circuit board back, and then the reverse side of circuit board is pressed on the metal fin dispels the heat.The heat dissipating method of general this use surface mounting high-power element is to install like this; referring to Fig. 1: with design on the position of the needs heat radiation of circuit board 3 soldering surface mounted formula high-power components 1 and process a lot of plated-through holes 2; in welding, these plated-through holes are filled up by scolding tin; when being installed, external heating panel 5 also between cushioning one deck heat-conducting insulation material 4 between circuit board 3 and the heating panel 5 is with assurance circuit board and heating panel, insulate; in order to allow high-power components 1 rapid heat dissipation; usually also circuit board 3 and heating panel 5 to be used screws clamp; perhaps use other ways that circuit board 3 and heating panel 5 are compressed; to reach radiating effect; but these plated-through hole heat-conducting areas are much smaller than the welding area of dissipation of high-power components itself; do not have moment with the quick ability that derives of the inner high heat that produces of high-power components; little and add that the conductive coefficient of the heat-conducting insulation material 4 of liner between circuit board reverse side and fin is not very high because of the cross-sectional area of the plated-through hole 2 on circuit board of gathering, the therefore this radiator structure that directly high-power surface mount elements is welded on the circuit board is restricted in actual applications.
Summary of the invention
At the prior art above shortcomings, it is strong to the purpose of this invention is to provide a kind of not only heat-sinking capability, and the radiator structure of surface mounting high-power element simple in structure, that manufacturing cost is lower.
The object of the present invention is achieved like this: the radiator structure of surface mounting high-power element, be used for the heat that the conduction and high power element gives out, and it is characterized in that, comprising:
One circuit board, the radiating surface of high-power components directly weld with the front that is embedded in the heat conduction copper billet in the circuit board;
-heat conduction copper billet, heat conduction copper billet be embedded in the circuit board and thickness the same with circuit board, the heat conduction copper billet has good heat conductivility;
-heating panel, the one side of heating panel and the reverse side welding that is embedded in heat conduction copper billet in the circuit board, another side connects heat-dissipating casing;
-heat-dissipating casing is used for heat is distributed in the air.
Further feature, described high-power components adopts the form of paster encapsulation.
The installation of described high-power components be by welding be embedded in circuit board on the front of heat conduction copper billet be connected.
Be coated with copper pad on heating panel, heating panel is by copper pad and the reverse side welding that is embedded in heat conduction copper billet on the circuit board.
Compared to existing technology, the present invention has following advantage:
Owing on circuit board, inlay (among Fig. 2) heat conduction copper billet 7, (among Fig. 1) plated-through hole 2 that replaces prior art, the long-pending plated-through hole 2 in Fig. 1 of the heat-conducting section of heat conduction copper billet 7, so the heat of high-power components 1 just can be transmitted to the reverse side of circuit board 3 fast, be delivered to heat-dissipating casing 6 through aluminium base heating panel 5 again, heat conducted in the air by heat-dissipating casing 6.Among the present invention, heat conduction copper billet 7 is directly to be welded on the aluminium base heating panel 5 by the copper pad 8 above the aluminium base heating panel 5 with welding method, and there is one deck chlorine monoxid insulating barrier on aluminium base heating panel 5 surfaces, copper pad 8 is tightly to be attached to the oxide isolated laminar surface of aluminium base heating panel 5 and to insulate with aluminium base by special processing, so just save the heat-conducting insulation material 4 among Fig. 1, also further reduced thermal resistance, be transmitted to purpose on the heat-radiating aluminum plate fast thereby reached the heat that will be in the high-power components 1 produces, thereby solved the problem of the quick heat radiating of high-power components.And structure is simpler, and manufacturing cost is lower.
The present invention adopts from high-power components-heat conduction copper billet-with the path of aluminium base heating panel-fin-air heat radiation of copper pad, effectively reduce the working temperature of high-power components, it is following that the high-power components working temperature is remained in the specified scope, satisfied the specification requirement of vehicle electronic device.
Description of drawings
Fig. 1 is the structural representation of existing high-power components thermal component;
Fig. 2 is the structural representation of the radiator structure of surface mounting high-power element of the present invention.
Embodiment
Embodiment 1: referring to Fig. 2, a kind of radiator structure of surface mounting high-power element is used for the heat that the conduction and high power element gives out, and comprising: circuit board, the radiating surface of high-power components 1 directly are welded on the front of the circuit board 3 that is inlaid with heat conduction copper billet 7; Heat conduction copper billet 7 be embedded in the circuit board 3 and thickness identical with circuit board 3, heat conduction copper billet 7 has good heat conductivility; The one side welding heat conduction copper billet 7 of heating panel 5, another side connects heat-dissipating casing 6; Heat-dissipating casing 6 is used for heat is conducted in the air.
The present invention fixes a heat conduction copper billet 7 with the circuit board same thickness on the position of needs heat radiations of soldering surface mounted formula high-power components 1 in circuit board 3, and in board production, heat conduction copper billet 7 and circuit board 3 are set into one, in welding, high-power components 1 and heat conduction copper billet 7 are welded together, then a volume and the bigger heating panel 5 of area are welded on the another side of heat conduction copper billet 7 by scolding tin.
Described heating panel 5 adopts aluminium bases (the perhaps material of other good heat conductivity, such as materials such as copper, potteries) structure, aluminium base has perfect heat-dissipating, price is relatively low, manufacturing process is ripe, the advantage easily of drawing materials, thereby is applied in a large number in the radiator structure of power circuit.
Embodiment 2: as shown in Figure 2, be on the basis of embodiment 1, be coated with copper pad 8 on aluminium base heating panel 5, aluminium base heating panel 5 is by the reverse side welding of copper pad 8 with heat conduction copper billet 7.
Principle of the present invention is: the heat that surface mounting high-power element 1 sends, directly pass to aluminium base heating panel 5 successively by the heat conduction copper billet 7 that is embedded in the circuit board 3, pass on the fin 6 of entire circuit through radiator aluminium base 5 again, the mode of surface mounting high-power element 1 by welding directly be embedded in circuit board 3 in heat conduction copper billet 7 be connected, heat conduction copper billet 7 is integrated by copper pad 8 welding with aluminium base heating panel 5, because the area of dissipation of aluminium base heating panel 5 is much larger than surface mounting high-power element 1, so it is just much smaller that aluminium base heating panel 5 is fixed on its thermal resistance of entire circuit shell, thereby just improved the efficient of heat transferred greatly.Not only the capacity of heat transmission is strong as heat carrier with the heat conduction copper billet, and easy to process, and manufacturing cost is lower.
The comparison of the capacity of heat transmission:
Thermal conductivity has two important parameters when calculating: thermal resistance and conductive coefficient.
Conductive coefficient is the thermal conduction characteristic of certain material, at shape size requirement is arranged;
Thermal resistance is at a certain fixed system, and strict size, thickness requirement are arranged, if change any part or size change, the thermal resistance of whole system all can change, corresponding to certain material, if overall dimension changes, thermal resistance also is different.
The homogenous material thermal resistance can be calculated by conductive coefficient and shape size.
Therefore, a kind of capacity of heat transmission of radiator structure will could clearly be represented by the calculating of system's thermal resistance.
The thermal source unanimity of this second mate figure can so be thought, the radiating mode capacity of heat transmission of system's thermal resistance minimum is just better.
The heat sink conception of Fig. 1:
R1 is the internal thermal resistance of MOSFET.It is a steady state value, often encapsulates to make when finishing at chip and has determined.Be about 1 ℃/W.
R2 is tin filling post (Sn63Pb37) thermal resistance in the aperture.The scolding tin conductive coefficient is 50W/m*K, totally 37 through holes, single hole sectional area 0.2mm
2, thickness 2mm.Expire if fill, single thermal resistance is 80 ℃/W, and total equivalent thermal resistance is 2.16 ℃/W.
R3 is a PCB substrate thermal resistance, and when material was FR4, conductive coefficient was generally 0.2W/m*K, and through hole is removed in the copper billet zone under the power chip, and the epoxy resin sectional area is 42.84mm altogether
2Its thermal resistance minimum is 233.4 ℃/W, and it is in parallel with the tin filling post, so it is little to the heat-sinking capability influence.
R4 is the heat conducting film thermal resistance, is 0.4 ℃/W.
R5 is the aluminium sheet thermal conductance, and area is 50.24mm
2, thickness 2mm.Conductive coefficient is 0.18 ℃/W.
R6 is an aluminium shell thermal resistance, supposes the shell unanimity, the thermal resistance unanimity of two kinds of comparative structures.
The heat sink conception of Fig. 2:
R1 is the internal thermal resistance of MOSFET.It is a steady state value, often encapsulates to make when finishing at chip and has determined.Be about 1 ℃/W.
R7 is the copper billet thermal resistance, sectional area 50.24mm
2, conductive coefficient 407W/m*K, the thermal resistance size is 0.01 ℃/W.
R8 is an aluminium base pad thermal resistance, has one deck Copper Foil and one deck zinc-plated on the pad, and zinc-plated and weld does not temporarily include, and copper thickness is generally 35 μ m, and the thermal resistance size is 0.000165 ℃/W, can ignore.
One deck layer Al that become attached to arranged between R5 and the R8
2O
396% aluminium oxide conductive coefficient is 30W/m*K, and 99% aluminium oxide conductive coefficient is 35W/m*K, calculates with lower 96% aluminium oxide here, calculate with R8 identical because thickness at 75 μ m between 155 μ m, be 0.1 ℃/W to the maximum.
R5 is an aluminium base, and area is 50.24mm
2, thickness 2mm.Conductive coefficient is 0.18 ℃/W.
R6 is an aluminium shell thermal resistance, supposes the shell unanimity, the thermal resistance unanimity of two kinds of comparative structures.
Equivalent thermal resistance except aluminium shell and chip internal thermal resistance and heat sink conception 1 is 2.74 ℃/W, and the equivalent thermal resistance of heat sink conception 2 is 0.29 ℃/W.Both differ 9.45 times.Calculate low 25 ℃ of the temperature rise of improved scheme 2 with the general dissipation power 10W of power chip commonly used.
The two identical welding portion is (1) and (2), between (1) and (7), supposes that welding procedure is identical, the thermal resistance unanimity.The present invention is not owing to use dielectric film, aluminium base also is to fit by welding and heat conduction copper billet, belonging to surface molecular merges, the contact-making surface gap is considerably less, the dielectric film that adopts with prior art (Fig. 1) compresses mode and (is confined to compress, still the surface of different materials contact) compare, contact heat resistance is lower; Moreover because prior art is used intensive through hole, because effect of surface tension, it is the comparison difficulty that whole holes will fully be filled up in the practical operation.When the power chip dissipation power was 10W in the reality, the temperature of the present invention after the improvement was than low 10 ℃ at least of prior aries (Fig. 1).
Claims (4)
1. the radiator structure of surface mounting high-power element is used for the heat that conduction and high power element (1) gives out, and it is characterized in that, comprising:
One circuit board (3), the radiating surface of high-power components (1) directly weld with the front that is embedded in the heat conduction copper billet (7) in the circuit board (3);
One heat conduction copper billet (7), heat conduction copper billet (7) be embedded in the circuit board (3) and thickness the same with circuit board (3), heat conduction copper billet (7) has good heat conductivility;
One heating panel (5) is coated with copper pad (8) on the described heating panel (5), heating panel (5) is by copper pad (8) and the reverse side welding that is embedded in heat conduction copper billet (7) in the circuit board (3), and another side connects heat-dissipating casing (6);
One heat-dissipating casing (6) is used for heat is distributed in the air.
2. the radiator structure of surface mounting high-power element according to claim 1 is characterized in that, described high-power components (1) adopts the form of paster encapsulation.
3. the radiator structure of surface mounting high-power element according to claim 1 is characterized in that, the installation of described high-power components (1) is to be connected with the front of heat conduction copper billet (7) by welding.
4. the radiator structure of surface mounting high-power element according to claim 1 is characterized in that, described heating panel (5) adopts aluminium base cooling plate structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910103838 CN101556941B (en) | 2009-05-13 | 2009-05-13 | Heat radiation structure of surface mounting high-power element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910103838 CN101556941B (en) | 2009-05-13 | 2009-05-13 | Heat radiation structure of surface mounting high-power element |
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| Publication Number | Publication Date |
|---|---|
| CN101556941A CN101556941A (en) | 2009-10-14 |
| CN101556941B true CN101556941B (en) | 2011-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910103838 Expired - Fee Related CN101556941B (en) | 2009-05-13 | 2009-05-13 | Heat radiation structure of surface mounting high-power element |
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Cited By (1)
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| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
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| CN115507694B (en) * | 2022-09-19 | 2023-11-17 | 中国核动力研究设计院 | Heat conducting rib, manufacturing equipment and manufacturing method thereof and heat exchange equipment comprising heat conducting rib |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005277381A (en) * | 2004-02-23 | 2005-10-06 | Kyocera Corp | Package for storing electronic component and electronic device |
| CN2872073Y (en) * | 2006-02-13 | 2007-02-21 | 江苏江旭电子有限公司 | High-brightness and large-power LED light |
| CN200969724Y (en) * | 2006-11-17 | 2007-10-31 | 上海任重仪表电器有限公司 | Box body for installing electric appliance controlled circuit board |
| CN201397814Y (en) * | 2009-05-13 | 2010-02-03 | 重庆三祥汽车电控系统有限公司 | Radiating structure of chip type high-power element |
-
2009
- 2009-05-13 CN CN 200910103838 patent/CN101556941B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005277381A (en) * | 2004-02-23 | 2005-10-06 | Kyocera Corp | Package for storing electronic component and electronic device |
| CN2872073Y (en) * | 2006-02-13 | 2007-02-21 | 江苏江旭电子有限公司 | High-brightness and large-power LED light |
| CN200969724Y (en) * | 2006-11-17 | 2007-10-31 | 上海任重仪表电器有限公司 | Box body for installing electric appliance controlled circuit board |
| CN201397814Y (en) * | 2009-05-13 | 2010-02-03 | 重庆三祥汽车电控系统有限公司 | Radiating structure of chip type high-power element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
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| CN101556941A (en) | 2009-10-14 |
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