CN102130018A - Chip radiation method, and related device and system - Google Patents
Chip radiation method, and related device and system Download PDFInfo
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- CN102130018A CN102130018A CN 201010579171 CN201010579171A CN102130018A CN 102130018 A CN102130018 A CN 102130018A CN 201010579171 CN201010579171 CN 201010579171 CN 201010579171 A CN201010579171 A CN 201010579171A CN 102130018 A CN102130018 A CN 102130018A
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Abstract
The embodiment of the invention discloses a chip radiation method, and a related device and system. The chip radiation method comprises steps as follows: a chip pad region on a printed circuit board is provided with a plurality of through holes, and the other surface of the chip pad region on the printed circuit board is provided with a bare metal foil; the through holes are processed so as to have heat-conducting property; and radiating fins are fixed on the bare metal foil. The technical scheme disclosed by the invention can effectively implement radiation of various chips; and the volume of the radiating fins can be easily set to be small enough so that the radiating fins have the characteristic of low cost, and are easy to install.
Description
Technical field
The present invention relates to the electronic communication field, relate in particular to chip cooling method, relevant apparatus and system.
Background technology
Chip can produce a large amount of heats usually in the process of work; and when chip not being carried out radiating treatment; the heat major part of its generation can be delivered to the printed circuit board (PCB) (PCB at its place; Printed CircuitBoard) on, for example, discovers; adopt small-sized square planar package (QFP; Quad Flat Package) chip, when it not being carried out radiating treatment, the meeting more than 60% of the hear rate that it produces in the process of work be delivered on the PCB at its place by chip bottom.But because most of Chip Packaging is less, the contact area of its bottom heat radiation pad and circuit board is minimum, therefore its heat-transfer capability to circuit board is extremely limited, and adopt QFP encapsulation, quad flat non-pin package (QFN for some, Quad Flat Noleads package) or BGA Package (BGA, Ball Grid Array Package) chip, not good operating efficiency, useful life and the reliability that will directly have influence on this chip of chip cooling, therefore, the bottom that utilizes PCB to handle chip well is dispelled the heat most important.
Existing a kind of chip cooling scheme as shown in Figure 1, it mainly is to offer a heat radiation hole 102 in the PCB zone of chip 101 bottom land correspondences, and design a kind of radiator that has boss 103, the cross-sectional area of boss 103 is slightly less than the cross-sectional area in heat radiation hole 102, boss 103 is passed heat radiation hole 102 to be contacted with chip 101 bottoms, the heat that chip 101 produces is gone out by heat sink radiates, thereby realizes the heat radiation of chip.
Though said method has heat dispersion preferably, but because the heat radiation hole area of offering is bigger, be applicable to that generally bottom area does not have the heat radiation of the chip of pin than big and bottom, little or bottom has the chip (as the chip of BGA encapsulation) of pin then can't be suitable for for the chip bottom area, simultaneously, the radiator of band boss is relatively heavy, installs and fixedly difficulty is also relatively large.
Summary of the invention
The embodiment of the invention provides a kind of chip cooling method, relevant apparatus and system, is used for improving under the prerequisite of easily installing the radiating efficiency of chip.
For solving the problems of the technologies described above, the embodiment of the invention provides following technical scheme:
A kind of chip cooling method comprises:
Chip-pad area on printed circuit board (PCB) is offered a plurality of through holes, has bare metal foil on another surface of the chip-pad area on the above-mentioned printed circuit board (PCB);
Last through hole is processed, made it have heat conductivility;
Fin is fixed on the above-mentioned bare metal foil.
A kind of printed circuit board (PCB) comprises:
Chip-pad area on the printed circuit board (PCB) is provided with a plurality of through holes with heat conductivility, and has on another surface of the chip-pad area on the described printed circuit board (PCB) and be used for the bare metal foil that is connected with fin.
A kind of chip cooling system comprises:
Printed circuit board (PCB) and fin, and be installed in chip on the above-mentioned printed circuit board (PCB);
Wherein, the chip-pad area on the above-mentioned printed circuit board (PCB) is provided with a plurality of through holes with heat conductivility, and has on another surface of the chip-pad area on the above-mentioned printed circuit board (PCB) and be used for the bare metal foil that is connected with fin;
Above-mentioned fin is fixed on the above-mentioned bare metal foil, with the thermo-contact of above-mentioned through hole, to distribute the heat that said chip produces.
Therefore, in the embodiment of the invention by offer a plurality of through holes in the chip-pad area of PCB with heat conductivility, and fin is fixed on the bare metal foil at the back side of chip-pad area of PCB, the heat that the feasible chip that is installed in the PCB correspondence position produces can be transferred on the fin by through hole and bare metal foil and distribute, can effectively realize the heat radiation of various chips, and the volume of fin is provided with enough for a short time easily, and it is low to have a cost, easily the characteristics of installing.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the configuration diagram of a kind of chip cooling method of the prior art;
Fig. 2 is the schematic flow sheet of embodiment of the invention chips heat dissipating method;
Fig. 3 is the structural representation of embodiment of the invention chips cooling system;
Fig. 4 is the structural representation of printed circuit board (PCB) in the embodiment of the invention;
Fig. 5 is the vertical view of printed circuit board (PCB) in the embodiment of the invention.
Embodiment
The embodiment of the invention provides a kind of chip cooling method, relevant apparatus and system, is used in low cost, easily improves the radiating efficiency of chip under the prerequisite of installing.
For make goal of the invention of the present invention, feature, advantage can be more obvious and understandable, below in conjunction with the accompanying drawing in the embodiment of the invention, technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, but not whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Below the chip cooling method in the embodiment of the invention is described, sees also Fig. 2, embodiment of embodiment of the invention chips heat dissipating method comprises:
201, the chip-pad area on printed circuit board (PCB) is offered a plurality of through holes;
Because of distributing from chip bottom more than 60% of chip caloric value,, can realize the heat radiation of chip with the efficient of maximum so the chip-pad area on printed circuit board (PCB) is offered a plurality of through holes.
Wherein, has bare metal foil (can by acquisition that this PCB surface welding resistance is windowed) on another surface of chip-pad area on the above-mentioned printed circuit board (PCB), all through holes are opened in the zone at bare metal foil place, the big I of the area of bare metal foil is according to chip bottom size, chip heating power consumption and industrial requirements flexible design, for example, for package size is 0.9 millimeter of 3 millimeters * of 3 millimeters *, power consumption is the chip of 2.5W, the area of bare metal foil can be 15 millimeters of 15 millimeters *, to reach preferable radiating effect.Through hole can be opened on the same bare metal foil, also can be opened on the polylith bare metal foil, can decide according to actual conditions, does not limit herein.
Offering the concrete zone of through hole can suitably adjust according to the difference of Chip Packaging form, for example, for the chip that adopts the QFN encapsulation, its zone of offering through hole can be at the welding disking area on the pairing PCB of the bottom of chip heat radiation pad, for the chip that adopts the BGA encapsulation, its zone of offering through hole can be at the welding disking area on the pairing PCB of heat conduction soldered ball of chip, for the chip that adopts the QFP encapsulation, its zone of offering through hole can be at welding disking area on the pairing PCB of chip bottom etc., the particular location of offering through hole is avoided other cabling on the PCB as far as possible, to avoid causing PCB to go up the open circuit or the short circuit of original other circuit.The quantity of the through hole of offering, can be according to chip bottom size, chip heating power consumption and industrial requirements flexible design, for example, for package size is 0.9 millimeter of 3 millimeters * of 3 millimeters *, power consumption is the chip of 2.5W, can offer 5 through holes on the PCB zone corresponding with this chip bottom, to reach preferable radiating effect, the shape of through hole can be circular, square, rhombus, polygon etc., does not limit herein.
202, above-mentioned through hole is processed, made it have heat conductivility;
For making the heat of chip generation can be delivered to the back side of PCB effectively by through hole, can process above-mentioned through hole, make it have heat conductivility.
Can pass through the hole wall metallization to above-mentioned through hole of plating or other mode, the heat that chip is produced can be delivered to the back side of PCB quickly by the coat of metal on the hole wall of through hole;
Perhaps, also can in above-mentioned through hole, fill Heat Conduction Material, as the Heat Conduction Material of conductive coefficients such as heat conductive silica gel greater than the air conductive coefficient, the conductive coefficient of Heat Conduction Material for example can be higher than 50W/m-k or be higher than other value, and the heat that chip is produced can be delivered to the back side of PCB quickly by above-mentioned Heat Conduction Material;
Certainly, also can process above-mentioned through hole, make it have heat conductivility, not limit herein by other method.
203, fin is fixed on the bare metal foil;
Fin is fixed on the above-mentioned bare metal foil,, distributes by fin so that realize and the thermo-contact of above-mentioned through hole that the heat that makes chip produce can be delivered on the fin by through hole, thus the heat radiation of realization chip.
Wherein, fin can be a graphite flake, potsherd, copper sheet or aluminium flake, also can be the fin of being made by the solid conductive heat material that other Heat Conduction Material or multiple Heat Conduction Material are composited, the conductive coefficient of Heat Conduction Material for example can be higher than 50W/m-k or be higher than other value.The thickness of fin can differently according to the speciality of selected Heat Conduction Material suitably be adjusted, for example, if selected Heat Conduction Material is a graphite flake, then its thickness can be about 70 microns, if selected Heat Conduction Material is a copper sheet, then its thickness then can 0.2 millimeter or more than, to realize preferable radiating effect, and when selected materials is aluminium flake, then its thickness can 0.4 millimeter or more than, to realize preferable radiating effect.In actual applications, can be by bonding mode, with the heat conduction viscose glue fin is fixed on the above-mentioned bare metal foil, perhaps also can fin be fixed on the above-mentioned bare metal foil by the mode of welding, certainly, also can fin be fixed on the above-mentioned bare metal foil, but the need assurance is to realize good heat transmission between bare metal foil and the fin by alternate manner.
In actual applications, the area of the fin of selecting for use can be gone up the area of bare metal foil greater than PCB, when fin is that electric conducting material is when making, the part that does not link to each other with bare metal foil for fear of fin touches other circuit on the PCB and causes short circuit, in actual applications, can carry out particular processing to fin.For example, for pliability fin (as graphite flake, copper sheet etc.) preferably, available insulating material (as being insulating protective film) covers it and does not link to each other with bare metal foil, and near the one side of PCB; And for the relatively poor fin of pliability (as aluminium flake), then also can be with this fin by special PROCESS FOR TREATMENT (as punching press, bending etc.), be made into certain specific shape, guarantee that its part that does not link to each other with bare metal foil can not touch other circuit of above-mentioned PCB.Certainly, also can select for use area to equal the fin that PCB goes up the bare metal foil area.
Said method by bonding or the welding mode with on the bare metal foil that fin is fixed on through hole links to each other, need not consider the tolerance and the assembly problem of chip, PCB and fin, install simple and easy, and fin can be by graphite flake, potsherd, solid conductive heat such as copper sheet or aluminium flake or composite heat conducting material material just can be made into by simple processing, and cost is low.
Therefore, in the embodiment of the invention by offer a plurality of through holes in the chip-pad area of PCB with heat conductivility, and fin is fixed on the bare metal foil at the back side of chip-pad area of PCB, the heat that the feasible chip that is installed in the PCB correspondence position produces can be transferred on the fin by through hole and bare metal foil and distribute, can effectively realize the heat radiation of various chips, and the volume of fin is provided with enough for a short time easily, and it is low to have a cost, easily the characteristics of installing.
For ease of better understanding the technical scheme of the embodiment of the invention, the chip cooling system to the embodiment of the invention is described below.
Fig. 3 is the chip cooling system schematic in the embodiment of the invention, sees also Fig. 3, and the chip cooling system of the embodiment of the invention comprises:
Printed circuit board (PCB) 302 and fin 303, and be installed in chip 301 on the printed circuit board (PCB) 302;
The chip-pad area 3021 of printed circuit board (PCB) 302 is provided with a plurality of through holes 3022 with heat conductivility, and has on another surface of chip-pad area 3021 and be used for the bare metal foil 3023 that is connected with fin 303;
Wherein, through hole 3022 is arranged in the zone at bare metal foil 3023 places, its concrete zone can suitably be adjusted according to the difference of Chip Packaging form, for example, for the chip that adopts the QFN encapsulation, the zone at through hole place can be at the welding disking area on the PCB of the bottom of chip heat radiation pad correspondence, for the chip that adopts the BGA encapsulation, the zone at through hole place can be at the welding disking area on the PCB of the heat conduction soldered ball correspondence of chip, for the chip that adopts the QFP encapsulation, the zone at through hole place can be at welding disking area on the PCB of chip bottom correspondence etc., the particular location of offering through hole is avoided other cabling on the PCB as far as possible, to avoid causing PCB to go up the open circuit or the short circuit of original other circuit.Can suitably adjust the quantity of through hole according to the actual application environment flexible design, reaching better radiating effect, shape of through holes can be circular, square, rhombus, polygon etc., does not limit herein.
Through hole 3022 is the through holes after the processing, and through hole 3022 is processed, and its method with heat conductivility can be repeated no more with reference to the description among Fig. 2 embodiment herein.
Fin 303 is used for fixing on bare metal foil 3023, so that the thermo-contact of realization and through hole 3022.
Wherein, can fin 303 be fixed on the bare metal foil 3023, with the thermo-contact of realization with through hole 3022 by thermal conducting agent 304.Wherein, thermal conducting agent 304 can be scolding tin or viscose glue, certainly, also can be other thermal conducting agent that fin 303 and bare metal foil 3023 can be fixed.
Wherein, in actual applications, go up the area of bare metal foil greater than PCB when the area of the fin of selecting for use, and when fin 303 can conduct electricity, then the part that does not link to each other with bare metal foil for fear of fin touches other circuit on the PCB and causes short circuit, and fin 303 can comprise insulating barrier 3031 and thermal conductive material layer 3032;
Insulating barrier 3031 is positioned at fin 303 and does not link to each other with bare metal foil 3023; and one side near PCB; it can be made (as insulating protective film) by insulating material, the concrete grammar that carries out insulation protection on fin can repeat no more with reference to the description among Fig. 2 embodiment herein.
Thermal conductive material layer 3032 can be by graphite flake, potsherd, copper sheet or aluminium flake are made, also can be to make by the material that other Heat Conduction Material or multiple Heat Conduction Material are composited, the conductive coefficient of thermal conductive material layer 3032 for example can be higher than 50W/m-k or be higher than other value, and its thickness can differently according to the speciality of selected Heat Conduction Material suitably be adjusted, for example, if selected Heat Conduction Material is a graphite flake, then its thickness can be about 70 microns, if selected Heat Conduction Material is a copper sheet, then its thickness then can 0.2 millimeter or more than, to realize preferable radiating effect, and when selected materials is aluminium flake, then its thickness can 0.4 millimeter or more than, to realize best radiating effect.
The quantity that is appreciated that the shape and structure of each parts shown in Figure 3 and through hole only is to be unique qualification to each component shape structure and number of openings for ease of drawing, should not be construed as.Based among the said method embodiment to the description of each functions of components feature, the quantity of its each position component relation and shape and structure and through hole can change, and describes in detail no longer one by one herein.
Therefore, in the embodiment of the invention by offer a plurality of through holes in the chip-pad area of PCB with heat conductivility, and fin is fixed on the bare metal foil at the back side of chip-pad area of PCB, the heat that the feasible chip that is installed in the PCB correspondence position produces can be transferred on the fin by through hole and bare metal foil and distribute, can effectively realize the heat radiation of various chips, and the volume of fin is provided with enough for a short time easily, and it is low to have a cost, easily the characteristics of installing.
The embodiment of the invention also provides a kind of printed circuit board (PCB), and a kind of printed circuit board (PCB) that the embodiment of the invention is provided is described below, and Fig. 4 is the structural representation of the printed circuit board (PCB) of the embodiment of the invention.
As shown in Figure 4, printed circuit board (PCB) comprises at least:
Wherein, the zone at through hole 402 places is set at the zone at chip bonding pad place, concrete zone can suitably be adjusted according to the difference of Chip Packaging form, for example, for the chip that adopts the QFN encapsulation, the zone at through hole place can be at the welding disking area on the PCB of the bottom of chip heat radiation pad correspondence, for the chip that adopts the BGA encapsulation, the zone at through hole place can be at the welding disking area on the PCB of the heat conduction soldered ball correspondence of chip, for the chip that adopts the QFP encapsulation, the zone at through hole place can be at welding disking area on the PCB of chip bottom correspondence etc., the particular location of offering through hole is avoided other cabling on the PCB as far as possible, to avoid causing PCB to go up the open circuit or the short circuit of original other circuit.Can suitably adjust the quantity of through hole 402 according to the actual application environment flexible design, reaching better radiating effect, shape of through holes can be circular, square, rhombus, polygon etc., does not limit herein.
Through hole 402 is the through holes after the processing, and through hole 402 is processed, and its method with heat conductivility can be repeated no more with reference to the description among Fig. 2 embodiment herein.
The vertical view of the printed circuit board (PCB) that the invention process provided for example can be as shown in Figure 5, and through hole 501 is arranged in the zone at bare metal foil 502 places.
The quantity that is appreciated that the shape and structure of Fig. 4 and each parts shown in Figure 5 and through hole only is to be unique qualification to each component shape structure and number of openings for ease of drawing, should not be construed as.Based among the said method embodiment to the description of each functions of components feature, the quantity of its each position component relation and shape and structure and through hole can change, and describes in detail no longer one by one herein.
Therefore, in the embodiment of the invention by offer a plurality of through holes in the chip-pad area of printed circuit board (PCB) with heat conductivility, so that fin is fixed on the bare metal foil at the back side of chip-pad area of printed circuit board (PCB), the heat that the feasible chip that is installed in the printed circuit board (PCB) correspondence position produces can be transferred on the fin by through hole and bare metal foil and distribute, can effectively realize the heat radiation of various chips, and the volume of fin is provided with enough for a short time easily, it is low to have cost, easily the characteristics of installing.
More than chip cooling method provided by the present invention, relevant apparatus and system are described in detail, for one of ordinary skill in the art, thought according to the embodiment of the invention, part in specific embodiments and applications all can change, to sum up, this description should not be construed as limitation of the present invention.
Claims (11)
1. a chip cooling method is characterized in that, comprising:
Chip-pad area on printed circuit board (PCB) is offered a plurality of through holes, has bare metal foil on another surface of the chip-pad area on the described printed circuit board (PCB);
Described through hole is processed, made it have heat conductivility;
Fin is fixed on the described bare metal foil.
2. method according to claim 1 is characterized in that, described described through hole is processed, and makes it have heat conductivility, comprising:
Hole wall metallization with described through hole makes it have heat conductivility;
Or,
Fill Heat Conduction Material in described through hole, make it have heat conductivility, the conductive coefficient of described Heat Conduction Material is greater than the conductive coefficient of air.
3. method according to claim 1 and 2 is characterized in that, described fin is fixed on the described bare metal foil, comprising:
Mode bonding by viscose glue or welding is fixed on fin on the described bare metal foil.
4. according to each described method of claim 1 to 3, it is characterized in that,
The area of described fin is greater than the area of described bare metal foil.
5. method according to claim 4 is characterized in that, described method also comprises:
If described fin can conduct electricity, then described fin is not linked to each other with described bare metal foil, and cover with insulating material near the one side of described printed circuit board (PCB).
6. method according to claim 5 is characterized in that,
Described fin is graphite flake, potsherd, copper sheet or aluminium flake.
7. a printed circuit board (PCB) is characterized in that,
Chip-pad area on the printed circuit board (PCB) is provided with a plurality of through holes with heat conductivility, and has on another surface of the chip-pad area on the described printed circuit board (PCB) and be used for the bare metal foil that is connected with fin.
8. a chip cooling system is characterized in that, comprising:
Printed circuit board (PCB) and fin, and be installed in chip on the described printed circuit board (PCB);
Wherein, the chip-pad area on the described printed circuit board (PCB) is provided with a plurality of through holes with heat conductivility, and has on another surface of the chip-pad area on the described printed circuit board (PCB) and be used for the bare metal foil that is connected with fin;
Described fin is fixed on the described bare metal foil, with the thermo-contact of described through hole, to distribute the heat that described chip produces.
9. system according to claim 8 is characterized in that,
The area of described fin is greater than the area of described bare metal foil.
10. system according to claim 9 is characterized in that,
Not linking to each other of described fin with described bare metal foil, and be insulated material near the one side of described printed circuit board (PCB) and cover.
11. system according to claim 10 is characterized in that,
Described fin is graphite flake, potsherd, copper sheet or aluminium flake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010579171 CN102130018A (en) | 2010-12-08 | 2010-12-08 | Chip radiation method, and related device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010579171 CN102130018A (en) | 2010-12-08 | 2010-12-08 | Chip radiation method, and related device and system |
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| CN102130018A true CN102130018A (en) | 2011-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010579171 Pending CN102130018A (en) | 2010-12-08 | 2010-12-08 | Chip radiation method, and related device and system |
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| CN103200805A (en) * | 2013-04-03 | 2013-07-10 | 张家港市华力电子有限公司 | Heat radiation structure of electronic devices in sealed shell |
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| CN103107277B (en) * | 2012-08-17 | 2016-05-25 | 周焕球 | Light source heat radiation structure |
| CN103200805A (en) * | 2013-04-03 | 2013-07-10 | 张家港市华力电子有限公司 | Heat radiation structure of electronic devices in sealed shell |
| CN104157627A (en) * | 2013-05-14 | 2014-11-19 | 飞兆半导体公司 | Semiconductor Assembly |
| CN104869744A (en) * | 2014-02-24 | 2015-08-26 | 联想(北京)有限公司 | Circuit board and preparation method thereof |
| CN104900610A (en) * | 2015-01-26 | 2015-09-09 | 天津大学 | Cooling structure for redistributed packaged chip |
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| CN108990362A (en) * | 2017-06-02 | 2018-12-11 | 中兴通讯股份有限公司 | A kind of radiator structure |
| CN108990362B (en) * | 2017-06-02 | 2022-03-01 | 中兴通讯股份有限公司 | Heat radiation structure |
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| CN109561611A (en) * | 2017-09-25 | 2019-04-02 | 群光电能科技股份有限公司 | power supply with heat insulation function |
| CN109840238A (en) * | 2017-11-29 | 2019-06-04 | 北京搜狗科技发展有限公司 | A kind of mainboard and translator |
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
| CN109309064A (en) * | 2018-08-10 | 2019-02-05 | 北京嘉楠捷思信息技术有限公司 | Chip device, circuit board and digital currency mining machine |
| CN109561573A (en) * | 2018-12-04 | 2019-04-02 | 深圳众力新能源科技有限公司 | A kind of heat radiating type PCB circuit board structure |
| CN111641101A (en) * | 2019-03-01 | 2020-09-08 | 亿光电子工业股份有限公司 | Transmitting device, camera module and electronic equipment |
| CN112533450A (en) * | 2020-12-01 | 2021-03-19 | 苏州浪潮智能科技有限公司 | Power supply conversion device for printed circuit board |
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| CN114252964A (en) * | 2021-12-02 | 2022-03-29 | 昂纳信息技术（深圳）有限公司 | Chip heat dissipation device, chip module and electronic equipment |
| CN117219594A (en) * | 2023-10-19 | 2023-12-12 | 合肥惟新数控科技有限公司 | Heat radiation structure, surface-mounted power device with heat radiation structure and packaging method |
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Application publication date: 20110720 |