CN101500372B - Electronic appliance and heat radiation substrate - Google Patents
Electronic appliance and heat radiation substrate Download PDFInfo
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- CN101500372B CN101500372B CN2009101052394A CN200910105239A CN101500372B CN 101500372 B CN101500372 B CN 101500372B CN 2009101052394 A CN2009101052394 A CN 2009101052394A CN 200910105239 A CN200910105239 A CN 200910105239A CN 101500372 B CN101500372 B CN 101500372B
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Abstract
The invention discloses an electronic apparatus and a heat radiation substrate thereof. The electronic apparatus comprises laminated PCB (printed circuit board) and the heat radiation substrate. Part of the PCB region is provided with a heat source, the heat radiation substrate at least comprises a first heat radiation region and a second heat radiation region which are connected with each other, the heat radiation property of the first heat radiation region is better than that of the second heat radiation region, the first heat radiation region corresponds to the heat source on the PCB and is larger than that of the heat source on the PCB. The invention can basically ensure the heat radiation effect and simultaneously and effectively reduce the cost.
Description
Technical field
The present invention relates to a kind of electronic equipment and heat-radiating substrate thereof.
Background technology
The prior art electronic equipment generally comprises the PCB circuit board, behind thermals source such as utilizing high power electronic component, need a heat radiating metal substrate be set at the back side that pcb board is installed electronic devices and components, and described large power, electrically sub-element is dispelled the heat.
Consulting Fig. 1, is the schematic cross-section that a kind of pcb board of prior art combines with the heat radiating metal substrate.Described pcb board 110 1 mounted on surface have various electronic devices and components, comprise high-power components 111, such as power amplifier.Described heat radiating metal substrate 120 whole a kind of material form.Comprise also that between pcb board 110 and heat radiating metal substrate 120 one deck is used for above-mentioned two plates are carried out bonding PP material or scolding tin 130.When described electronic component is worked, the heat that described high-power components 111 sends arrives heat radiating metal substrate 120 by PP material or scolding tin 130 etc., fast in metal substrate 120 diffusions, diffuse in the air by modes such as heat conduction, radiation, convection current more at last immediately.
On the one hand, because metal substrate 120 all adopts a kind of material, such as copper product, price is generally relatively costly, therefore prior art heat radiating metal substrate cost is also higher, causes using the electronic equipment cost of heat radiating metal substrate also high, particularly adopts under the bigger heat radiating metal substrate situation of area; And owing to adopt a kind of metal material, such as copper, its density is higher relatively, therefore uses the electronic equipment weight of heat radiating metal substrate also heavy, increases cost of transportation and use.On the other hand, thermal source in the electronic equipment on the pcb board is not all to gather on whole PCB, thermal source only occupies the fraction area of PCB under most of situation, for above-mentioned situation, prior art still adopts the mode that monoblock heat radiating metal substrate is cooperated PCB, though radiating effect can guarantee, also causes certain wasting of resources.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of electronic equipment and heat-radiating substrate thereof, when guaranteeing that described heat-radiating substrate possesses certain radiating effect, can significantly reduce cost.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of electronic equipment is provided, described electronic equipment comprises stacked PCB and heat-radiating substrate, described PCB subregion is provided with thermal source, described heat-radiating substrate comprises first heat dissipation region and second heat dissipation region of connection at least, the heat dispersion of described first heat dissipation region is better than described second heat dissipation region, and described first heat dissipation region is corresponding to the thermal source on the described PCB, and area is greater than the area of described thermal source on PCB.
Described first heat dissipation region is the copper radiator structure, and described second heat dissipation region is the aluminium radiator structure, and described first heat dissipation region is rectangle, and described second heat dissipation region comprises two parts, lays respectively at the both sides of described first heat dissipation region.
In the more excellent execution mode, described second heat dissipation region that is positioned at first heat dissipation region, one side comprises at least two, and arranges along a side of described first heat dissipation region, is provided with the slit between described at least two.
In the more excellent execution mode, described second heat dissipation region is surrounded described first heat dissipation region.
In the more excellent execution mode, has positioning through hole on the described heat-radiating substrate.
For solving the problems of the technologies described above, another technical solution used in the present invention is: the heat-radiating substrate that a kind of PCB of being applied to is provided, described heat-radiating substrate comprises first heat dissipation region and second heat dissipation region of connection at least, the heat dispersion of described first heat dissipation region is better than described second heat dissipation region, and described first heat dissipation region is corresponding to the thermal source on the described PCB.
Described first heat dissipation region is the copper radiator structure, and described second heat dissipation region is the aluminium radiator structure, and described first heat dissipation region is rectangle, and described second heat dissipation region comprises two parts, lays respectively at the both sides of described first heat dissipation region.
In the more excellent execution mode, described second heat dissipation region that is positioned at first heat dissipation region, one side comprises at least two, and arranges along a side of described first heat dissipation region, is provided with the slit between described at least two.
The invention has the beneficial effects as follows: be different from prior art and be applied to the heat radiating metal substrate whole employing copper product of PCB and cause the cost height, the technical problem of the wasting of resources, the present invention is divided into two heat dissipation region at least with heat-radiating substrate, and the heat dispersion difference of described at least two heat dissipation region, the heat dissipation region of good heat dispersion performance is corresponding to the thermal source setting on the described PCB, like this, the thermal source that needs most heat radiation on the PCB has the heat dissipation region of corresponding good heat dispersion performance to carry out good heat radiating, and the hot-fluid of this heat dissipation region of process is when disperse at the four sides, also can under the not obvious situation that influences the integral heat sink performance, disperse, can reduce material cost to other lower heat dissipation region conduction of heat dispersion.On concrete, the more excellent heat dissipation region of the heat dispersion that corresponding thermal source is provided with on the one hand itself can quick heat radiating, and heat is diffused in the air by modes such as radiation, convection current; Be the quick conduction pathway of hot-fluid that serves as thermal source and other heat dissipation region on the other hand, can give other heat dissipation region with the rapid conduction of hot-fluid of thermal source by the more excellent heat dispersion of utilization itself, solve thermal source to heat conducting bottleneck problem between the heat-radiating substrate, and, hot-fluid is during from other heat dissipation region conduction towards periphery of the more excellent heat dissipation region of performance, hot-fluid is disperseed, simultaneously hot-fluid also consumes in the more excellent heat dissipation region conductive process of performance gradually, therefore can obviously do not hindered the conductive process of hot-fluid between above-mentioned two heat dissipation region, and the hot-fluid that arrives the lower heat dissipation region of performance also can fully be exhaled by this zone, so the heat-radiating substrate of the present invention that adopts different materials to make can be guaranteed on heat dispersion generally, and material cost can effectively reduce.
Description of drawings
Fig. 1 is the schematic cross-section that the prior art pcb board combines with the heat radiating metal substrate;
Fig. 2 is the schematic cross-section that pcb board combines with heat-radiating substrate in electronic equipment first execution mode of the present invention;
Fig. 3 is the floor map of heat-radiating substrate among Fig. 2;
Fig. 4 is the floor map of heat-radiating substrate second execution mode of the present invention;
Fig. 5 is the floor map of heat-radiating substrate the 3rd execution mode of the present invention;
Fig. 6 is the floor map of heat-radiating substrate the 4th execution mode of the present invention;
Fig. 7 is the floor map of heat-radiating substrate the 5th execution mode of the present invention.
Embodiment
Please refer to Fig. 1, is the schematic diagram of electronic equipment first execution mode of the present invention.Described electronic equipment comprises stacked PCB 210 and heat-radiating substrate 220.Described PCB 210 subregions are provided with thermal source 211.Described heat-radiating substrate 220 comprises first heat dissipation region 221 and second heat dissipation region 222 of connection.The heat dispersion of described first heat dissipation region 221 is better than described second heat dissipation region 222.Described first heat dissipation region 221 is corresponding to the thermal source 211 on the described PCB 210, and area is greater than the area of described thermal source 211 on PCB 210.Fixing between described PCB 210 and the heat-radiating substrate 220 by PP or solder(ing) paste 230.
The invention described above execution mode is divided into the different zone of two heat dispersions with heat-radiating substrate 220, and the heat dissipation region of good heat dispersion performance is provided with corresponding to the thermal source on the described PCB 210 211, like this, the thermal source 211 that needs most heat radiation on the PCB 210 has the heat dissipation region of corresponding good heat dispersion performance to carry out good heat radiating, and the hot-fluid of this heat dissipation region of process is when disperse at the four sides, also can under the not obvious situation that influences the integral heat sink performance, disperse, can reduce material cost to other lower heat dissipation region conduction of heat dispersion.
On concrete, the more excellent heat dissipation region of the heat dispersion that corresponding thermal source 211 is provided with on the one hand itself can quick heat radiating, and heat is diffused in the air by modes such as conduct radiation, convection current; Be the quick conduction pathway of hot-fluid that serves as thermal source 211 and other heat dissipation region on the other hand, can give other heat dissipation region with the rapid conduction of hot-fluid of thermal source 211 by the more excellent heat dispersion of utilization itself, solve thermal source 211 to heat conducting bottleneck problem between the heat-radiating substrate 220, and, hot-fluid is during from other heat dissipation region conduction towards periphery of the more excellent heat dissipation region of performance, hot-fluid is disperseed, simultaneously hot-fluid also consumes in the more excellent heat dissipation region conductive process of performance gradually, therefore can obviously do not hindered the conductive process of hot-fluid between above-mentioned two heat dissipation region and influenced integral heat sink, and the hot-fluid that arrives the lower heat dissipation region of performance also can fully be exhaled by this zone, so the heat-radiating substrate of the present invention 220 that adopts different materials to make can be guaranteed on heat dispersion generally, and material cost can effectively reduce.
In addition, described first heat dissipation region, 221 areas can be dispersed by more effective heat to thermal source 211 greater than the area of described thermal source 211 on PCB 210, better guarantee the radiating effect of heat-radiating substrate 220.Wherein, thermal source 211 is heater elements, such as power amplifier, heating load etc.
In more excellent execution mode, described first heat dissipation region 221 is copper radiator structures.Certainly, also can be other metals or the nonmetallic materials that comprise copper, aluminium etc.And described second heat dissipation region 222 is aluminium radiator structures, certainly, also can be metal such as iron or the lower material of heat dispersion such as nonmetal.
Consult Fig. 3, described first heat dissipation region 221 can be a rectangle, and described second heat dissipation region 222 can comprise two parts, lays respectively at the both sides of described first heat dissipation region 221.First heat dissipation region 221 in the middle of being positioned at like this can be dispersed the hot-fluid from thermal source 211 the very not big integral heat sink performance that influences heat-radiating substrate 220 to second heat dissipation region 222 of both sides.Certainly, in other embodiments, first heat dissipation region 221 is not limited to rectangle; Described second heat dissipation region 222 is not limited to be divided into two parts, can be three parts, four parts etc., also be not limited to be positioned at the both sides of described first heat dissipation region 221, can be positioned at around described first heat dissipation region 221 or the inside, even can be with described first heat dissipation region 221 separately.
Consult Fig. 4, described second heat dissipation region 222 that is positioned at first heat dissipation region, 221 1 sides can comprise two, and arranges along a side of described first heat dissipation region 221, is provided with slit 223 at least between described two.The mode that second heat dissipation region 222 adopts piecemeal to arrange, can avoid when variations in temperature, first the heat dissipation region 221 and technical problem of heat-radiating substrate 220 bendings that cause different with second heat dissipation region, 222 thermal coefficient of expansions, make heat-radiating substrate 220 remain straight shape or be unlikely to overbending, and can well contact with PCB 210.Certainly, in other embodiments, second heat dissipation region 222 is not limited to be divided into two, can be divided into three, four or the like, nor is limited to the mode of arranging along a side of described first heat dissipation region 221.
Consult Fig. 5, have positioning through hole 224 on the described heat-radiating substrate 220.Described positioning through hole 224 is positioned at first heat dissipation region 221.Consult Fig. 6, described positioning through hole 224 can have a plurality of, and cross-distribution is at the edge of first heat dissipation region 221.Certainly, in other embodiments, described positioning through hole 224 also can be positioned at second heat dissipation region 222.
Consult Fig. 7, described second heat dissipation region 222 can be surrounded described first heat dissipation region 221.The hot-fluid that imports first heat dissipation region 221 like this can import described second heat dissipation region 222 from all quarter, plays preferable radiating effect.
Consult Fig. 2 again, the present invention also adopts another technical scheme to be: the heat-radiating substrate 220 that a kind of PCB210 of being applied to is provided, described heat-radiating substrate 220 comprises first heat dissipation region 221 and second heat dissipation region 222 of connection at least, the heat dispersion of described first heat dissipation region 221 is better than described second heat dissipation region 222, and described first heat dissipation region 221 is corresponding to the thermal source 211 on the described PCB 210.
Equally, when present embodiment can guarantee basic radiating effect, effectively reduce material cost.
Wherein, described first heat dissipation region 221 is copper radiator structures.Described second heat dissipation region 222 is aluminium radiator structures, and described first heat dissipation region 221 is rectangles, and described second heat dissipation region 222 comprises two parts, lays respectively at the both sides of described first heat dissipation region 221.
Described second heat dissipation region 222 that is positioned at first heat dissipation region, 221 1 sides comprises at least two, and arranges along a side of described first heat dissipation region 221, is provided with slit 223 (consulting Fig. 4) at least between described two.
Below row one embodiment:
For example heat-radiating substrate is of a size of: 12 (wide) * 29.5 (length) * 0.25 (thick) cm, and whole plate steel structure changes the local aluminum structural design into, promptly only adopts the copper product of original 1/3rd components, can obtain following effect at least:
1) weight reduces:
A, one-piece run weight of copper: 12 (wide) * 29.5 (length) * 0.25 (thick) * 8.9 (copper density)/1000=0.78765KG
B, local aluminum substitute back weight: (0.78765/3)+(8 * 29.5 * 0.25 * 2.7 (aluminium density)/1000)=0.26255+0.1593=0.42185KG
Final weight: the A-B=0.78765-0.42185=0.3658KG that reduces
2) cost reduces:
A, whole plate copper cost: 0.78765 * 30.025=23.65 unit
B, local aluminum substitute the whole price in back: (23.65/3)+(0.1593 * 12.39)=7.88+1.97=9.85 unit
Finally reduce cost: A-B=23.65-9.85=13.8 unit
This cost calculation is the benefit that single products produces, if more considerable by producing benefit in batches.
In addition, heat-radiating substrate is not limited to the design of two kinds of heat dissipation region, after can putting in order the plate design and changing multiple material (can be metal or nonmetallic materials such as copper, aluminium, iron) combination into, realizes combining with PCB 210 again.
Structure of heat dissipation substrate of the present invention can be any material, size, combination of shapes, basic principle is when guaranteeing that the heat-radiating substrate heat dispersion can satisfy actual needs substantially, effectively reduce material cost and product weight, and through after further making up, the combination cost can also be lower.
The area ratio of above-mentioned first heat dissipation region 221 and second heat dissipation region 222, at first to satisfy the device radiating requirements, design phase need be carried out analog simulation, to the product that processes also can subregion actual measurement device or PCB 210 temperature whether normally confirm, the qualified area ratio of just confirming final first heat dissipation region 221 and second heat dissipation region 222, the perhaps area ratio of a plurality of heat dissipation region and shape and structure thereof, can guarantee that like this heat-radiating substrate 220 satisfies the heat radiation requirement of PCB 210 substantially, and flexible Application can reduce material cost by maximum magnitude to various products.
The above only is the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (6)
1. an electronic equipment comprises PCB and heat-radiating substrate, and described PCB subregion is provided with thermal source, it is characterized in that:
Described heat-radiating substrate comprises first heat dissipation region and second heat dissipation region of connection at least,
The heat dispersion of described first heat dissipation region is better than described second heat dissipation region,
Described first heat dissipation region is corresponding to the thermal source on the described PCB, and area is greater than the area of described thermal source on PCB,
Described first heat dissipation region is the copper radiator structure, and described second heat dissipation region is the aluminium radiator structure, and described first heat dissipation region is rectangle, and described second heat dissipation region comprises two parts, lays respectively at the both sides of described first heat dissipation region.
2. electronic equipment according to claim 1 is characterized in that: described second heat dissipation region that is positioned at first heat dissipation region, one side comprises at least two, and arranges along a side of described first heat dissipation region, is provided with the slit between described at least two.
3. electronic equipment according to claim 1 is characterized in that: described second heat dissipation region is surrounded described first heat dissipation region.
4. according to each described electronic equipment of claim 1 to 3, it is characterized in that: have positioning through hole on the described heat-radiating substrate.
5. heat-radiating substrate that is applied to PCB is characterized in that:
Described heat-radiating substrate comprises first heat dissipation region and second heat dissipation region of connection at least,
The heat dispersion of described first heat dissipation region is better than described second heat dissipation region,
Described first heat dissipation region is corresponding to the thermal source on the described PCB,
Described first heat dissipation region is the copper radiator structure, and described second heat dissipation region is the aluminium radiator structure, and described first heat dissipation region is rectangle, and described second heat dissipation region comprises two parts, lays respectively at the both sides of described first heat dissipation region.
6. the heat-radiating substrate that is applied to PCB according to claim 5, it is characterized in that: described second heat dissipation region that is positioned at first heat dissipation region, one side comprises at least two, and arrange along a side of described first heat dissipation region, be provided with the slit between described at least two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101052394A CN101500372B (en) | 2009-01-21 | 2009-01-21 | Electronic appliance and heat radiation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101052394A CN101500372B (en) | 2009-01-21 | 2009-01-21 | Electronic appliance and heat radiation substrate |
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| Publication Number | Publication Date |
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| CN101500372A CN101500372A (en) | 2009-08-05 |
| CN101500372B true CN101500372B (en) | 2011-07-06 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112010004802T5 (en) * | 2010-01-26 | 2012-11-15 | Hewlett-Packard Development Company, L.P. | HEAT SINKS WITH SEVERAL STEAM CHAMBERS |
| WO2011096218A1 (en) | 2010-02-04 | 2011-08-11 | パナソニック株式会社 | Heat radiation device and electronic equipment using the same |
| KR101156903B1 (en) * | 2010-10-28 | 2012-06-21 | 삼성전기주식회사 | Thermal device for power converting module |
| KR102427092B1 (en) * | 2015-10-16 | 2022-08-01 | 삼성전자주식회사 | Semiconductor apparatus having marks for heat information |
| CN107949236B (en) * | 2017-10-27 | 2019-09-27 | 中国船舶重工集团公司第七二三研究所 | A kind of synthesis heat-exchanger rig based on conduction |
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2009
- 2009-01-21 CN CN2009101052394A patent/CN101500372B/en active Active
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518000 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee before: SHENZHEN SHENNAN CIRCUITS Co.,Ltd. |