CN203057683U - Circuit board radiating structure - Google Patents
Circuit board radiating structure Download PDFInfo
- Publication number
- CN203057683U CN203057683U CN 201320006742 CN201320006742U CN203057683U CN 203057683 U CN203057683 U CN 203057683U CN 201320006742 CN201320006742 CN 201320006742 CN 201320006742 U CN201320006742 U CN 201320006742U CN 203057683 U CN203057683 U CN 203057683U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper
- radiator structure
- copper foil
- power device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a circuit board radiating structure, and aims at solving the technical problem that the radiating effect is poor due to small size of the circuit board in the prior art. The circuit board radiating structure provided by the utility model is fixedly connected with a patch power device, and the circuit board radiating structure comprises a circuit board for bearing components, a copper foil surface inlaid in the circuit board, a copper foil pad which is arranged on the copper foil surface and used for fixing the patch power device, and a plurality of thermal conductors arranged on the copper foil surface. The circuit board radiating structure provided by the utility model increases the thermal conductivity and enlarges the radiating area by implementing the thermal design optimization measures to the copper foil surface and arranging the thermal conducting materials, increases the air circulation by arranging the radiating grooves, and effectively improves the radiating effect of the copper foil surface, thereby reducing the working temperature of patch power device on the circuit board.
Description
Technical field
The utility model relates to a kind of radiator structure.Relate in particular to a kind of circuit board radiator structure.
Background technology
Changing into along with panel TV set is ultra-thin and to be a kind of trend, make self-contained circuit board also need develop towards ultra-thin direction, therefore need a large amount of SMT(Surface of employing Mounted Technology, surface mounting technology) technology makes circuit board.Adopting SMT technology to make circuit board has device cost low, production automation degree advantages of higher, but usually only utilize the Copper Foil that is connected with its pad to dispel the heat for the SMT power device on the plate because of plug-in fin difficulty, be subjected to the restriction of circuit board size, copper-clad surface often can not be done very greatly, making radiating effect be restricted, is a challenge so how to improve radiating effect at unit circuit plate copper-clad surface.
The utility model content
The utility model provides a kind of circuit board radiator structure, is intended to solve in the prior art because the circuit board size causes the technical problem of radiating effect difference for a short time.In order to solve the problems of the technologies described above, the utility model adopts following scheme to be achieved:
A kind of circuit board radiator structure, fixedly connected with the paster power device, it is characterized in that, described circuit board radiator structure comprises: the circuit board that is used for the carrying components and parts, be embedded in the copper-clad surface in the described circuit board, be located at copper-clad surface surface and be used for the Copper Foil pad of fixing described paster power device, and some naked copper wide bank bars of being located at the copper-clad surface surface.
Further, described paster power device is connected with described Copper Foil pad by welding manner.
Further, described some naked copper wide bank bars are interconnected or are separated from each other.
Further, be covered with some conduction materials on described some naked copper wide bank bars.
Preferably, described conduction material is scolding tin.
Further, have at least one to be connected with described Copper Foil pad in the described naked copper wide bank bar.
Further, the area of described copper-clad surface is less than the area of circuit board, on circuit board, copper-clad surface around be provided with some radiating grooves.
Preferably, described radiating groove can be strip, circle, ellipse.
Preferably, described copper-clad surface, Copper Foil pad and some naked copper wide bank bars all are located at the back side of described circuit board.
The circuit board radiator structure that the utility model provides, the Thermal Design of Electronic Equipments theory is applied on the single-side coated copper plate paster power device, by being implemented thermal design, copper-clad surface optimizes measure, conduction material is set have been strengthened heat conductivility, has increased area of dissipation, radiating groove is set has increased circulation of air, improve the radiating effect of copper-clad surface effectively, thereby reduced the power paster device working temperature on this circuit board.
Description of drawings
Fig. 1 is the structural representation of the circuit board radiator structure that provides of the utility model one embodiment;
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
The detailed description embodiment is as follows:
With reference to Fig. 1, the structural representation of the circuit board radiator structure 10 that Fig. 1 the utility model one embodiment provides.Among the utility model embodiment, a kind of circuit board radiator structure 10 is provided, fixedly connected with paster power device 1, circuit board radiator structure 10 also comprises: the circuit board 6 that is used for the carrying components and parts, be embedded in the copper-clad surface 3 in the circuit board 6, be located at copper-clad surface 3 surfaces and be used for the fixedly Copper Foil pad 2 of paster power device 1, and some naked copper wide bank bars 4 of being located at copper-clad surface 3 surfaces.
Paster power device 1 generally is connected with described Copper Foil pad 2 by welding manner.
For protective circuit plate 6; non-weld can apply insulating varnish on circuit board 6; therefore when the design circuit plate, need reserve some naked copper wide bank bars 4 that do not apply insulating varnish on the copper-clad surface surface, described some naked copper wide bank bars are interconnected or are separated from each other.
Among another embodiment of the utility model, conduction material is connected with Copper Foil pad 2, and then paster power device 1 just directly is connected with conduction material, is conducive to heat radiation.
In the board production process, the naked copper wide bank bar that is not insulated the lacquer covering can be covered with the conduction material (not shown).Among the utility model one embodiment, the material of conduction material is scolding tin, can directly be plated on some naked copper wide bank bars of reservation by craft or machine.Among one embodiment, the area of copper-clad surface 3 is less than the area of circuit board 6, on circuit board 6, copper-clad surface 3 around be provided with some radiating grooves 5, described radiating groove 5 can be strip, circle, ellipse.Around copper-clad surface 3, offer radiating groove, can increase ventilation quantity, be conducive to heat radiation.
In a preferred embodiment, copper-clad surface 3, Copper Foil pad 2 and some naked copper wide bank bars 4 all are located at the back side of described circuit board.
The circuit board radiator structure that the utility model provides, by being implemented thermal design, copper-clad surface optimizes measure, conduction material is set have been strengthened heat conductivility, has increased area of dissipation, radiating groove is set has increased circulation of air, improve the radiating effect of copper-clad surface effectively, thereby reduced the power paster device working temperature on this circuit board.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (9)
1. circuit board radiator structure, fixedly connected with the paster power device, it is characterized in that, described circuit board radiator structure comprises: the circuit board that is used for the carrying components and parts, be embedded in the copper-clad surface in the described circuit board, be located at copper-clad surface surface and be used for the Copper Foil pad of fixing described paster power device, and some naked copper wide bank bars of being located at the copper-clad surface surface.
2. circuit board radiator structure as claimed in claim 1 is characterized in that, described paster power device is connected with described Copper Foil pad by welding manner.
3. circuit board radiator structure as claimed in claim 1 is characterized in that, described some naked copper wide bank bars are interconnected or are separated from each other.
4. circuit board radiator structure as claimed in claim 3 is characterized in that, is covered with some conduction materials on described some naked copper wide bank bars.
5. circuit board radiator structure as claimed in claim 4 is characterized in that, described conduction material is scolding tin.
6. circuit board radiator structure as claimed in claim 1 is characterized in that, has at least one to be connected with described Copper Foil pad in the described naked copper wide bank bar.
7. circuit board radiator structure as claimed in claim 1 is characterized in that, the area of described copper-clad surface is less than the area of circuit board, on circuit board, copper-clad surface around be provided with some radiating grooves.
8. circuit board radiator structure as claimed in claim 6 is characterized in that, described radiating groove can be strip, circle, ellipse.
9. circuit board radiator structure as claimed in claim 1 is characterized in that, described copper-clad surface, Copper Foil pad and some naked copper wide bank bars all are located at the back side of described circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320006742 CN203057683U (en) | 2013-01-07 | 2013-01-07 | Circuit board radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320006742 CN203057683U (en) | 2013-01-07 | 2013-01-07 | Circuit board radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203057683U true CN203057683U (en) | 2013-07-10 |
Family
ID=48740593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320006742 Expired - Fee Related CN203057683U (en) | 2013-01-07 | 2013-01-07 | Circuit board radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203057683U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107343353A (en) * | 2016-05-03 | 2017-11-10 | 无锡深南电路有限公司 | A kind of thick copper pcb board and its radiating processing method |
| WO2020061920A1 (en) * | 2018-09-27 | 2020-04-02 | 西门子（中国）有限公司 | Circuit board heat dissipation system, circuit board and robot joint |
-
2013
- 2013-01-07 CN CN 201320006742 patent/CN203057683U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107343353A (en) * | 2016-05-03 | 2017-11-10 | 无锡深南电路有限公司 | A kind of thick copper pcb board and its radiating processing method |
| WO2020061920A1 (en) * | 2018-09-27 | 2020-04-02 | 西门子（中国）有限公司 | Circuit board heat dissipation system, circuit board and robot joint |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203057683U (en) | Circuit board radiating structure | |
| CN204733519U (en) | A kind of electronic installation | |
| CN202121492U (en) | Power source and power source casing thereof | |
| CN204836781U (en) | Four layers PCB board subassembly in material saving and space | |
| CN103747610A (en) | PCB thermal pad | |
| CN204204837U (en) | A kind of chip cooling structure | |
| CN205283932U (en) | Heat dissipating PCB | |
| CN203040009U (en) | High heat conducting circuit board | |
| CN202551494U (en) | High heat conductivity PCB (Printed Circuit Board) metal substrate | |
| CN203788546U (en) | Heat dissipating PCB | |
| CN204585969U (en) | A kind of good copper-clad plate of dispelling the heat | |
| CN205305020U (en) | Take many meshes camera of heat radiation structure | |
| CN201174855Y (en) | Radiator assembly | |
| CN201995275U (en) | Electronic product and radiator thereof | |
| CN202153613U (en) | Mother board used for low-voltage power distribution cabinet | |
| CN205249683U (en) | Inlay copper heat sink component | |
| CN203708741U (en) | Fan controller | |
| CN203416498U (en) | Circuit board convenient for heat radiation | |
| CN204481721U (en) | A kind of electronic controller controlled for brushless electric machine | |
| CN204810680U (en) | Novel electricity daughter board | |
| CN204046923U (en) | Heat radiation pcb board | |
| CN203120370U (en) | Heat dissipation structure of model airplane motor controller | |
| CN202103994U (en) | Heat dissipation assembly structure | |
| CN203775516U (en) | PCB with implantable heat dissipation copper block | |
| CN203482488U (en) | Circuit board with good thermal conductivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130710 Termination date: 20150107 |
|
| EXPY | Termination of patent right or utility model |