CN204046923U - Heat radiation pcb board - Google Patents
Heat radiation pcb board Download PDFInfo
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- CN204046923U CN204046923U CN201420467532.1U CN201420467532U CN204046923U CN 204046923 U CN204046923 U CN 204046923U CN 201420467532 U CN201420467532 U CN 201420467532U CN 204046923 U CN204046923 U CN 204046923U
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- heat dissipating
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Abstract
The utility model relates to technical field of electronic components, especially a kind of heat radiation pcb board.It comprises substrate, installing hole, conductive layer, insulating barrier and heat dissipating layer, installing hole is distributed in the surrounding of substrate, conductive layer, insulating barrier and heat dissipating layer are sequentially arranged in the upper, middle and lower of substrate, are provided with radiating core in substrate, and the bottom of heat dissipating layer is provided with heat radiation hole.The radiating core be made up of core branch, core bar and core root is set in substrate, core branch and core root are embedded in insulating barrier and heat dissipating layer respectively, both the steadiness of insulating barrier and heat dissipating layer combination can have been improved, again by the heat in the abundant absorbent insulation layer of core branch, directly heat is diffused to quickly and evenly each corner of heat dissipating layer, raising speed, the heat radiation hole be arranged on bottom heat dissipating layer is positioned at immediately below core root, both area of dissipation was added, shorten again the distance that heat leaks, improve radiating effect further.
Description
Technical field
The utility model relates to technical field of electronic components, especially a kind of heat radiation pcb board.
Background technology
PCB(Printed Circuit Board), Chinese is printed circuit board, and also known as printed circuit board (PCB), printed substrate, being important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.In prior art, pcb board is widely used, and well-known electronic component can produce heat in the course of the work, so the thermal diffusivity of pcb board is an important index.Existing pcb board dispels the heat mainly through the heat dissipating layer of bottom; and heat dissipating layer is mostly be made up of the homogenous material such as aluminium sheet, pottery; the lateral thermal conductivity of these materials can be poor; this often causes the heat dissipating layer temperature of corresponding region immediately below components and parts high; but this extra-regional temperature is low; when particularly multiple components and parts are with array distribution, therefore the heat of those middle several components and parts often can cannot well come out, and causes components and parts cisco unity malfunction.
Utility model content
Single in order to overcome existing pcb board radiator structure, inefficiency, affects the deficiency of the normal work of components and parts, and the utility model provides a kind of heat radiation pcb board.
The utility model solves the technical scheme that its technical problem adopts: a kind of heat radiation pcb board, comprise substrate, installing hole, conductive layer, insulating barrier and heat dissipating layer, installing hole is distributed in the surrounding of substrate, conductive layer, insulating barrier and heat dissipating layer are sequentially arranged in the upper, middle and lower of substrate, be provided with radiating core in substrate, the bottom of heat dissipating layer is provided with heat radiation hole.
According to another embodiment of the present utility model, the material comprising radiating core is further copper, in tree-shaped, is made up of core branch, core bar and core root.
According to another embodiment of the present utility model, comprise core branch further and core root is all umbrella, be symmetrically distributed in the two ends up and down of core bar.
According to another embodiment of the present utility model, comprise core branch further and core root is embedded in insulating barrier and heat dissipating layer respectively.
According to another embodiment of the present utility model, comprise heat radiation hole further and be positioned at immediately below core root.
The beneficial effects of the utility model are, copper tree-shaped radiating core is set in substrate, radiating core is by core branch, core bar and core root composition, core branch and core root are distributed in the two ends up and down of core bar, be embedded in insulating barrier and heat dissipating layer respectively, both the steadiness of insulating barrier and heat dissipating layer combination can have been improved, again by the heat in the abundant absorbent insulation layer of core branch, core root is passed to by core bar, again to act as a go-between, heat is directly diffused to each corner of heat dissipating layer by the mode of linear transmission quickly and evenly, raising speed, the heat radiation hole be arranged on bottom heat dissipating layer is positioned at immediately below core root, both area of dissipation was added, shorten again the distance that heat leaks, further raising radiating effect.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model.
1. substrates, 2. installing hole, 3. conductive layer, 4. insulating barrier, 5. heat dissipating layer, 6. radiating core in figure, 61. core branches, 62. core bars, 63. core roots, 7. heat radiation hole.
body execution mode
If Fig. 1 is structural representation of the present utility model, a kind of heat radiation pcb board, comprise substrate 1, installing hole 2, conductive layer 3, insulating barrier 4 and heat dissipating layer 5, installing hole 2 is distributed in the surrounding of substrate 1, conductive layer 3, insulating barrier 4 and heat dissipating layer 5 are sequentially arranged in the upper, middle and lower of substrate 1, be provided with radiating core 6 in substrate 1, the bottom of heat dissipating layer 5 is provided with heat radiation hole 7.The material of radiating core 6 is copper, in tree-shaped, is made up of core branch 61, core bar 62 and core root 63.Core branch 61 and core root 63 are all umbrella, are symmetrically distributed in the two ends up and down of core bar 62.Core branch 61 and core root 63 are embedded in insulating barrier 4 and heat dissipating layer 5 respectively.Heat radiation hole 7 is positioned at immediately below core root 63.
Copper tree-shaped radiating core 6 is set in substrate 1, radiating core 6 is by core branch 61, core bar 62 and core root 63 form, core branch 61 and core root 63 are distributed in the two ends up and down of core bar 62, be embedded in insulating barrier 4 and heat dissipating layer 5 respectively, both the steadiness of insulating barrier 4 and heat dissipating layer 5 combination can have been improved, again by core branch 61 fully absorbent insulation layer 4 heat, core root 63 is passed to by core bar 62, again to act as a go-between, heat is directly diffused to each corner of heat dissipating layer 5 by the mode of linear transmission quickly and evenly, raising speed, the heat radiation hole 7 be arranged on bottom heat dissipating layer 5 is positioned at immediately below core root 63, both area of dissipation was added, shorten again the distance that heat leaks, further raising radiating effect.
Claims (5)
1. a heat radiation pcb board, comprise substrate (1), installing hole (2), conductive layer (3), insulating barrier (4) and heat dissipating layer (5), installing hole (2) is distributed in the surrounding of substrate (1), conductive layer (3), insulating barrier (4) and heat dissipating layer (5) are sequentially arranged in the upper, middle and lower of substrate (1), it is characterized in that: be provided with radiating core (6) in substrate (1), the bottom of heat dissipating layer (5) is provided with heat radiation hole (7).
2. heat radiation pcb board according to claim 1, is characterized in that: the material of radiating core (6) is copper, in tree-shaped, is made up of core branch (61), core bar (62) and core root (63).
3. heat radiation pcb board according to claim 1, is characterized in that: core branch (61) and core root (63) are all umbrella, are symmetrically distributed in the two ends up and down of core bar (62).
4. heat radiation pcb board according to claim 1, is characterized in that: core branch (61) and core root (63) are embedded in insulating barrier (4) and heat dissipating layer (5) respectively.
5. heat radiation pcb board according to claim 1, is characterized in that: heat radiation hole (7) is positioned at immediately below core root (63).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420467532.1U CN204046923U (en) | 2014-08-19 | 2014-08-19 | Heat radiation pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420467532.1U CN204046923U (en) | 2014-08-19 | 2014-08-19 | Heat radiation pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204046923U true CN204046923U (en) | 2014-12-24 |
Family
ID=52247540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420467532.1U Active CN204046923U (en) | 2014-08-19 | 2014-08-19 | Heat radiation pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204046923U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102327A (en) * | 2016-08-12 | 2016-11-09 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glued membrane |
-
2014
- 2014-08-19 CN CN201420467532.1U patent/CN204046923U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102327A (en) * | 2016-08-12 | 2016-11-09 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glued membrane |
| CN106102327B (en) * | 2016-08-12 | 2019-01-01 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glue film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |