CN205142648U - Heat conduction base plate of device and device that generates heat generate heat - Google Patents
Heat conduction base plate of device and device that generates heat generate heat Download PDFInfo
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- CN205142648U CN205142648U CN201520751618.1U CN201520751618U CN205142648U CN 205142648 U CN205142648 U CN 205142648U CN 201520751618 U CN201520751618 U CN 201520751618U CN 205142648 U CN205142648 U CN 205142648U
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- heat
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Abstract
The utility model discloses a heat conduction base plate of device and device that generates heat generate heat, this heat conduction base plate is including the base plate layer, first insulation heat -conducting layer, first circuit layer, the 2nd insulating heat transfer layer and the second circuit layer that from bottom to top set gradually to run through the via hole on first circuit layer, the 2nd insulating heat transfer layer and second circuit layer, provide two heat dissipation path from structural device that generates heat for its setting. Wherein, article one route does, and the heat passes through second circuit layer, the 2nd insulating heat transfer layer and first circuit layer and transmits in proper order to the base plate layer, the second route does, and the direct transmission of via hole that the heat runs through on through second circuit layer, the 2nd insulating heat transfer layer and first circuit layer is transmitted to the base plate layer to an insulating heat transfer layer again. Compare in traditional heat conduction base plate, its heat conductivility is more excellent, and electric current bearing capacity is also higher.
Description
Technical field
The utility model relates to field of power electronics, particularly a kind of heat-conducting substrate of heater members and electro-heat equipment.
Background technology
Along with the power of heater members is increasing, its heat distributed is also increasing, the electric current causing it to carry can not reach industrial requirements, and high-power heater members is widely used in Aero-Space, military equistability can require high field, if radiating effect is bad, may cause heater members scaling loss, complete machine stops repairing, and even causes larger security incident.So field of power electronics requires more and more higher to the heat conductivility of heater members heat-conducting substrate.
At present, for improving the heat conductivility of heat-conducting substrate, be generally start with from the material of its composition structure.Heat-conducting substrate of the prior art at least comprises one deck circuit layer, one deck thermal insulation layer and one deck substrate layer, conductive coefficient is generally adopted to be the copper of 401W/m*K for improving its heat conductivility, conductive coefficient is that the aluminium of 237W/m*K is as substrate layer, employing conductive coefficient is the insulating heat-conductive PP of 3W/m*K, these are all the good conductors of heat, but it is expensive, cost is high and procurement cycle is long, a difficult problem for the manufacturer that cost control is strict, and for high-power heater members, start with can not meet cooling requirements completely from material simply.So the heat conductivility how improving heat-conducting substrate is further this field major issue urgently to be resolved hurrily.
Utility model content
In view of this, the utility model proposes a kind of heat-conducting substrate of heater members and the electro-heat equipment of this heat-conducting substrate is set, to solve the problem improving heat-conducting substrate heat conductivility how further.
The heat-conducting substrate of the utility model heater members, comprise the substrate layer, the first thermal insulation layer, the first circuit layer, the second thermal insulation layer and the second circuit layer that from bottom to top set gradually, described first circuit layer, described second thermal insulation layer and described second circuit layer run through via hole.
Further, described heat-conducting substrate, also comprises via hole heat-conducting layer, and described via hole heat-conducting layer is embedded in described via hole.
Further, the material of described via hole heat-conducting layer is specially copper.
Further, the material of described second thermal insulation layer is FR-4.
Further, the material of described second thermal insulation layer is insulating heat-conductive PP.
Further, the material of described first circuit layer is specially Copper Foil.
Further, the material of described second circuit layer is specially Copper Foil
Further, described substrate layer is specially any one of aluminium base, silicon substrate, copper base, silicon substrate, glass-fiber-plate or ceramic substrate.
The present invention also provides a kind of electro-heat equipment, the above-mentioned any heat-conducting substrate under comprising heater members and being arranged on described heater members.
Preferably, described heater members is LED.
The utility model provides heat-conducting substrate and the electro-heat equipment of heater members, and the heat that heater members produces is passed to external substrate layer by two paths.Wherein, Article 1 path is, is passed to substrate layer successively by second circuit layer, the second thermal insulation layer and the first circuit layer; Article 2 path is, is directly passed to the first thermal insulation layer, then is passed to substrate layer by the via hole that second circuit layer, the second thermal insulation layer and the first circuit layer run through.Compared to the heat-conducting substrate that conventional method makes, it by running through via hole on the first circuit layer, the second thermal insulation layer and second circuit layer, from structure for heater members has opened a new heat dissipation path, owing to running through via hole, increase manufacturing cost hardly, so both control manufacturing cost, the heat conductivility of heat-conducting substrate can be improved again further, and then improve current carrying capacity.
Accompanying drawing explanation
The accompanying drawing forming a part of the present utility model is used to provide further understanding of the present utility model, and schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is the structural representation of an embodiment of the heat-conducting substrate of the utility model heater members;
Fig. 2 is the structural representation of a preferred embodiment of the heat-conducting substrate of the utility model heater members.
Description of reference numerals
10 substrate layers
20 first thermal insulation layers
30 first circuit layers
40 second thermal insulation layers
50 second circuit layers
60 via holes
70 via hole heat-conducting layers
100 heater members
Embodiment
It should be noted that, when not conflicting, the embodiment in the utility model and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the utility model in detail in conjunction with the embodiments.
As shown in Figure 1, show an embodiment of the present utility model, a kind of heat-conducting substrate of heater members, comprise substrate layer 10, first thermal insulation layer 20, first circuit layer 30, second thermal insulation layer 40 and second circuit layer 50 that from bottom to top set gradually, and run through via hole 60 on the first circuit layer 30, second thermal insulation layer 40 and second circuit layer 50.
Available solder on the heat-conducting substrate of this embodiment, the mode such as to inlay arrange heater members 100, are applied in the encapsulating structures such as LED.The heat that the heater members 100 that it is arranged produces is passed to external substrate layer 10 by two paths.Wherein, Article 1 path is, heat is passed to substrate layer 10 successively by second circuit layer 50, second thermal insulation layer 40 and the first circuit layer 30; Article 2 path is, heat is directly passed to the first thermal insulation layer 20 by the via hole 60 that second circuit layer 50, second thermal insulation layer 40 and the first circuit layer 30 run through, then is passed to substrate layer 10.Compared to traditional heat-conducting substrate, it by running through via hole 60 on the first circuit layer 30, second thermal insulation layer 40 and second circuit layer 50, be that heater members 100 has opened a new heat dissipation path from structure, owing to running through via hole, increase manufacturing cost hardly, so both control manufacturing cost, the heat conductivility of heat-conducting substrate can be improved again further, and then improve its current carrying capacity.
Preferably, as shown in Figure 2, heat-conducting substrate, also comprises via hole heat-conducting layer 70, is embedded in via hole 60.
In the preferred embodiment, heat-conducting substrate also comprises the via hole heat-conducting layer 70 be embedded in via hole 60, the heat that heater members 100 produces also is passed to the first thermal insulation layer 20 by this via hole heat-conducting layer 70, then is passed to substrate layer 10, so can improve the heat conductivility of heat-conducting substrate further.
Preferably, the material of this via hole heat-conducting layer, optional but be not limited only to copper, the material of any high thermal conductivity.
In the preferred embodiment, the material selection conductive coefficient of via hole heat-conducting layer 70 is the copper of 401W/m*K, is a kind of high thermal conductivity material, can further improve the heat transfer efficiency of via hole, and then improves the heat conductivility of heat-conducting substrate.
Preferably, the material of the second thermal insulation layer 40 is FR-4.
In the preferred embodiment, select cheap, general, that procurement cycle is short FR-4 material, the production cost of heat-conducting substrate can be reduced further.Although the conductive coefficient of FR4 is only 0.2W/m*K, heat conductivility is not high, but due to the architecture advances of this heat-conducting substrate, for heater members 100 provides more heat dissipation path, so adopt FR-4 as the second thermal insulation layer, the industrial requirements of middle low power heater members should can be met.
Preferably, the material of the second thermal insulation layer 40 is insulating heat-conductive PP.
In the preferred embodiment, select conductive coefficient to be the insulating heat-conductive PP of 3W/m*K, be a kind of good conductor of heat, can further improve the heat conductivility of heat-conducting substrate, adapt to the industrial requirements of high-power heater members.
Optionally, the material of the first circuit layer is specially Copper Foil.
Optionally, the material of second circuit layer is specially Copper Foil.
Optionally, substrate layer 10 is specially any one of aluminium base, silicon substrate, copper base, silicon substrate, glass-fiber-plate or ceramic substrate.
Optionally, the first thermal insulation layer 20, second thermal insulation layer 40 also can be epoxy resin, vistanex, polyimide resin, polyphenylene oxide resin etc.
The utility model also provides a kind of electro-heat equipment, the above-mentioned arbitrary heat-conducting substrate under comprising heater members and being arranged on this heater members.
In this embodiment, the heater members of electro-heat equipment, is arranged on above-mentioned arbitrary heat-conducting substrate, and it, by least two heat dissipation path heat radiations, has better radiating effect.Preferably, this heater members can be LED.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (10)
1. the heat-conducting substrate of a heater members, it is characterized in that, comprise the substrate layer, the first thermal insulation layer, the first circuit layer, the second thermal insulation layer and the second circuit layer that from bottom to top set gradually, described first circuit layer, described second thermal insulation layer and described second circuit layer run through via hole.
2. heat-conducting substrate according to claim 1, is characterized in that, also comprises via hole heat-conducting layer, and described via hole heat-conducting layer is embedded in described via hole.
3. heat-conducting substrate according to claim 2, is characterized in that, the material of described via hole heat-conducting layer is specially copper.
4. the heat-conducting substrate according to claim 1-3 any one, is characterized in that, the material of described second thermal insulation layer is FR-4.
5. the heat-conducting substrate according to claim 1-3 any one, is characterized in that, the material of described second thermal insulation layer is insulating heat-conductive PP.
6. the heat-conducting substrate according to claim 1-3 any one, is characterized in that, the material of described first circuit layer is specially Copper Foil.
7. the heat-conducting substrate according to claim 1-3 any one, is characterized in that, the material of described second circuit layer is specially Copper Foil.
8. the heat-conducting substrate according to claim 1-3 any one, is characterized in that, described substrate layer is specially any one of aluminium base, silicon substrate, copper base, silicon substrate, glass-fiber-plate or ceramic substrate.
9. an electro-heat equipment, is characterized in that, the heat-conducting substrate described in claim 1-8 any one under comprising heater members and being arranged on described heater members.
10. electro-heat equipment according to claim 9, is characterized in that, described heater members is LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520751618.1U CN205142648U (en) | 2015-09-25 | 2015-09-25 | Heat conduction base plate of device and device that generates heat generate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520751618.1U CN205142648U (en) | 2015-09-25 | 2015-09-25 | Heat conduction base plate of device and device that generates heat generate heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205142648U true CN205142648U (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520751618.1U Active CN205142648U (en) | 2015-09-25 | 2015-09-25 | Heat conduction base plate of device and device that generates heat generate heat |
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| CN (1) | CN205142648U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163485A (en) * | 2015-09-25 | 2015-12-16 | 湖南三一电控科技有限公司 | Heat conducting substrate for heating device and heating device and manufacturing method thereof |
-
2015
- 2015-09-25 CN CN201520751618.1U patent/CN205142648U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163485A (en) * | 2015-09-25 | 2015-12-16 | 湖南三一电控科技有限公司 | Heat conducting substrate for heating device and heating device and manufacturing method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220525 Address after: 410100 2nd floor, No.3 workshop, Sany industrial city, Changsha Economic and Technological Development Zone, Changsha City, Hunan Province Patentee after: HUNAN SANY INTELLIGENT CONTROL EQUIPMENT Co.,Ltd. Address before: 410100 second floor, plant 3, Sany industrial city, Changsha Economic Development Zone, Changsha City, Hunan Province Patentee before: HUNAN SANYI ELECTRIC CONTROL TECHNOLOGY Co.,Ltd. |