CN203482488U - Circuit board with good thermal conductivity - Google Patents
Circuit board with good thermal conductivity Download PDFInfo
- Publication number
- CN203482488U CN203482488U CN201320547474.9U CN201320547474U CN203482488U CN 203482488 U CN203482488 U CN 203482488U CN 201320547474 U CN201320547474 U CN 201320547474U CN 203482488 U CN203482488 U CN 203482488U
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- CN
- China
- Prior art keywords
- hole
- insulating trip
- base plate
- circuit base
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a circuit board with good thermal conductivity. The circuit boards comprises a circuit substrate, a resin sheet, an insulating strip and a heat radiating base material, wherein the circuit substrate includes circuit substrate through holes, the insulating strip is equipped with insulating strip through holes corresponding to the circuit substrate through holes, the area of the insulating strip through hole is greater than that of the circuit substrate through hole, and the insulating strip through holes are respectively filled with insulators. Under the condition that other performance (such as heat radiation performance) of the circuit board is not influenced, the circuit board of the utility model has the advantage that excellent insulation performance between the heat radiating base material and the circuit substrate is provided.
Description
Technical field
The utility model relates to pcb board, especially relates to the wiring board that a kind of thermal conductance is good.
Background technology
Along with social development, various electronic products (as LED, power supply etc.) are widely used for people.But when these electronic product work, its master chip and its peripheral electron components and parts can produce a large amount of heats, thereby affect the stability of product, as disposed the useful life of being not good at can reducing product, existing electronic product wiring board, it mounts after components and parts, in actual use, its heat radiation realizes by natural heat dissipation and insulating barrier heat conduction, and radiating effect is not good.How when not affecting its wiring board heat radiation, to guarantee that its insulating properties is the difficult problem existing in wiring board design process always.
Summary of the invention
For addressing the above problem, for the purpose of this utility model is to provide the good wiring board of thermal conductance between a kind of heat radiating material and wiring board with good insulation property.
The purpose of this utility model is achieved in that the wiring board that a kind of thermal conductance is good, comprise the circuit base plate, resin sheet, insulating trip and the heat dispersion substrate that press together successively from the top down, on described circuit base plate, there is circuit base plate through hole, on described insulating trip, be provided with the insulating trip through hole corresponding with circuit base plate through hole, and the area of insulating trip through hole is greater than the area of circuit base plate through hole, in described insulating trip through hole, be filled with insulator.
As a kind of optimal way, the thickness of described insulating trip is less than or equal to the thickness of resin sheet.
Concrete, described insulator is insulating resin.
As a kind of optimal way, described heat dispersion substrate and insulating trip are sheet metal or heat radiating type shape.
Concrete, described sheet metal or heat radiating type shape are aluminium, aluminium alloy, copper, copper alloy or stainless steel.
The utility model by arranging insulating trip between described heat dispersion substrate and resin sheet, and on insulating trip, be provided with the insulating trip through hole of filling insulator, insulating trip through hole is not only corresponding with circuit base plate through hole, and area is greater than the area of circuit base plate through hole, in actual application, can not affect under the condition of other performances of wiring board (as thermal diffusivity), also can make between heat dispersion substrate and wiring board, to there are good insulation property.
Accompanying drawing explanation
Fig. 1 is cross-sectional schematic of the present utility model.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.
Refer to shown in Fig. 1, the utility model discloses the wiring board that a kind of thermal conductance is good, comprise the circuit base plate 1, resin sheet 2, insulating trip 3 and the heat dispersion substrate 4 that press together successively from the top down, on described circuit base plate 1, there is circuit base plate through hole 101, on described insulating trip 3, be provided with the insulating trip through hole 301 corresponding with circuit base plate through hole 101, and the area of insulating trip through hole 301 is greater than the area of circuit base plate through hole 101, in described insulating trip through hole 301, be filled with insulator 302.
In the present embodiment, in order to make to there is high insulating property between heat dispersion substrate 4 and circuit base plate 1, and do not affect other performances (as thermal diffusivity) of wiring board, the area of described circuit base plate through hole 101 is slightly larger than the area of circuit base plate through hole 101, be the diameter D that the size of insulator 302 is slightly larger than circuit base plate through hole 101, with insulator 302, can cover circuit base plate through hole 101 and be advisable.
In a preferred embodiment, described insulator 302 is located in insulating trip through hole 301, and be embedded in insulating trip 3, in the course of processing, described insulator 302 is embedded in insulating trip 3 by pressing, it not only can dwindle the volume of wiring board, and can make the insulation property between heat dispersion substrate 4 and circuit base plate 1 better.
Wherein, the height of described insulating trip 3 is less than or equal to the height of resin sheet 2.In a preferred embodiment, the height of described insulating trip 3 need slightly approach the height of resin sheet 2, thereby makes to have high insulating property between heat dispersion substrate 4 and circuit base plate 1.
In order not affect the heat dispersion of metal base base board, described heat dispersion substrate 4 and insulating trip 3 are sheet metal or heat radiating type shape, and wherein, described sheet metal or heat radiating type shape are aluminium, aluminium alloy, copper, copper alloy or stainless steel.
The utility model by being provided with insulating trip 3 between described heat dispersion substrate 4 and resin sheet 2, insulating trip through hole 301 in described insulating trip 3 is not only corresponding with described circuit base plate through hole 101, and the area of insulating trip through hole 301 is greater than the area of through hole 4, in actual application, do not affecting under the condition of other performances of wiring board (as thermal diffusivity), can make to there are good insulation property between heat dispersion substrate 4 and circuit base plate 1;
The utility model can be applicable to power supply product and LED etc. to be had in the Metal Substrate product of high insulating property requirement.
Above-described embodiment is preferably execution mode of the utility model; but execution mode of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under the utility model principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection range of the present utility model.
Claims (5)
1. the wiring board that thermal conductance is good, it is characterized in that: comprise the circuit base plate, resin sheet, insulating trip and the heat dispersion substrate that press together successively from the top down, on described circuit base plate, there is circuit base plate through hole, on described insulating trip, be provided with the insulating trip through hole corresponding with circuit base plate through hole, and the area of insulating trip through hole is greater than the area of circuit base plate through hole, in described insulating trip through hole, be filled with insulator.
2. the good wiring board of thermal conductance according to claim 1, is characterized in that: the thickness of described insulating trip is less than or equal to the thickness of resin sheet.
3. the good wiring board of thermal conductance according to claim 1, is characterized in that: described insulator is insulating resin.
4. the good wiring board of thermal conductance according to claim 1, is characterized in that: described heat dispersion substrate and insulating trip are sheet metal or heat radiating type shape.
5. the good wiring board of thermal conductance according to claim 4, is characterized in that: described sheet metal or heat radiating type shape are aluminium, aluminium alloy, copper, copper alloy or stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320547474.9U CN203482488U (en) | 2013-08-28 | 2013-08-28 | Circuit board with good thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320547474.9U CN203482488U (en) | 2013-08-28 | 2013-08-28 | Circuit board with good thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203482488U true CN203482488U (en) | 2014-03-12 |
Family
ID=50230729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320547474.9U Expired - Fee Related CN203482488U (en) | 2013-08-28 | 2013-08-28 | Circuit board with good thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203482488U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050317A (en) * | 2015-06-18 | 2015-11-11 | 镇江华印电路板有限公司 | High-precision printed circuit board |
-
2013
- 2013-08-28 CN CN201320547474.9U patent/CN203482488U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050317A (en) * | 2015-06-18 | 2015-11-11 | 镇江华印电路板有限公司 | High-precision printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 Termination date: 20150828 |
|
| EXPY | Termination of patent right or utility model |