CN204966543U - Novel composite metal material base plate - Google Patents
Novel composite metal material base plate Download PDFInfo
- Publication number
- CN204966543U CN204966543U CN201520669668.5U CN201520669668U CN204966543U CN 204966543 U CN204966543 U CN 204966543U CN 201520669668 U CN201520669668 U CN 201520669668U CN 204966543 U CN204966543 U CN 204966543U
- Authority
- CN
- China
- Prior art keywords
- copper
- composite metal
- material layer
- novel composite
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model relates to a novel composite metal material base plate, include adhesive copper foil line layer, insulating material layer and aluminium copper composite metal board in proper order, wherein the copper of aluminium copper composite metal board part is adhere with the insulating material layer mutually, the upper surface of copper part is equipped with a bronze medal boss, is equipped with one on bind copper foil line layer and the insulating material layer and is used for the installation together the first through -hole of copper boss, the upper surface of copper boss flushes with the upper surface of copper foil line layer. The utility model discloses has better heat conduction radiation effect.
Description
Technical field
The utility model relates to a kind of Novel composite metal material substrate.
Background technology
In LED industry, the metal substrate that tradition has heat conduction and heat radiation effect is generally formed with the metallic plate of single metallicity and insulating material, Copper Foil.Such as, in copper base, copper metal has high thermal conductivity, and in aluminium base, aluminium sheet or aluminium alloy plate have higher heat dispersion and different use hardness.But along with technical development, the metal substrate of single metallicity more and more can not meet the demand of development.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of NEW TYPE OF COMPOSITE metal substrate with better heat conduction and heat radiation effect.
For achieving the above object, the utility model adopts following technical scheme:
A kind of Novel composite metal material substrate, comprise the copper foil circuit layer, insulation material layer and the aluminum bronze clad metal sheet that bond successively, copper part and the insulation material layer of wherein said aluminum bronze clad metal sheet are bonding; The upper surface of described copper part is provided with a copper protruding plate, and the copper foil circuit layer be bonded together and insulation material layer are provided with one for installing the first through hole of described copper protruding plate, the upper surface of described copper protruding plate and the upper surface flush of copper foil circuit layer.
Preferably, the thickness of described copper part is the 10%-15% of described aluminum bronze composition metal plate thickness.
Preferably, the upper surface of described copper protruding plate is also provided with the metal tin layers for fixed L ED chip.
The beneficial effects of the utility model are as follows:
This NEW TYPE OF COMPOSITE metal substrate has better heat conduction and radiating effect.
Accompanying drawing explanation
Fig. 1 is the structure chart of the better embodiment of NEW TYPE OF COMPOSITE metal substrate of the present utility model.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described further:
Refer to Fig. 1, the utility model relates to a kind of Novel composite metal material substrate, its better embodiment comprises the copper foil circuit layer 1, insulation material layer 2 and the aluminum bronze clad metal sheet 3 that bond successively, wherein the copper part of aluminum bronze clad metal sheet 3 and insulation material layer 2 bonding; The upper surface of copper part is provided with a copper protruding plate 4, and the copper foil circuit layer 1 be bonded together and insulation material layer 2 are provided with one for installing the first through hole 5 of copper protruding plate 4, the upper surface of copper protruding plate 4 and the upper surface flush of copper foil circuit layer 1.
Concrete, aluminum bronze clad metal sheet is the composite plate of metallurgical binding, can refer to the production method of a kind of aluminium of Chinese invention patent and copper composite metal band.Wherein, copper part and the insulation material layer 2 of aluminum bronze clad metal sheet 3 are bonding, namely the upper surface of copper part and the lower surface of insulation material layer bond, and can play the effect of quick conductive, and the upper surface of insulation material layer and the lower surface of copper foil circuit layer bond simultaneously.The aluminum portions being positioned at copper portion lower surface can play thermolysis fast, thus makes whole aluminum bronze clad metal sheet heat conduction and heat radiation better effects if, also namely makes the heat conduction and heat radiation better effects if of Novel composite metal material substrate of the present utility model.
Moreover the copper protruding plate that copper part is provided with is arranged in the first through hole, the upper surface of copper protruding plate may be used for fixed L ED chip, thus plays good conductive force.Wherein copper protruding plate can be formed by the copper part of aluminum bronze clad metal sheet acid liquid medicine or alkaline medicinal liquid etching.As preferably, the thickness of the copper part in the present embodiment can be the 10%-15% of aluminum bronze composition metal plate thickness.On the one hand, copper part now can be done process for copper process and save the advantage of copper self high thermal conductivity; On the other hand, aluminum portions account for larger proportion, not only makes rapid heat dissipation, and remains the feature of aluminium light weight, also reduces production cost simultaneously.
As preferably, the upper surface of described copper protruding plate is also provided with the metal tin layers 6 for fixed L ED chip.This metal tin layers 6 has good heat dispersion, the heat that LED chip can be sent spreads conduction out better, thus improve the useful life of LED chip, also namely can improve the heat conduction and heat radiation effect of composite material substrate of the present utility model better.
For a person skilled in the art, according to technical scheme described above and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the utility model claim.
Claims (3)
1. a Novel composite metal material substrate, is characterized in that, comprises the copper foil circuit layer, insulation material layer and the aluminum bronze clad metal sheet that bond successively, and copper part and the insulation material layer of wherein said aluminum bronze clad metal sheet are bonding; The upper surface of described copper part is provided with a copper protruding plate, and the copper foil circuit layer be bonded together and insulation material layer are provided with one for installing the first through hole of described copper protruding plate, the upper surface of described copper protruding plate and the upper surface flush of copper foil circuit layer.
2. Novel composite metal material substrate as claimed in claim 1, is characterized in that: the thickness of described copper part is the 10%-15% of described aluminum bronze composition metal plate thickness.
3. Novel composite metal material substrate as claimed in claim 1, is characterized in that: the upper surface of described copper protruding plate is also provided with the metal tin layers for fixed L ED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520669668.5U CN204966543U (en) | 2015-08-31 | 2015-08-31 | Novel composite metal material base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520669668.5U CN204966543U (en) | 2015-08-31 | 2015-08-31 | Novel composite metal material base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204966543U true CN204966543U (en) | 2016-01-13 |
Family
ID=55061585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520669668.5U Active CN204966543U (en) | 2015-08-31 | 2015-08-31 | Novel composite metal material base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204966543U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609615A (en) * | 2016-03-03 | 2016-05-25 | 深圳市新月光电有限公司 | Copper-aluminum composite base heat-conduction surface light source |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
-
2015
- 2015-08-31 CN CN201520669668.5U patent/CN204966543U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609615A (en) * | 2016-03-03 | 2016-05-25 | 深圳市新月光电有限公司 | Copper-aluminum composite base heat-conduction surface light source |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204966543U (en) | Novel composite metal material base plate | |
| CN203446104U (en) | Insulating thermal conductive substrate | |
| CN205611056U (en) | Thermoelectric separation composite metal circuit board | |
| CN203219607U (en) | High-heat-conduction flexible LED lead plate | |
| CN202948970U (en) | Improved heat conduction light emitting diode (LED) substrate | |
| CN103987211A (en) | Efficient cooling aluminum substrate based on enlarged aluminum-based face and manufacturing method thereof | |
| CN203984767U (en) | A kind of high capacity aluminum-based circuit board | |
| CN207014886U (en) | A kind of heat conduction aluminium nitride substrate | |
| CN201207757Y (en) | Printed circuit board | |
| CN206365131U (en) | A kind of circuit board of quick heat radiating | |
| CN202357536U (en) | Metal-based copper-clad plate used for light-emitting diode (LED) for lighting | |
| CN203689950U (en) | Tin-plated copper-plated steel flat wire used for electric power transmission | |
| CN203482488U (en) | Circuit board with good thermal conductivity | |
| CN203057695U (en) | Ceramic circuit board | |
| CN203368904U (en) | Multi-layer PCB plate structure | |
| CN204966533U (en) | High light efficiency COB base plate | |
| CN201490177U (en) | Metal-based copper clad laminate for mounting semiconductor power devices | |
| CN203057702U (en) | Multi-layer ceramic circuit board | |
| CN202423382U (en) | LED (Light Emitting Diode) ceramic substrate | |
| CN206247280U (en) | A kind of corrosion-resistant power supply wiring board | |
| CN202118644U (en) | LED (Light Emitting Diode) lamp string | |
| CN202507609U (en) | Substrate | |
| CN204966544U (en) | Composite substrate who is fit for encapsulation of LED high density | |
| CN205051965U (en) | Compound heat conduction circuit board | |
| CN201796948U (en) | High-power LED packaging base plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee after: Shenzhen hi tech materials Limited by Share Ltd Address before: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee before: Shenzhen Kerui Electronic Industrial Co.,Ltd. |