CN202948970U - Improved heat conduction light emitting diode (LED) substrate - Google Patents
Improved heat conduction light emitting diode (LED) substrate Download PDFInfo
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- CN202948970U CN202948970U CN 201220635104 CN201220635104U CN202948970U CN 202948970 U CN202948970 U CN 202948970U CN 201220635104 CN201220635104 CN 201220635104 CN 201220635104 U CN201220635104 U CN 201220635104U CN 202948970 U CN202948970 U CN 202948970U
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- thermally conductive
- substrate body
- heat conduction
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Abstract
The utility model relates to the technical field of substrates of LED lamps, in particular to an improved heat conduction LED substrate. The improved heat conduction LED substrate comprises a substrate body and a heat conduction block which is arranged on the substrate body, the substrate body is composed of a solder mask layer, a conducting layer, an insulating layer and a basic metal layer which are sequentially laminated from top to bottom, an accommodating hole is mounted on the substrate body and extends to the basic metal layer, and the heat conduction block is embedded in the accommodating hole. According to the technical scheme, the substrate body is merely composed of the solder mask layer, the conducting layer, the insulating layer and the basic metal layer, the structure of the improved heat conduction LED substrate is simplified, production costs of the improved heat conduction LED substrate are reduced, the substrate body is directly connected with the heat conduction block, the heat conduction performance of the substrate body is enhanced, the heat dissipation efficiency of LED lamp beads is indirectly improved, the service life of the LED lamp beads is prolonged, and the practicability is high.
Description
Technical field
The utility model relates to the substrate technical field of LED lamp, refers in particular to a kind of modified model thermally conductive LED substrate.
Background technology
Due at present increasing to the power requirement of LED lamp, and the volume of LED lamp is more and more less, the heat conductivility of existing base plate for packaging for the LED lamp oneself through not satisfying the needs of high-powered LED lamp, the inferior quality that causes high-powered LED lamp, greatly reduce the useful life of high-powered LED lamp, thereby hindered the development of high-powered LED lamp.
prior art is to ask required capacity of heat transmission and the circuit function demand of carrying high-power components, need first with metal substrate, insulating barrier and circuit layer utilize the mode moulding of hot pressing, make circuit again on the substrate of this two moulding, to form a high-power components bearing substrate, this bearing substrate comprises solder mask, conductive layer, the first insulating barrier, metal-based layer and the second insulating barrier, due to the about 401W/M.K of the conductive coefficient of copper, the conductive coefficient of aluminium is about 207W/M.K, and the conductive coefficient of insulating barrier is about 1-3W/M.K, therefore the heat conduction obstacle of LED substrate is insulating barrier, but aforesaid substrate vertical thermal conducting power is confined to its insulating barrier, and make it use power to be difficult to further raising.
The utility model content
The technical problems to be solved in the utility model is to provide a kind of modified model thermally conductive LED substrate of high thermal conductivity.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme: a kind of modified model thermally conductive LED substrate, comprise substrate body and be arranged at heat-conducting block on substrate body, described substrate body is comprised of solder mask, conductive layer, insulating barrier and metal-based layer, and this solder mask, conductive layer, insulating barrier and metal-based layer stack gradually from top to bottom; Described substrate body offers containing hole, and this containing hole extends to metal-based layer, and described heat-conducting block is embedded in containing hole.
Wherein, be coated with between the bottom of the bottom surface of described heat-conducting block and containing hole tin cream is housed.
Wherein, be provided with nickel dam or tin layer between the inwall of the outer wall of described heat-conducting block and containing hole.
Wherein, described heat-conducting block is made by the red copper material.
Wherein, described conductive layer is the Copper Foil that is made of copper.
Wherein, described metal-based layer is made by copper coin, aluminium sheet or corrosion resistant plate.
Wherein, described insulating barrier is made by ceramics polymer.
Wherein, the thickness of described metal-based layer is greater than the thickness of solder mask, conductive layer and insulating barrier sum.
Wherein, the downside of described metal-based layer is provided with radiator, and this radiator and metal-based layer are one-body molded.
the beneficial effects of the utility model are: the utility model provides a kind of to contain an insulating barrier to improve the modified model thermally conductive LED substrate of LED substrate heat conductivility, only by solder mask, conductive layer, insulating barrier and metal-based layer form, simplified the structure of modified model thermally conductive LED substrate, reduced the production cost of modified model thermally conductive LED substrate, substrate body in the technical program directly is connected with heat-conducting block, strengthened the heat conductivility of substrate body, pearl is arranged on heat-conducting block the LED lamp, thereby the heat on LED lamp pearl can be conducted to substrate body as soon as possible, by the radiator that is arranged on substrate body, heat is shed again, indirectly improved the radiating efficiency of LED lamp pearl, extended its useful life, practical.
Description of drawings
Fig. 1 is cross-sectional view of the present utility model.
Fig. 2 is the structural representation of each step of technological process of the utility model processing technology.
Cross-sectional view when Fig. 3 is the utility model application.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with embodiment and accompanying drawing, the utility model is further described, the content that execution mode is mentioned not is to restriction of the present utility model.
As shown in Figure 1 to Figure 3, a kind of modified model thermally conductive LED substrate, comprise substrate body 1 and be arranged at the heat-conducting block 2 of substrate body 1, described substrate body 1 is comprised of solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6, and this solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6 stack gradually from top to bottom; Described substrate body 1 offers containing hole 7, and this containing hole 7 extends to metal-based layer 6, and described heat-conducting block 2 is embedded in containing hole 7.
modified model thermally conductive LED substrate of the present utility model is only by solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6 form, only contain an insulating barrier, simplified the structure of modified model thermally conductive LED substrate, reduced the production cost of modified model thermally conductive LED substrate, substrate body 1 in the technical program directly is connected with heat-conducting block 2, strengthened the heat conductivility of substrate body 1, LED lamp pearl is arranged on heat-conducting block 2, thereby the heat on LED lamp pearl can be conducted to substrate body 1 as soon as possible, by the radiator that is arranged on substrate body 1, heat is shed again, indirectly improved the radiating efficiency of LED lamp pearl, extended its useful life, practical.
Be coated with between the bottom surface of the described heat-conducting block 2 of the present embodiment and the bottom of containing hole 7 tin cream is housed, be provided with nickel dam or tin layer between the inwall of the outer wall of described heat-conducting block 2 and containing hole 7, so that improve the heat conductivility of junction between substrate body 1 and heat-conducting block 2.
Concrete, described heat-conducting block 2 is made by the red copper material, the Copper Foil of described conductive layer 4 for being made of copper, described metal-based layer 6 is made by copper coin, aluminium sheet or corrosion resistant plate, adopt the higher material of conductive coefficient, can further accelerate thermal conduction rate, practicality is stronger.
The described insulating barrier 5 of the present embodiment is made by ceramics polymer, not only has the good heat conductive performance, also have insulation property preferably, effectively avoid LED lamp pearl in use to produce short trouble, guarantee that modified model thermally conductive LED substrate has higher job stability.
The thickness of the described metal-based layer 6 of the present embodiment has effectively improved the bearing strength of substrate body 1 greater than the thickness of solder mask 3, conductive layer 4 and insulating barrier 5 sums.
See Fig. 3, the downside of described metal-based layer 6 is provided with radiator 8, this radiator 8 is one-body molded with metal-based layer 6, design has reduced the gap that is connected between substrate and radiator 8 like this, transferring heat that can be more convenient, further improve heat conduction and heat radiation function between modified model thermally conductive LED substrate and radiator 8, stabilized structure, practical.
A kind of processing technology of processing modified model thermally conductive LED substrate comprises following processing step:
A, solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6 are stacked gradually hot pressing from top to bottom obtain substrate body 1;
The mode of B, employing milling on substrate body 1 mills out containing hole 7, makes the heat-conducting block 2 that adapts with containing hole 7 sizes standby;
C, the mode of electroplating in the inwall employing of containing hole 7 plate nickel dam or adopt the mode of spraying to spray the tin layer;
D, adopt the mode of silk screen printing to be coated with the seal tin cream in the bottom of heat-conducting block 2, and heat-conducting block 2 is embedded at obtains substrate base material in containing hole 7;
E, Reflow Soldering processing is carried out in the junction between the inwall of the outer wall of heat-conducting block 2 and containing hole 7 process.
The modified model thermally conductive LED substrate that adopts this processing step to process, not only structure is compacter firm, the sidewall of described containing hole 7 is also more concordant, is convenient on the one hand greatly improve thermal conduction rate between substrate body 1 and heat-conducting block 2 with plating nickel dam or adopting the mode of spraying to spray the tin layer; Also be convenient on the other hand described heat-conducting block 2 is embedded in containing hole 7, reduced difficulty of processing, improved the production efficiency of modified model thermally conductive LED substrate.
Preferably, in step e, when carrying out Reflow Soldering processing processing, the upper surface that heat-conducting block 2 is pressed to heat-conducting block 2 is concordant with the upper surface of conductive layer 4, be convenient to the installation of LED lamp pearl base and fix, and make LED lamp pearl base keep good contacting with conductive layer 4, and improve the stability of LED lamp pearl, further improve the whole crudy of LED light fixture.What need supplementary notes is, equipment can adopt below substrate body 1 die was set in afternoon this, above heat-conducting block 2, punch was set, and utilizes the mutual extruding of punch and die to realize that the pressing of heat-conducting block 2 processes, and crudy is higher.
Above-described embodiment is the better implementation of the utility model, in addition, all right alternate manner realization of the utility model, any apparent replacement is all within protection range of the present utility model without departing from the concept of the premise utility.
Claims (9)
1. modified model thermally conductive LED substrate, comprise substrate body (1) and be arranged at the heat-conducting block (2) of substrate body (1), it is characterized in that: described substrate body (1) is comprised of solder mask (3), conductive layer (4), insulating barrier (5) and metal-based layer (6), and this solder mask (3), conductive layer (4), insulating barrier (5) and metal-based layer (6) stack gradually from top to bottom; Described substrate body (1) offers containing hole (7), and this containing hole (7) extends to metal-based layer (6), and described heat-conducting block (2) is embedded in containing hole (7).
2. modified model thermally conductive LED substrate according to claim 1, is characterized in that: be coated with between the bottom of the bottom surface of described heat-conducting block (2) and containing hole (7) tin cream is housed.
3. modified model thermally conductive LED substrate according to claim 1, is characterized in that: be provided with nickel dam or tin layer between the inwall of the outer wall of described heat-conducting block (2) and containing hole (7).
4. modified model thermally conductive LED substrate according to claim 1, is characterized in that: the copper sheet of described heat-conducting block (2) for being made by the red copper material.
5. modified model thermally conductive LED substrate according to claim 1, is characterized in that: the Copper Foil of described conductive layer (4) for being made of copper.
6. modified model thermally conductive LED substrate according to claim 1, is characterized in that: the layer structure of described metal-based layer (6) for being made by copper coin, aluminium sheet or corrosion resistant plate.
7. modified model thermally conductive LED substrate according to claim 1, is characterized in that: the layer structure of described insulating barrier (5) for being made by ceramics polymer.
8. modified model thermally conductive LED substrate according to claim 1, it is characterized in that: the thickness of described metal-based layer (6) is greater than the thickness of solder mask (3), conductive layer (4) and insulating barrier (5) sum.
9. modified model thermally conductive LED substrate according to claim 1, it is characterized in that: the downside of described metal-based layer (6) is provided with radiator (8), and this radiator (8) is one-body molded with metal-based layer (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220635104 CN202948970U (en) | 2012-11-27 | 2012-11-27 | Improved heat conduction light emitting diode (LED) substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220635104 CN202948970U (en) | 2012-11-27 | 2012-11-27 | Improved heat conduction light emitting diode (LED) substrate |
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| Publication Number | Publication Date |
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| CN202948970U true CN202948970U (en) | 2013-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201220635104 Expired - Fee Related CN202948970U (en) | 2012-11-27 | 2012-11-27 | Improved heat conduction light emitting diode (LED) substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate and processing technology thereof |
| CN106604532A (en) * | 2017-01-17 | 2017-04-26 | 苏州灯龙光电科技有限公司 | PCB and producing technique and application thereof |
| CN112879815A (en) * | 2020-10-26 | 2021-06-01 | 深圳爱克莱特科技股份有限公司 | High heat conduction LED lamps and lanterns |
| CN114688510A (en) * | 2022-03-30 | 2022-07-01 | 深圳市中孚能电气设备有限公司 | LED connection structure and lamp holder subassembly |
-
2012
- 2012-11-27 CN CN 201220635104 patent/CN202948970U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate and processing technology thereof |
| CN102983249B (en) * | 2012-11-27 | 2015-10-21 | 东莞勤上光电股份有限公司 | Modified model thermally conductive LED substrate and processing technology thereof |
| CN106604532A (en) * | 2017-01-17 | 2017-04-26 | 苏州灯龙光电科技有限公司 | PCB and producing technique and application thereof |
| CN112879815A (en) * | 2020-10-26 | 2021-06-01 | 深圳爱克莱特科技股份有限公司 | High heat conduction LED lamps and lanterns |
| CN112879815B (en) * | 2020-10-26 | 2023-01-31 | 深圳爱克莱特科技股份有限公司 | High heat conduction LED lamps and lanterns |
| CN114688510A (en) * | 2022-03-30 | 2022-07-01 | 深圳市中孚能电气设备有限公司 | LED connection structure and lamp holder subassembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130522 Termination date: 20151127 |