CN201706426U - Mounting structure of packaged LED and LED illumination system - Google Patents

Mounting structure of packaged LED and LED illumination system Download PDF

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Publication number
CN201706426U
CN201706426U CN2010202385025U CN201020238502U CN201706426U CN 201706426 U CN201706426 U CN 201706426U CN 2010202385025 U CN2010202385025 U CN 2010202385025U CN 201020238502 U CN201020238502 U CN 201020238502U CN 201706426 U CN201706426 U CN 201706426U
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CN
China
Prior art keywords
led
shell
encapsulated led
mounting structure
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202385025U
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Chinese (zh)
Inventor
胡秀梅
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胡秀梅
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Filing date
Publication date
Application filed by 胡秀梅 filed Critical 胡秀梅
Priority to CN2010202385025U priority Critical patent/CN201706426U/en
Application granted granted Critical
Publication of CN201706426U publication Critical patent/CN201706426U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The utility model relates to a mounting structure of a packaged LED and an LED illumination system. The LED is directly soldered on a heat sink or a shell, so that the LED and the heat sink or the shell can be directly contacted, the heat-dissipating effect of the LED is enhanced, consequently, the brightness of the LED is increased, and the service life of the LED is prolonged.

Description

The mounting structure of encapsulated LED and LED illuminator
Technical field
The utility model is about the mounting structure of a kind of LED and LED illuminator.
Background technology
The light extraction efficiency of LED improves rapidly, and LED commodity existing different on the market are as replacing traditional illuminator for example MR16 type shot-light, portable torch etc.
Because LED, particularly high-power LED can produce a large amount of heats in luminous process, if the heat dissipation design of LED illuminator is bad, can directly influence light extraction efficiency and the life-span of LED, even LED can damage because of overheated.
Fig. 1 is the heat dissipation design of existing LED illuminator, and the anode 12 of encapsulated LED and negative electrode 11 connection line plates 2 allow electric current pass through encapsulated LED 1.Wiring board 2 as Al-alloy based copper clad plate, wiring board generally is made up of three layers of material: aluminium lamination 23, ceramic layer 22 and copper layer 21.Utilize tin slurry 8 that LED is fixed on the Al-alloy based copper clad plate.Al-alloy based copper clad plate is fixed on the radiator 7 together with the heat radiation of encapsulated LED utilization oil 4.In the structure of Fig. 1 and since heat energy that encapsulated LED had produced need through five layers material (the tin slurry->the copper layer->ceramic layer->aluminium lamination->heat radiation oil) could arrive on the radiator 7 its heat dissipation so have a greatly reduced quality.Bad radiating effect can make the light emission rate of LED subtract greatly and the lost of life, even burns the chip of LED.
The heat dissipation design of another kind of existing LED illuminator, as shown in Figures 2 and 3, this is designed to: add a guide hole 51 on wiring board 5, above guide hole, put led chip 15, below wiring board, add radiator 7, utilize gold-plated line 14 to make electric current between the chip 15 of wiring board 5 and LED, pass through, add that above chip optical lens 13 makes LED.Guide hole in the circuit board adds heat radiation binder 6 fixed L ED chips 15.But owing to can't directly be welded in the tin slurry on the chip of LED in the prior art, this structure can only utilize the heat radiation binder that the chip of LED is fixed on the radiator.Because the radiating effect of heat radiation binder is starched far away from tin, so this structural cooling performance is relatively poor.
The utility model content
The purpose of this utility model is at the deficiencies in the prior art, and a kind of mounting structure and LED illuminator that can improve the encapsulated LED of heat dispersion is provided.
For achieving the above object, the utility model has adopted following technical scheme: a kind of mounting structure of encapsulated LED, comprise shell and encapsulated LED, and described encapsulated LED is directly installed on described shell.
Described encapsulated LED directly is welded on described shell by the tin slurry.
Described shell has guide hole, the described guide hole of described tin slurry filling.
Described shell also has at least one louvre.
Described shell is a heat carrier.
Described shell is aluminum shell or copper shell.
Described shell is a radiator.
A kind of LED illuminator comprises the mounting structure of described encapsulated LED.
The beneficial effects of the utility model are:
1) encapsulated LED directly links to each other with shell, makes LED and radiator or shell have on a large scale and directly contacts, and the heat that encapsulated LED produced can directly give out outside the shell of product, has improved heat dispersion.
2) can use the high tin of thermal conductivity slurry to replace the heat radiation binder that encapsulated LED is fixed on radiator or the shell, improve heat dispersion.
3) heat dispersion of the present utility model is than prior art height, because heat dispersion improves, light emission rate and the life-span of LED also increase to some extent than prior art.
Description of drawings
Fig. 1 is the structural representation of first kind of LED illuminator of prior art;
Fig. 2 is the structural representation of second kind of LED illuminator of prior art;
Fig. 3 is the schematic diagram of LED encapsulating structure of second kind of LED illuminator of reflection prior art;
Fig. 4 is the present embodiment vertical view of the mounting structure of encapsulated LED;
Fig. 5 is the present embodiment upward view of the mounting structure of encapsulated LED;
Fig. 6 is the present embodiment cross-sectional schematic of the mounting structure of encapsulated LED.
The specific embodiment
In conjunction with the accompanying drawings the utility model is described in further detail below by the specific embodiment.
To shown in Figure 6, radiator or shell 7 are made by the material of high-termal conductivity, for example aluminium or copper as Fig. 4.The center of radiator or shell 7 has the guide hole 71 of inserting tin slurry 8 to be used as, and encapsulated LED 1 directly is welded on radiator or the shell 7.Radiator or shell 7 can have one or more louvres 72 as auxiliary heat dissipation.
To shown in Figure 6, radiator or shell 7 are made by the material of high-termal conductivity, for example aluminium or copper as Fig. 4.The negative electrode 11 of encapsulated LED and the anode 12 of encapsulated LED allow electric current lead to encapsulated LED 1, make LED luminous.Radiator or shell 7 can have one or more louvres 72 as auxiliary heat dissipation.Whole encapsulated LED 1 is used tin slurry 8 and is fixed on radiator or the shell 7 and improves heat dispersion.
To shown in Figure 6, radiator or shell 7 are made by the material of high-termal conductivity, for example aluminium or copper as Fig. 4.The negative electrode 11 of encapsulated LED and the anode 12 of encapsulated LED allow electric current lead to encapsulated LED 1, make LED luminous.The center of radiator or shell 7 has the guide hole 71 of inserting the tin slurry to be used as, and encapsulated LED 1 directly is welded on radiator or the shell 7.Whole encapsulated LED can be fixed on radiator or the shell 7 and improve heat dispersion.
The mounting structure of encapsulated LED comprises encapsulated LED and shell, this encapsulated LED directly be fixed on the shell.The structure that should directly install comprises: encapsulated LED is directly installed on shell by guide hole; Encapsulated LED is directly installed on shell by guide hole; Encapsulated LED directly is welded on shell by the tin slurry; Tin slurry directly is welded on shell to encapsulated LED by guide hole.This shell can be a radiator.This shell can be made by Heat Conduction Material, and the shell of making by this Heat Conduction Material can directly give out the heat of encapsulated LED generation.The material of the high-termal conductivity of this Heat Conduction Material such as perfect heat-dissipating is as aluminium or copper.Shell can also be provided with the louvre that is used for auxiliary heat dissipation.
A kind of LED illuminator comprises encapsulated LED and shell, this encapsulated LED be directly installed on the shell.This shell can refer to the casing of whole illuminator, also can refer to the radiator of illuminator.These LED illuminator such as shot-light or portable torch etc.
A kind of installation method of encapsulated LED directly is welded on encapsulated LED on radiator or the shell by tin slurry.There is a guide hole encapsulated LED directly to be fixed on radiator or the shell in order to insert tin slurry at the center of radiator or shell.
A kind of installation method of encapsulated LED is directly installed on shell to encapsulated LED.The shell of described installation method is a radiator.The raw material of the shell of described installation method are the material of high-termal conductivity.The raw material of the shell of described installation method are aluminium or copper.The installation method of described encapsulated LED is as illuminator.Described illuminator is shot-light or portable torch.Described illuminator is a MR16 type shot-light.Described illuminator is portable torch.
A kind of installation method of encapsulated LED is directly installed on shell to encapsulated LED by guide hole.The shell of described installation method is a radiator.The raw material of the shell of described installation method are the material of high-termal conductivity.The raw material of the shell of described installation method are aluminium or copper.The installation method of described encapsulated LED is as illuminator.Described illuminator is shot-light or portable torch.Described illuminator is a MR16 type shot-light.Described illuminator is portable torch.
A kind of installation method of encapsulated LED utilizes encapsulated LED the tin slurry directly to be welded on shell.The shell of described installation method is a radiator.The raw material of the shell of described installation method are the material of high-termal conductivity.The raw material of the shell of described installation method are aluminium or copper.The installation method of described encapsulated LED is as illuminator.Described illuminator is shot-light or portable torch.Described illuminator is a MR16 type shot-light.Described illuminator is portable torch.
A kind of installation method of encapsulated LED utilizes tin slurry that encapsulated LED directly is welded on shell by guide hole.The shell of described installation method is a radiator.The raw material of the shell of described installation method are the material of high-termal conductivity.The raw material of the shell of described installation method are aluminium or copper.The installation method of described encapsulated LED is as illuminator.Described illuminator is shot-light or portable torch.Described illuminator is a MR16 type shot-light.Described illuminator is portable torch.
Above content be in conjunction with concrete embodiment to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.

Claims (8)

1. mounting structure of encapsulated LED comprises shell and encapsulated LED, and it is characterized in that: described encapsulated LED is directly installed on described shell.
2. the mounting structure of encapsulated LED according to claim 1 is characterized in that: described encapsulated LED directly is welded on described shell by the tin slurry.
3. the mounting structure of encapsulated LED according to claim 2 is characterized in that: described shell has guide hole, the described guide hole of described tin slurry filling.
4. the mounting structure of encapsulated LED according to claim 2 is characterized in that: described shell also has at least one louvre.
5. the mounting structure of encapsulated LED according to claim 1 is characterized in that: described shell is a heat carrier.
6. the mounting structure of encapsulated LED according to claim 5 is characterized in that: described shell is aluminum shell or copper shell.
7. the mounting structure of encapsulated LED according to claim 1 is characterized in that: described shell is a radiator.
8. a LED illuminator is characterized in that: the mounting structure that comprises any described encapsulated LED among the claim 1-7.
CN2010202385025U 2010-06-25 2010-06-25 Mounting structure of packaged LED and LED illumination system Expired - Fee Related CN201706426U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202385025U CN201706426U (en) 2010-06-25 2010-06-25 Mounting structure of packaged LED and LED illumination system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2010202385025U CN201706426U (en) 2010-06-25 2010-06-25 Mounting structure of packaged LED and LED illumination system
PCT/CN2011/076177 WO2011160592A1 (en) 2010-06-25 2011-06-23 Mounting structure of packaged led and led illumination system

Publications (1)

Publication Number Publication Date
CN201706426U true CN201706426U (en) 2011-01-12

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Country Status (2)

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CN (1) CN201706426U (en)
WO (1) WO2011160592A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011160592A1 (en) * 2010-06-25 2011-12-29 Wu Sau Mui Mounting structure of packaged led and led illumination system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080007961A (en) * 2006-07-19 2008-01-23 알티전자 주식회사 Cooling device of led module and manufacturing method thereof
CN201057450Y (en) * 2007-04-03 2008-05-07 宁翔科技股份有限公司 LED lamp structure
CN201166324Y (en) * 2008-01-22 2008-12-17 和谐光电科技(泉州)有限公司 Encapsulated circuit using LED chip light fitting
CN201155735Y (en) * 2008-02-04 2008-11-26 何永祥 High power light-emitting diode adopting porous metal material as heat radiating device
CN201262377Y (en) * 2008-09-02 2009-06-24 铜陵市毅远电光源有限责任公司 White light LED with good color rendering and high illumination efficiency
CN101382265A (en) * 2008-10-24 2009-03-11 四川新力光源有限公司 LED light source and lamp thereof
CN201349020Y (en) * 2008-12-22 2009-11-18 于正国 Packaged large-power LED with radiator
CN201391774Y (en) * 2009-04-10 2010-01-27 鑫谷光电股份有限公司 Illumination lamp formed by polyhedral high-power LED
CN101660678B (en) * 2009-09-09 2011-03-30 史杰 Method for packaging white LED light source module
CN101672441A (en) * 2009-10-21 2010-03-17 苏州中泽光电科技有限公司 Low thermal resistance LED light source module
CN201651909U (en) * 2010-03-30 2010-11-24 昆山冠辉精密电子有限公司 Led fluorescent lamp tube
CN101886793A (en) * 2010-06-25 2010-11-17 胡秀梅 Method for assembling encapsulated LED
CN201706426U (en) * 2010-06-25 2011-01-12 胡秀梅 Mounting structure of packaged LED and LED illumination system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011160592A1 (en) * 2010-06-25 2011-12-29 Wu Sau Mui Mounting structure of packaged led and led illumination system

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Publication number Publication date
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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110112

Termination date: 20150625

EXPY Termination of patent right or utility model