CN201351881Y - High-power LED lamp - Google Patents
High-power LED lamp Download PDFInfo
- Publication number
- CN201351881Y CN201351881Y CNU2009201138259U CN200920113825U CN201351881Y CN 201351881 Y CN201351881 Y CN 201351881Y CN U2009201138259 U CNU2009201138259 U CN U2009201138259U CN 200920113825 U CN200920113825 U CN 200920113825U CN 201351881 Y CN201351881 Y CN 201351881Y
- Authority
- CN
- China
- Prior art keywords
- radiator
- led
- wiring board
- projection
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses a high-power LED lamp comprising a radiator and a plurality of LEDs. The anodes and cathodes of the plurality of the LEDs are welded on a circuit board; the positioning position of each LED on the circuit board is provided with a through hole; and heat sink of the LEDs is directly contacted with the plane of the radiator relative to the circuit board by the through holes and directly transfers heat generated by the LEDs to the radiator for heat dissipation. The further technical proposal is as follows: the plane of the radiator relative to the circuit board is provided with a plurality of convex bosses matched with the through holes on the circuit board, the circuit board is sheathed on the convex bosses to integrally connected with the radiator; and the heat sink of the LEDs is directly contacted with the convex bosses of the radiator. The high-power LED lamp is particularly applicable to super heat conducting high-power LED lamps.
Description
Technical field
The utility model relates to a kind of LED high-power illumination lamp, relates in particular to the interior LED of light fixture to the heat transfer structure between radiator.
Background technology
At present, light emitting diode high-power illumination lamp (being called for short LED high-power illumination lamp) is interior to be notch cuttype from LED to the heat transfer type between radiator, heat is passed to by welding by LED earlier and cover copper aluminium base (or copper base), pass to radiating gasket (or heat-conducting glue) then, pass to radiator at last.This heat transfer type (structure) except that the thermal conductivity of two kinds of materials itself low and thermal resistance greatly, also have interface resistance, therefore, heat-transfer effect is not good.Research to this conduction technique at present biases toward the insulation heat-conducting property that how to improve these two kinds of materials, promptly seeks the higher dielectric layer of insulating heat-conductive rate and radiating gasket or heat-conducting glue, but progress is little all the time.Up to the present, the highest 8W/mk that just reaches of the thermal conductivity of the two material also belongs to war products, and that can buy on the market has only 4W/mk.Obviously,, be difficult to realize the miniaturization truly of LED high-power illumination lamp, more can't improve the due energy-saving effect of light fixture and longer service life if thoroughly do not change existing heat transfer type and heat transfer structure.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of LED high-power illumination lamp, and it can improve the defective that LED in the existing LED high-power illumination lamp exists to the heat transfer type between radiator and heat transfer structure.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is to remove to cover copper aluminium base (or copper base) and radiating gasket (heat-conducting glue) on the traditional structure, LED (heat sink) is directly welded or is bonded on the radiator, make that LED is heat sink directly to be contacted with radiator, the heat that LED is produced directly dispels the heat to heat sink.The LED high-power illumination lamp of this structure comprises radiator and several LED, the positive and negative polarities welding of described several LED in the circuit board, the place, location of each LED on the described wiring board is provided with through hole, and the heat sink of LED directly contacts with the plane of radiator with respect to wiring board by through hole.
The further technical scheme of the utility model is: described radiator is provided with the projection that several match with through hole on the wiring board with respect to the plane of wiring board, wiring board is sleeved on the projection to be linked to be with radiator and is one, and the projection of the heat sink and radiator of LED directly contacts.The heat sink welding of LED or be bonded on the projection of radiator, well-separated with the conducting wire on the wiring board, form a special-purpose heat transfer path, and wiring board combines compact and reasonable more with radiator.
Adopt technique scheme, make to the utlity model has following beneficial effect: 1,, LED and radiator are fused owing to directly contact LED is heat sink with radiator, make fitting structure more simply, reasonable; 2, except that the thermal resistance of LED and radiator itself, there is not other any thermal resistance, reduce the thermal resistance in the heat transfer path significantly, greatly promote the integral heat sink ability of high-power LED illuminating lamp, prolong the service life of LED illuminating lamp; 3, save expensive thermal conductivity aluminum matrix plate and radiating gasket in the traditional structure, saved material, reduced cost; 4, because designs simplification can reduce small product size and weight, make product more tend to miniaturization, the high-altitude is used safer.The utility model is particularly useful for superconduction pattern of fever LED high-power illumination lamp.
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the utility model LED high-power illumination lamp.
Drawing explanation: 1, radiator, 2, projection, 3, wiring board, 4, LED, 5, cloche, 6, nut, 7, sealing ring, 8, screw, 9, pressure ring, 10, reinforcement, 11, electrode, 12, heat sink.
The specific embodiment
Embodiment as shown in Figure 1 is a kind of superconduction pattern of fever LED high-power illumination lamp, comprise radiator 1, single face copper coating board 3, welding several LED4 and cloche 5 in the circuit board, wiring board 3 cover copper face radiator 1 dorsad, each place, LED location on the wiring board 3 is provided with through hole (not marking among the figure), the sizableness that through hole and LED are heat sink, radiator 1 is provided with several projections 2 that matches with through hole on the wiring board 3, the height of the thickness of wiring board 3 and projection 2 is suitable, projection 2 and radiator 1 one-step die casting, wiring board 3 is sleeved on the projection 2 by through hole, make wiring board and projection form a plane, promptly fuse with radiator 1, and at the periphery of wiring board with viscose glue or screw is fixing a little gets final product, heat sink 12 and the positive and negative electrode 11 of LED are welded on respectively on the projection 2 and wiring board 3 of radiator with reflow soldering process with the low melting point brazing filler metal alloy, perhaps heat sink 12 of LED are bonded on the projection 2 of radiator with highly heat-conductive material.LED quantity is selected according to the illuminating lamp watt level, and through hole and the projection on the radiator on the wiring board are consistent with LED quantity.Cloche 5 is with sealing ring 7, by pressure ring 9 and screw 8, nut 6 cloche is fixed on the radiator 1.For strengthening the overall mechanical strength of illuminating lamp, reinforcement 10 is set at the edge of radiator 1.
This LED high-power illumination lamp manufacturing process is as follows: projection 2 with certain altitude together with radiator 1 disposable die cast; Circuit on wiring board 3 cloth that thickness is suitable with the projection height, and at place, the LED location cutting through hole bigger slightly than projection 2; Above-mentioned radiator 1 with wiring board 3 suits, and is coated viscose glue at the periphery of wiring board, wiring board and radiator are fixed, or both are fixed by screw; Heat sink 12 and the positive and negative electrode 11 of LED are welded on respectively on the projection 2 and wiring board 3 of radiator with reflow soldering process with the low melting point brazing filler metal alloy, perhaps heat sink 12 of LED are bonded on the projection 2 of radiator with highly heat-conductive material; Sealing ring 7 is enclosed within on the cloche 5, with screw 8 and nut 6 pressure ring 9 is screwed and get final product.
Claims (4)
1, a kind of LED high-power illumination lamp, comprise radiator and several LED, the positive and negative polarities that it is characterized in that described several LED weld in the circuit board, the place, location of each LED on the described wiring board is provided with through hole, and the heat sink of LED directly contacts with the plane of radiator with respect to wiring board by through hole.
2, LED high-power illumination lamp according to claim 1, it is characterized in that described radiator is provided with the projection that several match with through hole on the wiring board with respect to the plane of wiring board, wiring board is sleeved on the projection and is integral with radiator, and the projection of the heat sink and radiator of LED directly contacts.
3, LED high-power illumination lamp according to claim 2 is characterized in that the height of the thickness of described wiring board and projection is suitable.
4, according to claim 2 or 3 described LED high-power illumination lamps, it is characterized in that described projection and radiator one-step die casting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201138259U CN201351881Y (en) | 2009-02-12 | 2009-02-12 | High-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201138259U CN201351881Y (en) | 2009-02-12 | 2009-02-12 | High-power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201351881Y true CN201351881Y (en) | 2009-11-25 |
Family
ID=41375269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009201138259U Expired - Fee Related CN201351881Y (en) | 2009-02-12 | 2009-02-12 | High-power LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201351881Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889561A (en) * | 2012-09-12 | 2013-01-23 | 广东宏泰照明科技有限公司 | High-power LED (light-emitting diode) thermoelectric separation structure |
| CN103100770A (en) * | 2013-03-06 | 2013-05-15 | 林秀林 | Welding process of electronic component assembly |
-
2009
- 2009-02-12 CN CNU2009201138259U patent/CN201351881Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889561A (en) * | 2012-09-12 | 2013-01-23 | 广东宏泰照明科技有限公司 | High-power LED (light-emitting diode) thermoelectric separation structure |
| CN103100770A (en) * | 2013-03-06 | 2013-05-15 | 林秀林 | Welding process of electronic component assembly |
| CN103100770B (en) * | 2013-03-06 | 2015-01-28 | 林秀林 | Welding process of electronic component assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091125 Termination date: 20170212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |