CN201708182U - Ceramic substrate for LED lamps - Google Patents
Ceramic substrate for LED lamps Download PDFInfo
- Publication number
- CN201708182U CN201708182U CN2010201630778U CN201020163077U CN201708182U CN 201708182 U CN201708182 U CN 201708182U CN 2010201630778 U CN2010201630778 U CN 2010201630778U CN 201020163077 U CN201020163077 U CN 201020163077U CN 201708182 U CN201708182 U CN 201708182U
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- ceramic
- led lamps
- substrate
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model relates to a ceramic substrate, in particular to a ceramic substrate for LED lamps, which belongs to a component in an LED lamp. The existing capsulation substrate used in LED lamps has the shortcomings that 1, after being filled with insulation materials, the capsulation substrate is poor in thermal conductivity and not favorable for heat dissipation and service lives of the LED lamps are shortened; and 2, only the insulation materials are filled between an aluminum base and a circuit board, and then overall high-pressure resistance of the capsulation substrate is poor. The ceramic substrate for LED lamps is characterized in that the ceramic substrate comprises a ceramic base, a cylindrical mounting cavity is disposed in the ceramic base, and the bottom of the mounting cavity is provided with two cylindrical threading through holes. The ceramic substrate is reasonable in structural design, low in production cost and fine in heat conductivity, can resist high pressure and can enhance overall performance of LED lamps.
Description
Technical field
The utility model relates to a kind of ceramic substrate, especially relates to a kind of ceramic substrate of the LED of being used for lamp, belongs to parts in the LED lamp.
Background technology
The base plate for packaging that is used for the LED lamp at present adopts the metal aluminium to form as main material manufacturing usually, fill insulant between aluminium base and the circuit board, there is following shortcoming in this class base plate for packaging: 1, behind the fill insulant, heat conductivility is poor, be unfavorable for heat radiation, shortened the useful life of LED lamp; 2, fill insulant only between aluminium base and the circuit board causes whole high-voltage resistance capability poor.
Because the base plate for packaging that is used for high-powered LED lamp has bigger influence to the performance of LED lamp, such as the thermal conductivity of this base plate for packaging, high-voltage resistance capability to the quality of LED lamp and great influence is all arranged useful life, along with the continuous popularization of little, the high-power LED lamp of volume, existing aluminium base can not satisfy the development need of LED lamp at present.
Summary of the invention
The purpose of this utility model is to overcome above shortcomings in the prior art, and a kind of reasonable in design is provided, and production cost is low, and good heat conductivity can promote the ceramic substrate that is used for the LED lamp of LED lamp overall performance.
The technical scheme in the invention for solving the above technical problem is: these characteristics that are used for the ceramic substrate of LED lamp are: comprise base of ceramic, be provided with a columned installation cavity in the described base of ceramic, the bottom of this installation cavity is provided with two threading via holes, and the shape of described threading via hole is cylindrical.
Base of ceramic described in the utility model is the cermet material.
The bottom surface of threading via hole described in the utility model and base of ceramic is perpendicular.
The utility model compared with prior art has the following advantages and effect: good heat conductivity, be beneficial to heat radiation, and can effectively prolong the useful life of LED lamp; High-voltage resistance capability is strong, can effectively promote the overall performance of LED lamp, especially can effectively promote the overall performance of high-powered LED lamp.
Of the present utility model simple in structure, reasonable in design, manufacturing process is simple, and production cost is low, can be high pressure resistant, and heat conduction and good heat dissipation effect, the LED lamp can meet the requirement of CE authentication.
Description of drawings
Fig. 1 is the main TV structure schematic diagram of the utility model embodiment;
Fig. 2 is the structural representation of looking up of Fig. 1.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and by embodiment, and following examples are to explanation of the present utility model and the utility model is not limited to following examples.
Embodiment:
Referring to Fig. 1 and Fig. 2, the ceramic substrate that is used for the LED lamp in the present embodiment comprises base of ceramic 1, this base of ceramic 1 adopts the cermet manufacturing to form, in base of ceramic 1, be provided with a columned installation cavity 2, be provided with a threading via hole 3 and No. two threading via holes 4 in the bottom of installation cavity 2, the bottom that is to say installation cavity 2 is provided with two threading via holes, the shape of this threading via hole 3 and No. two threading via holes 4 is cylindrical, and a threading via hole 3 and No. two threading via holes 4 are all perpendicular with the bottom surface of base of ceramic 1.
The ceramic substrate structure that is used for the LED lamp in the present embodiment is reasonable in design, and manufacturing process is simple, and production cost is low; This ceramic substrate can be high pressure resistant, and good heat conductivity is beneficial to heat radiation, can effectively promote the overall performance of LED lamp, makes the requirement that the LED lamp that forms can meet the CE authentication.
Above content described in this specification only is to the explanation of the utility model structure example.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment; only otherwise depart from structure of the present utility model or surmount the defined scope of these claims, all should belong to protection range of the present utility model.
Claims (3)
1. ceramic substrate that is used for the LED lamp, it is characterized in that: comprise base of ceramic, be provided with a columned installation cavity in the described base of ceramic, the bottom of this installation cavity is provided with two threading via holes, and the shape of described threading via hole is cylindrical.
2. the ceramic substrate that is used for the LED lamp according to claim 1 is characterized in that: described base of ceramic is the cermet material.
3. the ceramic substrate that is used for the LED lamp according to claim 1 and 2 is characterized in that: the bottom surface of described threading via hole and base of ceramic is perpendicular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201630778U CN201708182U (en) | 2010-04-19 | 2010-04-19 | Ceramic substrate for LED lamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201630778U CN201708182U (en) | 2010-04-19 | 2010-04-19 | Ceramic substrate for LED lamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201708182U true CN201708182U (en) | 2011-01-12 |
Family
ID=43445336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201630778U Expired - Fee Related CN201708182U (en) | 2010-04-19 | 2010-04-19 | Ceramic substrate for LED lamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201708182U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103304276A (en) * | 2012-03-14 | 2013-09-18 | 比亚迪股份有限公司 | Method for metalizing ceramic substrate surface and high-power LED (light-emitting display) base |
-
2010
- 2010-04-19 CN CN2010201630778U patent/CN201708182U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103304276A (en) * | 2012-03-14 | 2013-09-18 | 比亚迪股份有限公司 | Method for metalizing ceramic substrate surface and high-power LED (light-emitting display) base |
| CN103304276B (en) * | 2012-03-14 | 2015-11-25 | 比亚迪股份有限公司 | A kind of metallized method of ceramic base plate surface and a kind of great power LED base |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203136323U (en) | Metal core printed circuit board for LED installation | |
| CN101752354A (en) | Packaging substrate structure for LED and production method thereof | |
| CN106298758B (en) | A kind of SMD power device integrated morphology applied to electric car electric control product | |
| CN203104941U (en) | A double-surface aluminum core circuit board | |
| CN202009033U (en) | Aluminum baseplate for LED lighting unit board | |
| CN202948970U (en) | Improved heat conduction light emitting diode (LED) substrate | |
| CN201708182U (en) | Ceramic substrate for LED lamps | |
| CN201601146U (en) | Light-emitting diode (LED) | |
| CN204966543U (en) | Novel composite metal material base plate | |
| CN206365131U (en) | A kind of circuit board of quick heat radiating | |
| CN201708183U (en) | Ceramic aluminum substrate for LED lamp | |
| CN201547554U (en) | High power LED lamp panel | |
| CN202127039U (en) | Light-emitting diode (LED) metallic support, LED, LED display screen and LED lamp | |
| CN201555191U (en) | LED radiating device | |
| CN204268256U (en) | Backlight module and display unit | |
| CN201706263U (en) | LED lamp provided with silicon wafer substrate | |
| CN201706427U (en) | Metalized ceramic mounting base used for mounting LED lamp | |
| CN202487657U (en) | Composite type light-emitting diode (LED) package substrate | |
| CN201854497U (en) | Improved circuit board | |
| CN202678401U (en) | Packaging structure for high-power LED | |
| CN202425193U (en) | Aluminium-based circuit board | |
| CN206329932U (en) | A kind of high and pressure-resistant LED aluminum base plate of electrical strength | |
| CN201487652U (en) | LED lamp | |
| CN202651197U (en) | A ceramic substrate used for a LED lamp | |
| CN203165885U (en) | Plastic packaging type rectifier bridge |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WUJIANG NEW LANDMARK ENERGY SAVING LIGHTING TECHNO Free format text: FORMER OWNER: JIAXING KUANGYI NEW LIGHTING TECHNOLOGY CO., LTD. Effective date: 20120220 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 314000 JIAXING, ZHEJIANG PROVINCE TO: 215211 SUZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120220 Address after: 215211 Jiangsu city of Suzhou province Wujiang FenHu, FENHU Road on the eastern side of No. 2 Bridge Patentee after: Wujiang new landmark energy saving light source technology Co., Ltd. Address before: The new rural road in Xiuzhou District of Jiaxing City, Zhejiang province 314000 No. 399 Faldan Gerui Park 6 Building Patentee before: Jiaxing Kuangyi New Light Source Technology Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20140419 |