CN201487652U - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN201487652U CN201487652U CN2009201903698U CN200920190369U CN201487652U CN 201487652 U CN201487652 U CN 201487652U CN 2009201903698 U CN2009201903698 U CN 2009201903698U CN 200920190369 U CN200920190369 U CN 200920190369U CN 201487652 U CN201487652 U CN 201487652U
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- CN
- China
- Prior art keywords
- heat
- led chip
- conducting layer
- pcb board
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Radiation-Therapy Devices (AREA)
Abstract
The utility model discloses an LED lamp, which comprises an LED chip; a pin of the LED chip is connected to a PCB board; the outside of the PCB board is provided with a radiator; the LED lamp also comprises a heat conducting layer which is arranged between the LED chip and the PCB board and is attached to the PCB board; the pin of the LED chip passes through the heat conducting layer in a relative insulation way; and the heat conducting layer extends all around and is attached to the radiator. The utility model provides the LED lamp with good radiating effect.
Description
Technical field
The utility model relates to a kind of lighting LED lamp, relates in particular to a kind of radiator structure of LED lamp.
Background technology
Advantages such as the LED lamp relies on that it is low in energy consumption, long service life, pollution-free, radiationless, no stroboscopic are extensively favored, and its technology has obtained develop rapidly in recent years.
Present known LED lamp, its structure comprises pcb board, and led chip is welded on the pcb board, and the arranged outside of pcb board has radiator.The LED lamp is when work, and the heat that led chip distributes is transmitted on the pcb board, heat is distributed by radiator by pcb board again.But because the pcb board pyroconductivity is not high, heat rests on the fritter pcb board of led chip below for a long time, and radiating rate is slow.Make that the pcb board local temperature is higher, cause the led chip long-term work in the environment of temperature drift, quickened product aging, shortened life of product.
The utility model content
The utility model provides a kind of LED lamp of good heat dissipation effect at deficiency of the prior art.
In order to solve the problems of the technologies described above, the utility model is solved by following technical proposals:
A kind of LED lamp, comprise led chip, the pin of led chip is connected on the pcb board, the arranged outside of pcb board has radiator, also comprises heat-conducting layer, and described heat-conducting layer is arranged between led chip and the pcb board, and fit with pcb board, the pin of led chip passes heat-conducting layer with insulating relatively, heat-conducting layer to around extend, and fit with radiator.The heat that led chip distributes, sub-fraction is transmitted to the pcb board of led chip below by the pin of led chip, be transmitted to heat-conducting layer by pcb board again, another major part is directly transferred to heat-conducting layer by led chip bottom, is transmitted to the radiator of periphery rapidly and distributes through heat-conducting layer.Because the pyroconductivity of heat-conducting layer is far longer than the pyroconductivity of pcb board, therefore, have only a spot of heat by pcb board to around distribute, and conduct to radiator heat-dissipation, the heat of the overwhelming majority then conducts to radiator and heat radiation rapidly through heat-conducting layer, good heat dissipation effect, and can eliminate the localized hyperthermia of pcb board quickly and effectively.
In the technique scheme, described heat-conducting layer is provided with through hole, and the aperture of through hole is greater than the external diameter of led chip pin, and through hole is passed in the pin noncontact of led chip.The pin that makes heat-conducting layer and led chip is by the air mutually insulated.
In the technique scheme, described heat-conducting layer is a graphite linings, adopts the high expanded graphite meterial of plane pyroconductivity, optimizes heat-conducting effect.
In the technique scheme, the bottom surface of described led chip has metal base plate, and described metal base plate and heat-conducting layer are fitted, and most of heat that led chip is distributed is transmitted to heat-conducting layer rapidly by metal base plate, further improves radiating effect.
In the technique scheme, the upper surface of described heat-conducting layer not by the led chip cover part, also is fitted with reflective material layer, can increase the brightness of LED lamp.
In the technique scheme, described reflective material layer is an aluminium foil layer.
Beneficial effect: the utility model compared with prior art has following beneficial effect:
(1) the utility model is by being provided with the high graphite linings of plane pyroconductivity between led chip and pcb board, and the side of graphite linings directly links to each other with the radiator in the outside, improved the radiating effect of product greatly.
(2) bottom surface of the utility model led chip is provided with metal base plate, and metal base plate is direct and graphite linings fits, and has further improved the radiating effect of product.
(3) the utility model is fitted with reflectorized material at the upper surface of graphite linings, has improved the brightness of LED lamp.
(4) the utility model need not to change the circuit design of existing LED lamp, and as long as structure is done slight variations just can reach good heat-radiation effect, is easy to implement.
(5) the used graphite linings of the utility model has excellent heat conductivility in in-plane, can eliminate the localized hyperthermia district on the pcb board effectively, makes Temperature Distribution more even, has increased the radiating effect of radiator and whole system effectively.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the H place enlarged drawing of Fig. 1.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is described in further detail:
Referring to accompanying drawing 1～2, a kind of LED lamp comprises led chip 1, and the pin 11 of led chip is welded on the pcb board 3.As required, led chip 1 can be for one or more.The arranged outside of pcb board 3 has radiator 5, and this radiator 5 can be traditional metal fin formula or liquid-cooling type cold drawing.
In at present common LED lamp, the heat that led chip distributes is transmitted on the pcb board, again by pcb board to around distribute, be transmitted to radiator and dispel the heat.But because the pcb board pyroconductivity is not high, distribute heat rapidly, therefore, heat rests on the fritter pcb board of led chip below for a long time, forms the localized hyperthermia district, makes the led chip long-term work in the environment of temperature drift, wears out easily.
The utility model is as improvement, the high heat-conducting layer 7 of the layer plane pyroconductivity of on pcb board 3, having fitted, this heat-conducting layer 7 is a graphite linings, be that the plane pyroconductivity can be up to the expanded graphite meterial of 400-600W/mK, graphite linings can use glue to be bonded on the pcb board 3, also can use screw, press strip etc. to carry out mechanical connection.Graphite linings is provided with through hole 71, and the aperture of through hole 71 is greater than the external diameter of led chip pin 11, and through hole 71 is passed in pin 11 noncontacts of led chip, makes 11 of the pins of graphite linings and led chip pass through the air mutually insulated.Certainly, also can use other insulation processing mode, as, adopt modes such as insulating trip is set in the relevant position that through hole 71 contacts with pin 11 to carry out electrical isolation.Heat-conducting layer 7 to around extend, and fit with radiator 5.Like this, the heat that led chip 1 distributes, sub-fraction is transmitted to the pcb board 3 of led chip 1 below by the pin 11 of led chip, be transmitted to heat-conducting layer 7 by pcb board 3 again, another major part is directly transferred to heat-conducting layer 7 by led chip bottom, is transmitted to the radiator 5 of periphery rapidly and distributes through heat-conducting layer 7.Because the pyroconductivity of heat-conducting layer 7 is far longer than the pyroconductivity of pcb board 3, therefore, have only a spot of heat by pcb board 3 to around distribute, and conduct to radiator 5 heat radiation, the heat of the overwhelming majority then conducts to radiator 5 and heat radiation rapidly through heat-conducting layer 7,, increased the radiating effect of radiator 5 and whole system effectively, and can eliminate the localized hyperthermia of pcb board 3 quickly and effectively, make uniformity of temperature profile.
As preferably, the bottom surface of described led chip 1 has metal base plate 13, in concrete enforcement, one deck cohesive body 17 can be set at the upper surface of metal base plate 13, then, and above led chip 1 is bonded in.Described metal base plate 13 fits tightly with heat-conducting layer 7, and like this, most of heat that led chip 1 distributes can directly be transmitted to heat-conducting layer 7 rapidly by metal base plate 13, further improves radiating effect.
As further improvement, the upper surface of described heat-conducting layer 7 not by led chip 1 cover part, also is fitted with aluminium foil or other reflective material layers 9, to increase the brightness of LED lamp.
The utility model LED lamp, its good heat dissipation effect, led chip 1 long-term work has guaranteed quality and the life-span of product in good environment.
Claims (6)
1. LED lamp, comprise led chip (1), the pin of led chip (11) is connected on the pcb board (3), and the arranged outside of pcb board (3) has radiator (5), it is characterized in that, also comprise heat-conducting layer (7), described heat-conducting layer (7) is arranged between led chip (1) and the pcb board (3), and fits with pcb board (3), and the pin of led chip (11) relatively insulation passes heat-conducting layer (7), heat-conducting layer (7) to around extend, and fit with radiator (5).
2. LED lamp according to claim 1 is characterized in that, described heat-conducting layer (7) is provided with through hole (71), and the aperture of through hole (71) is greater than the external diameter of led chip pin (11), and through hole (71) is passed in the pin of led chip (11) noncontact.
3. LED lamp according to claim 1 is characterized in that, described heat-conducting layer (7) is a graphite linings.
4. according to claim 1 or 2 or 3 described LED lamps, it is characterized in that the bottom surface of described led chip (1) has metal base plate (13), described metal base plate (13) is fitted with heat-conducting layer (7).
5. according to claim 1 or 2 or 3 described LED lamps, it is characterized in that the upper surface of described heat-conducting layer (7) by led chip (1) cover part, also is not fitted with reflective material layer (9).
6. LED lamp according to claim 5 is characterized in that, described reflective material layer (9) is an aluminium foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201903698U CN201487652U (en) | 2009-07-31 | 2009-07-31 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201903698U CN201487652U (en) | 2009-07-31 | 2009-07-31 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201487652U true CN201487652U (en) | 2010-05-26 |
Family
ID=42426531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201903698U Expired - Fee Related CN201487652U (en) | 2009-07-31 | 2009-07-31 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201487652U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103322457A (en) * | 2013-06-26 | 2013-09-25 | 合肥京东方光电科技有限公司 | Light bar, backlight module and display device |
| WO2014127593A1 (en) * | 2013-02-08 | 2014-08-28 | 世光国际贸易有限公司 | Led lighting |
-
2009
- 2009-07-31 CN CN2009201903698U patent/CN201487652U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014127593A1 (en) * | 2013-02-08 | 2014-08-28 | 世光国际贸易有限公司 | Led lighting |
| CN103322457A (en) * | 2013-06-26 | 2013-09-25 | 合肥京东方光电科技有限公司 | Light bar, backlight module and display device |
| CN103322457B (en) * | 2013-06-26 | 2015-04-01 | 合肥京东方光电科技有限公司 | Light bar, backlight module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20140731 |
|
| EXPY | Termination of patent right or utility model |