CN201854497U - Improved circuit board - Google Patents
Improved circuit board Download PDFInfo
- Publication number
- CN201854497U CN201854497U CN2010205396680U CN201020539668U CN201854497U CN 201854497 U CN201854497 U CN 201854497U CN 2010205396680 U CN2010205396680 U CN 2010205396680U CN 201020539668 U CN201020539668 U CN 201020539668U CN 201854497 U CN201854497 U CN 201854497U
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- circuit board
- improved circuit
- resin board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an improved circuit board, which comprises a substrate including an epoxy resin board and copper layers. The copper layers are arranged on two sides of the epoxy resin board and provided with more than two through holes evenly after being combined with the epoxy resin board; and copper with high heat conductivity is arranged in the through holes. The improved circuit board adopts the epoxy resin board to replace an aluminum board, reduces raw material cost, can save cost by 20%, and can achieve needed heat dissipation performance by arranging the through holes with copper with high heat conductivity inside.
Description
Technical field
The utility model relates to a kind of circuit board, and particularly a kind of improved circuit board that has improved substrate material and structure belongs to electronic technology field.
Background technology
In the prior art, circuit board as shown in Figure 1 comprises base material usually; Described base material comprises aluminium sheet 1, insulating barrier 2, copper layer 3; Described insulating barrier 2 is arranged on the aluminium sheet 1; Described copper layer 3 is arranged on the insulating barrier 2; Sort circuit plate area is big, because the raw material expense of aluminium sheet is expensive, so the manufacturing cost height.
The utility model content
The utility model purpose is to have proposed a kind of improved circuit board that has improved substrate material and structure in order to overcome the deficiencies in the prior art.
For achieving the above object, the technical solution adopted in the utility model is: a kind of improved circuit board comprises base material; Described base material comprises epoxy resin board, copper layer; Described copper layer is arranged on the both sides of epoxy resin board; Described copper layer with 2 above through holes evenly are set after epoxy resin board combines; Be provided with high heat-conducting copper in the described through hole.
Preferably, around the structure after described through hole evenly is arranged on the copper layer and epoxy resin board combines.
Preferably, described through hole is more than 8.
Because the utilization of technique scheme, the utility model compared with prior art has following advantage:
Improved circuit board of the present utility model adopts epoxy resin board to replace aluminium sheet, has reduced cost of material, cost-saved 20%; By through hole is set, in the described through hole high heat-conducting copper is set simultaneously, can reaches the heat dispersion that needs are set.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Accompanying drawing 1 is the cutaway view of the circuit board of prior art;
Accompanying drawing 2 is the cutaway view of improved circuit board of the present utility model;
Wherein: 1, aluminium sheet; 2, insulating barrier; 3, copper layer; 10, copper layer; 11, epoxy resin board; 12, through hole; 13, high heat-conducting copper.
Embodiment
Be a kind of improved circuit board described in the utility model as shown in Figure 2, comprise base material; Described base material comprises epoxy resin board 11, copper layer 10; Described copper layer 10 is arranged on the both sides of epoxy resin board 11; Described copper layer 10 with evenly be provided with through hole 12 after epoxy resin board 11 combines; Be provided with high heat-conducting copper 13 in the described through hole 12; Around the structure after described through hole 12 evenly is arranged on copper layer 10 and epoxy resin board 11 combines; Described through hole 12 is 12.
Because the utilization of technique scheme, the utility model compared with prior art has following advantage:
Improved circuit board of the present utility model adopts epoxy resin board to replace aluminium sheet, has reduced cost of material, cost-saved 20%; By through hole is set, in the described through hole high heat-conducting copper is set simultaneously, can reaches the heat dispersion that needs are set.
Below only be concrete exemplary applications of the present utility model, protection range of the present utility model is not constituted any limitation.All employing equivalents or equivalence are replaced and the technical scheme of formation, or any to move mode dull and stereotyped described in the utility model, all drop within the utility model rights protection scope.
Claims (3)
1. an improved circuit board is characterized in that: comprise base material; Described base material comprises epoxy resin board, copper layer; Described copper layer is arranged on the both sides of epoxy resin board; Described copper layer with 2 above through holes evenly are set after epoxy resin board combines; Be provided with high heat-conducting copper in the described through hole.
2. improved circuit board according to claim 1 is characterized in that: around the structure after described through hole evenly is arranged on the copper layer and epoxy resin board combines.
3. improved circuit board according to claim 1 is characterized in that: described through hole is more than 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205396680U CN201854497U (en) | 2010-09-20 | 2010-09-20 | Improved circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205396680U CN201854497U (en) | 2010-09-20 | 2010-09-20 | Improved circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201854497U true CN201854497U (en) | 2011-06-01 |
Family
ID=44096874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205396680U Expired - Fee Related CN201854497U (en) | 2010-09-20 | 2010-09-20 | Improved circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201854497U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421242A (en) * | 2011-08-08 | 2012-04-18 | 慈溪市永旭丰泰电子科技有限公司 | Flanged brass circuit board |
-
2010
- 2010-09-20 CN CN2010205396680U patent/CN201854497U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421242A (en) * | 2011-08-08 | 2012-04-18 | 慈溪市永旭丰泰电子科技有限公司 | Flanged brass circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20140920 |
|
| EXPY | Termination of patent right or utility model |