CN209994614U - CEM-3 copper-clad plate with high CTI (comparative tracking index) - Google Patents
CEM-3 copper-clad plate with high CTI (comparative tracking index) Download PDFInfo
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- CN209994614U CN209994614U CN201822244690.1U CN201822244690U CN209994614U CN 209994614 U CN209994614 U CN 209994614U CN 201822244690 U CN201822244690 U CN 201822244690U CN 209994614 U CN209994614 U CN 209994614U
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- Prior art keywords
- layer
- insulating layer
- heat dissipation
- top surface
- copper
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- 239000011190 CEM-3 Substances 0.000 title claims abstract description 16
- 230000000052 comparative effect Effects 0.000 title description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- 239000000741 silica gel Substances 0.000 claims abstract description 6
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 6
- 238000005187 foaming Methods 0.000 claims abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 4
- 230000002209 hydrophobic effect Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 9
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 239000004576 sand Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
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Abstract
The utility model provides a CEM-3 copper-clad plate of high CTI, including base plate and the copper foil layer that covers at the base plate top surface, be equipped with first insulating layer, heat dissipation layer, second insulating layer in proper order below the base plate, the fixed first cylinder that is the matrix distribution that is equipped with of top surface of first insulating layer, first cylinder equipartition is in the top surface of first insulating layer, the top surface of first cylinder and the bottom surface of base plate bonding are fixed, the bottom surface of first insulating layer is fixed and is equipped with the second cylinder that is the matrix distribution, the second cylinder equipartition is in the bottom surface of first insulating layer, first cylinder and second cylinder structure as an organic whole; the top surface of the heat dissipation layer is fixedly bonded with the bottom surface of the second column body, and the heat dissipation layer is made of graphene; the bottom surface of the heat dissipation layer is fixedly bonded with the top surface of the second insulating layer, and the second insulating layer is a silica gel foaming plate; the copper clad laminate has good insulating property, can improve the insulating safety performance of the copper clad laminate, and the heat dissipation layer can provide good heat dissipation performance, prevent the damage of electronic components and prolong the service life.
Description
Technical Field
The utility model relates to a copper-clad plate field, more specifically relates to a CEM-3 copper-clad plate of high CTI.
Background
At present, with the development of electronic components, the performance requirements of a copper-clad plate serving as a main carrier of the electronic components are higher and higher, wherein the CTI of the copper-clad plate is one of the performance requirements, and the CTI is an index of the anti-tracking capability of the surface of an insulating material, namely a comparative tracking index, which can measure the insulating safety performance of the insulating material to a certain extent; and most of the existing copper-clad plates have insufficient heat dissipation performance, and are easy to cause the damage of electronic components and short in service life.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to solve the technical problem that a CEM-3 copper-clad plate of high CTI is proposed, its novel structure possesses good insulating properties, can improve the insulating safety performance of copper-clad plate to can provide better heat dispersion, prevent electronic components's damage, increase of service life.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a CEM-3 copper-clad plate of high CTI, including the base plate and cover the copper foil layer of base plate top surface, the below of base plate is equipped with first insulating layer, heat dissipation layer, second insulating layer in proper order, the fixed first cylinder that is the matrix distribution that is equipped with of top surface of first insulating layer, first cylinder equipartition in the top surface of first insulating layer, the top surface of first cylinder with the bottom surface bonding of base plate is fixed, the fixed second cylinder that is the matrix distribution that is equipped with of bottom surface of first insulating layer, second cylinder equipartition in the bottom surface of first insulating layer, first cylinder and the second cylinder structure as an organic whole; the top surface of the heat dissipation layer is fixedly bonded with the bottom surface of the second column body, and the heat dissipation layer is made of graphene; the bottom surface of the heat dissipation layer is fixedly bonded with the top surface of the second insulating layer, and the second insulating layer is a silica gel foaming plate.
The utility model discloses in the technical scheme of preferred, copper foil layer top surface reaches the bottom surface of second insulating layer all is equipped with the hydrophobic layer, the hydrophobic layer is formed by the spraying of hydrophobic coating.
The utility model discloses in the technical scheme of preferred, the heat dissipation layer is including first sheet board and the second sheet board that is parallel to each other, first sheet board with be equipped with many sand grips between the second sheet board, the even interval of sand grip sets up, first sheet board reaches the second sheet board passes through sand grip fixed connection, just first sheet board the sand grip reaches second sheet board structure as an organic whole.
In a preferred embodiment of the present invention, the first insulating layer is made of thermosetting phenol resin.
The utility model has the advantages that:
the utility model provides a CEM-3 copper-clad plate of high CTI, its novel structure, the design of first insulating layer and second insulating layer can make whole CEM-3 copper-clad plate possess good insulating properties, improves the insulating security performance of copper-clad plate, and wherein the second insulating layer is silica gel foaming board, can provide certain buffering, antidetonation effect; the design of the heat dissipation layer can improve better heat dissipation performance, and the first column body and the second column body are arranged on the first insulation layer, so that a gap is reserved between the first insulation layer and the substrate and between the first insulation layer and the heat dissipation layer, the heat dissipation effect can be further enhanced, the electronic components can be effectively prevented from being damaged, and the service life is prolonged.
Drawings
Fig. 1 is a schematic structural diagram of a CEM-3 copper-clad plate with high CTI provided in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation layer provided in an embodiment of the present invention.
In the figure:
100. a substrate; 200. a copper foil layer; 300. a first insulating layer; 310. a first column; 320. a second cylinder; 400. a heat dissipation layer; 410. a first sheet; 420. a second sheet; 430. a convex strip; 500. a second insulating layer; 600. a hydrophobic layer.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, the embodiment of the present invention discloses a high CTI CEM-3 copper clad laminate, including a substrate 100 and a copper foil layer 200 covering the top surface of the substrate 100, wherein a first insulating layer 300, a heat dissipation layer 400 and a second insulating layer 500 are sequentially disposed below the substrate 100, first pillars 310 distributed in a matrix are fixedly disposed on the top surface of the first insulating layer 300, the first pillars 310 are uniformly distributed on the top surface of the first insulating layer 300, the top surface of the first pillars 310 is fixedly bonded to the bottom surface of the substrate 100, second pillars 320 distributed in a matrix are fixedly disposed on the bottom surface of the first insulating layer 300, the second pillars 320 are uniformly distributed on the bottom surface of the first insulating layer 300, and the first insulating layer 300, the first pillars 310 and the second pillars 320 are an integrated structure; the top surface of the heat dissipation layer 400 is fixedly bonded with the bottom surface of the second cylinder 320, and the heat dissipation layer 400 is made of graphene; the bottom surface of the heat dissipation layer 400 is fixedly bonded to the top surface of the second insulation layer 500, and the second insulation layer 500 is a silica gel foam board.
The CEM-3 copper-clad plate with high CTI is novel in structure, the first insulating layer 300 and the second insulating layer 500 are designed to enable the whole CEM-3 copper-clad plate to have good insulating performance and improve the insulating safety performance of the copper-clad plate, and the second insulating layer 500 is a silica gel foaming plate and can provide certain buffering and anti-seismic effects; the heat dissipation layer 400 is designed to improve the heat dissipation performance, and the first column 310 and the second column 320 are disposed on the first insulating layer 300, so that a gap is left between the first insulating layer 300 and the substrate 100 and between the first insulating layer and the heat dissipation layer 400, the heat dissipation effect can be further enhanced, the damage of electronic components can be effectively prevented, and the service life can be prolonged.
Further, hydrophobic layers 600 are arranged on the top surface of the copper foil layer 200 and the bottom surface of the second insulating layer 500, and the hydrophobic layers 600 are formed by spraying hydrophobic paint; the hydrophobic layer is designed to prevent excessive water drops from adhering to the surface of the copper foil layer 200 in a humid environment, so that the problem of a circuit caused by the formation of a conductive channel on the surface of the copper foil layer 200 by the water drops is avoided, and a certain insulating effect is achieved; it should be noted that the hydrophobic coating can be purchased and used in the market.
Further, the heat dissipation layer 400 includes a first plate 410 and a second plate 420 that are parallel to each other, a plurality of protruding strips 430 are disposed between the first plate 410 and the second plate 420, the protruding strips 430 are uniformly spaced, the first plate 410 and the second plate 420 are fixedly connected through the protruding strips 430, and the first plate 410, the protruding strips 430, and the second plate 420 are an integrated structure; the heat dissipation layer 400 is designed to mainly improve the heat dissipation performance of the overall structure, and an overhead structure is formed among the first sheet 410, the second sheet 420 and the protruding strips 430, so that the heat dissipation effect can be effectively enhanced, the structural strength is enhanced to a certain extent, and the copper-clad plate is prevented from being easily broken.
Further, the first insulating layer 300 is made of a thermosetting phenol resin; the phenolic resin product has the advantages of stable size, heat resistance, flame retardance, good electrical insulation performance and the like, and the first insulation layer 300 is made of the material, so that excellent insulation performance can be guaranteed, and a certain heat resistance and flame retardance effect is provided.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (4)
1. The CEM-3 copper-clad plate with high CTI comprises a substrate (100) and a copper foil layer (200) coated on the top surface of the substrate (100), and is characterized in that:
a first insulating layer (300), a heat dissipation layer (400) and a second insulating layer (500) are sequentially arranged below the substrate (100), first cylinders (310) distributed in a matrix are fixedly arranged on the top surface of the first insulating layer (300), the first cylinders (310) are uniformly distributed on the top surface of the first insulating layer (300), the top surface of the first cylinders (310) is fixedly bonded with the bottom surface of the substrate (100), second cylinders (320) distributed in a matrix are fixedly arranged on the bottom surface of the first insulating layer (300), the second cylinders (320) are uniformly distributed on the bottom surface of the first insulating layer (300), and the first insulating layer (300), the first cylinders (310) and the second cylinders (320) are of an integrated structure; the top surface of the heat dissipation layer (400) is fixedly bonded with the bottom surface of the second cylinder (320), and the heat dissipation layer (400) is made of graphene; the bottom surface of the heat dissipation layer (400) is fixedly bonded with the top surface of the second insulation layer (500), and the second insulation layer (500) is a silica gel foaming plate.
2. The CEM-3 copper-clad plate with high CTI of claim 1, wherein:
the top surface of the copper foil layer (200) and the bottom surface of the second insulating layer (500) are both provided with a hydrophobic layer (600), and the hydrophobic layer (600) is formed by spraying hydrophobic paint.
3. The CEM-3 copper-clad plate with high CTI of claim 1, wherein:
the heat dissipation layer (400) comprises a first sheet plate (410) and a second sheet plate (420) which are parallel to each other, a plurality of protruding strips (430) are arranged between the first sheet plate (410) and the second sheet plate (420), the protruding strips (430) are evenly arranged at intervals, the first sheet plate (410) and the second sheet plate (420) are fixedly connected through the protruding strips (430), and the first sheet plate (410), the protruding strips (430) and the second sheet plate (420) are of an integral structure.
4. The CEM-3 copper-clad plate with high CTI of claim 1, wherein:
the first insulating layer (300) is made of a thermosetting phenol resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822244690.1U CN209994614U (en) | 2018-12-28 | 2018-12-28 | CEM-3 copper-clad plate with high CTI (comparative tracking index) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822244690.1U CN209994614U (en) | 2018-12-28 | 2018-12-28 | CEM-3 copper-clad plate with high CTI (comparative tracking index) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209994614U true CN209994614U (en) | 2020-01-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822244690.1U Expired - Fee Related CN209994614U (en) | 2018-12-28 | 2018-12-28 | CEM-3 copper-clad plate with high CTI (comparative tracking index) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209994614U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112248579A (en) * | 2020-10-20 | 2021-01-22 | 赣州烨森电子科技有限公司 | Corrosion-resistant copper-clad plate |
| CN113580713A (en) * | 2021-08-31 | 2021-11-02 | 长沙新材料产业研究院有限公司 | Polyimide copper-clad plate and preparation method thereof |
-
2018
- 2018-12-28 CN CN201822244690.1U patent/CN209994614U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112248579A (en) * | 2020-10-20 | 2021-01-22 | 赣州烨森电子科技有限公司 | Corrosion-resistant copper-clad plate |
| CN113580713A (en) * | 2021-08-31 | 2021-11-02 | 长沙新材料产业研究院有限公司 | Polyimide copper-clad plate and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200124 |