CN204206600U - copper foil composite base material for circuit board - Google Patents
copper foil composite base material for circuit board Download PDFInfo
- Publication number
- CN204206600U CN204206600U CN201420705091.4U CN201420705091U CN204206600U CN 204206600 U CN204206600 U CN 204206600U CN 201420705091 U CN201420705091 U CN 201420705091U CN 204206600 U CN204206600 U CN 204206600U
- Authority
- CN
- China
- Prior art keywords
- copper
- base material
- composite base
- foil composite
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 239000000463 material Substances 0.000 title claims abstract description 26
- 239000002131 composite material Substances 0.000 title claims abstract description 21
- 239000011889 copper foil Substances 0.000 title claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- 229920000297 Rayon Polymers 0.000 claims abstract description 7
- 230000004888 barrier function Effects 0.000 claims description 13
- 239000005030 aluminium foil Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229920006335 epoxy glue Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 3
- 239000002351 wastewater Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 239000011888 foil Substances 0.000 abstract 3
- 230000017525 heat dissipation Effects 0.000 abstract 3
- 230000008021 deposition Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 13
- 230000005855 radiation Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
A copper foil composite substrate for a circuit board comprises an insulating layer or a heat conducting layer, an aluminum foil adhered to the insulating layer or the heat conducting layer through viscose, and a copper layer on the surface of the aluminum foil in an electroplating or chemical copper deposition mode. Under the condition that the circuit board has the same thickness specification requirement, the thickness of a copper layer can be reduced by adding a layer of aluminum foil, and the material cost of copper is far higher than that of aluminum, so that the production cost of the copper foil composite base material can be greatly reduced; meanwhile, the process is more complex and more waste water is generated during copper production, so that the environmental pollution can be reduced by reducing the consumption of copper, and the ever-increasing environmental protection requirement is met; in addition, due to the good heat dissipation of aluminum, the circuit board made of the copper foil composite base material has good heat dissipation effect, thereby being beneficial to the heat dissipation of electric products to prolong the service life of the products.
Description
Technical field
The utility model relates to a kind of wiring board techniques, refers in particular to Copper Foil composite base material in the circuit board.
Background technology
Need on the product of electricity consumption in household electrical appliance, LED etc., often all will use wiring board to lay electric elements or LED lamp bead etc.We know; the base material thickness of wiring board generally has certain specification to require; it has generally included layers of copper, adhesive-layer and insulating barrier; the material cost of the layers of copper in this which floor is the highest, and the cost that how can reduce the base material of wiring board when guaranteeing that substrate performance is constant is the purpose of the applicant.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides that a kind of production cost is lower, radiating effect is better for the Copper Foil composite base material of wiring board.
In order to solve the technical problem of above-mentioned existence, the utility model adopts following technical proposals:
For a Copper Foil composite base material for wiring board, include insulating barrier or heat-conducting layer, by the aluminium foil of paste adhesive on insulating barrier or heat-conducting layer and plating or the layers of copper of electroless copper plating mode on aluminium foil surface.
In the improvement project to the above-mentioned Copper Foil composite base material for wiring board, described insulating barrier is PI film or glass-fiber-plate; Described heat-conducting layer is aluminium lamination.
In the improvement project to the above-mentioned Copper Foil composite base material for wiring board, described viscose glue is epoxy resin, glue or polyurethane.
Compared with prior art, the beneficial effects of the utility model are: due under the condition of wiring board condition of equivalent thickness specification requirement, the thickness of layers of copper just can be reduced by increasing one deck aluminium foil, and due to the material cost of copper high more than aluminium, so just greatly can reduce the production cost of Copper Foil composite base material; Meanwhile, because the waste water that technique during production of copper is more complicated, produce is more, the consumption like this by reducing copper just can reduce environmental pollution, meets growing environmental protection needs; In addition, because the thermal diffusivity of aluminium is good, the wiring board radiating effect made with this Copper Foil composite base material is like this good, thus the heat radiation contributing to electric equipment products is to improve the useful life of product.
Below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail:
[accompanying drawing explanation]
Fig. 1 is the structural representation of the utility model embodiment.
[embodiment]
The utility model is a kind of Copper Foil composite base material for wiring board, include insulating barrier or heat-conducting layer 1, the aluminium foil 2 be pasted onto by viscose glue 4 on insulating barrier or heat-conducting layer 1, and electroplate or the layers of copper 3 of electroless copper plating on aluminium foil 2 surface, like this under the condition of wiring board condition of equivalent thickness specification requirement, the thickness of layers of copper just can be reduced by increasing one deck aluminium foil, and due to the material cost of copper high more than aluminium, so just greatly can reduce the production cost of Copper Foil composite base material; Meanwhile, because the waste water that technique during production of copper is more complicated, produce is more, the consumption like this by reducing copper just can reduce environmental pollution, meets growing environmental protection needs; In addition, because the thermal diffusivity of aluminium is good, the wiring board radiating effect made with this Copper Foil composite base material is like this good, thus the heat radiation contributing to electric equipment products is to improve the useful life of product.
Copper Foil composite base material of the present utility model to manufacture process as follows:
1, in the one side of aluminium foil 2, one deck copper 3 is plated with plating or chemical deposition (i.e. electroless copper plating) mode;
2, coat viscose glue 4 at aluminium foil 2 another side, viscose glue can be epoxy resin, glue, polyurethane etc.;
3, on viscose glue 4, insulating barrier or heat-conducting layer 1 is stained with, insulating barrier is PI film, glass-fiber-plate etc. normally, when insulating barrier adopts PI film, the Copper Foil composite base material produced is flexible, and when insulating barrier adopts glass-fiber-plate, the Copper Foil composite base material produced is rigidity, is namely usually said pcb board.Heat-conducting layer is aluminium lamination normally, to improve the heat dispersion of wiring board further.
Although with reference to when embodiment describes principle of the present utility model and the scope of the claim restriction described in this disengaging in detail above; can make a variety of changes the utility model or revise; but be it will be apparent to one skilled in the art that by the disclosure; the detailed description of disclosure embodiment is only used for explaining; instead of be used for limiting the utility model, but be defined by the subject-matter of the claims the scope of protection.
Claims (3)
1. for a Copper Foil composite base material for wiring board, it is characterized in that, include insulating barrier or heat-conducting layer, by the aluminium foil of paste adhesive on insulating barrier or heat-conducting layer and plating or the layers of copper of electroless copper plating mode on aluminium foil surface.
2. the Copper Foil composite base material for wiring board according to claim 1, is characterized in that, described insulating barrier is PI film or glass-fiber-plate; Described heat-conducting layer is aluminium lamination.
3. the Copper Foil composite base material for wiring board according to claim 1 and 2, is characterized in that, described viscose glue is epoxy resin, glue or polyurethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705091.4U CN204206600U (en) | 2014-11-22 | 2014-11-22 | copper foil composite base material for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705091.4U CN204206600U (en) | 2014-11-22 | 2014-11-22 | copper foil composite base material for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204206600U true CN204206600U (en) | 2015-03-11 |
Family
ID=52664505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420705091.4U Active CN204206600U (en) | 2014-11-22 | 2014-11-22 | copper foil composite base material for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204206600U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN115384139A (en) * | 2022-09-20 | 2022-11-25 | 天长市京发铝业有限公司 | Aluminum-based aluminum-clad metal plate for electronic circuit and preparation method thereof |
-
2014
- 2014-11-22 CN CN201420705091.4U patent/CN204206600U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN115384139A (en) * | 2022-09-20 | 2022-11-25 | 天长市京发铝业有限公司 | Aluminum-based aluminum-clad metal plate for electronic circuit and preparation method thereof |
| CN115384139B (en) * | 2022-09-20 | 2024-01-02 | 天长市京发铝业有限公司 | Aluminum-based aluminum-coated metal plate for electronic circuit and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151211 Address after: Keyuan Road 528400 in Guangdong province Zhongshan City Jianghai District No. 17 building four floor B2 Patentee after: Jiangmen Jianghai Yong Chong Xin Electronics Co. Ltd. Address before: 528400 Guangdong Province, Zhongshan Jianghai garden Yuanzhi Bay Street six building 1502 Patentee before: Wang Yanxin |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 528400 Guangdong province Jiangmen Jianghai Keyuan Road No. 17 building four floor B2 Patentee after: Jiangmen Jianghai Yong Chong Xin Electronics Co. Ltd. Address before: Keyuan Road 528400 in Guangdong province Zhongshan City Jianghai District No. 17 building four floor B2 Patentee before: Jiangmen Jianghai Yong Chong Xin Electronics Co. Ltd. |