CN204206600U - copper foil composite base material for circuit board - Google Patents
copper foil composite base material for circuit board Download PDFInfo
- Publication number
- CN204206600U CN204206600U CN201420705091.4U CN201420705091U CN204206600U CN 204206600 U CN204206600 U CN 204206600U CN 201420705091 U CN201420705091 U CN 201420705091U CN 204206600 U CN204206600 U CN 204206600U
- Authority
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- Prior art keywords
- copper
- layer
- foil composite
- copper foil
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000002131 composite material Substances 0.000 title claims abstract description 20
- 239000011889 copper foil Substances 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 title claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 3
- 239000005030 aluminium foil Substances 0.000 claims 2
- 229920000297 Rayon Polymers 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 229920006335 epoxy glue Polymers 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 3
- 239000002351 wastewater Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 29
- 239000003365 glass fiber Substances 0.000 description 3
- 238000005234 chemical deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
一种用于线路板的铜箔复合基材，包括有绝缘层或导热层、通过粘胶粘贴在绝缘层或导热层上的铝箔、以及电镀或化学沉铜方式在铝箔表面上的铜层。由于在线路板同等厚度规格要求的条件下，通过增加一层铝箔就可以降低铜层的厚度，而由于铜的材料成本远比铝高，这样就可以大大降低铜箔复合基材的生产成本；与此同时，由于生产铜时的工艺更复杂、产生的废水更多，这样通过减少铜的用量就可以减少环境污染，符合日益增长的环保需要；另外，由于铝的散热性好，这样用本铜箔复合基材做成的线路板散热效果良好，从而有助于电器产品的散热来提高产品的使用寿命。
A copper foil composite substrate for circuit boards includes an insulating layer or a heat-conducting layer, an aluminum foil attached to the insulating layer or the heat-conducting layer by adhesive, and a copper layer on the surface of the aluminum foil by electroplating or chemical copper deposition. Under the same thickness specification requirements of the circuit board, the thickness of the copper layer can be reduced by adding a layer of aluminum foil, and since the material cost of copper is much higher than that of aluminum, the production cost of the copper foil composite substrate can be greatly reduced; at the same time, since the process of producing copper is more complicated and more waste water is generated, environmental pollution can be reduced by reducing the amount of copper, which meets the growing environmental protection needs; in addition, since aluminum has good heat dissipation, the circuit board made of the copper foil composite substrate has a good heat dissipation effect, which helps to dissipate the heat of electrical products and increase the service life of the products.
Description
技术领域 technical field
本实用新型涉及一种线路板技术，尤其是指用在线路板上的铜箔复合基材。 The utility model relates to a circuit board technology, in particular to a copper foil composite base material used on the circuit board.
背景技术 Background technique
在家用电器、LED灯等需要用电的产品上，往往都要用到线路板来安放电器元件或LED灯珠等。我们知道，线路板的基材厚度一般都有一定规格要求的，它通常包括有铜层、粘胶层和绝缘层，这几层中的铜层的材料成本最高，如何能在确保基材性能不变的情况下降低线路板的基材的成本是本申请人的目的所在。 In household appliances, LED lamps and other products that require electricity, circuit boards are often used to place electrical components or LED lamp beads. We know that the thickness of the base material of the circuit board generally has certain specifications. It usually includes a copper layer, an adhesive layer and an insulating layer. The material cost of the copper layer in these layers is the highest. How to ensure the performance of the base material? It is the purpose of the applicant to reduce the cost of the base material of the circuit board without changing the situation.
发明内容 Contents of the invention
本实用新型的目的是在于克服现有技术的不足，提供了一种生产成本更低、散热效果更好的用于线路板的铜箔复合基材。 The purpose of the utility model is to overcome the deficiencies of the prior art and provide a copper foil composite base material for circuit boards with lower production cost and better heat dissipation effect.
为了解决上述存在的技术问题，本实用新型采用下述技术方案： In order to solve the above-mentioned technical problems, the utility model adopts the following technical solutions:
一种用于线路板的铜箔复合基材，包括有绝缘层或导热层、通过粘胶粘贴在绝缘层或导热层上的铝箔、以及电镀或化学沉铜方式在铝箔表面上的铜层。 A copper foil composite base material for circuit boards, comprising an insulating layer or a thermally conductive layer, an aluminum foil pasted on the insulating layer or the thermally conductive layer by adhesive, and a copper layer on the surface of the aluminum foil by electroplating or electroless copper deposition.
在对上述用于线路板的铜箔复合基材的改进方案中，所述的绝缘层是PI膜或玻纤板；所述的导热层是铝层。 In the improved solution to the above-mentioned copper foil composite substrate for circuit boards, the insulating layer is a PI film or a glass fiber board; the heat conducting layer is an aluminum layer.
在对上述用于线路板的铜箔复合基材的改进方案中，所述的粘胶是环氧树脂、水胶或聚氨酯。 In an improvement to the above-mentioned copper foil composite substrate for circuit boards, the adhesive is epoxy resin, water glue or polyurethane.
与现有技术相比，本实用新型的有益效果是：由于在线路板同等厚度规格要求的条件下，通过增加一层铝箔就可以降低铜层的厚度，而由于铜的材料成本远比铝高，这样就可以大大降低铜箔复合基材的生产成本；与此同时，由于生产铜时的工艺更复杂、产生的废水更多，这样通过减少铜的用量就可以减少环境污染，符合日益增长的环保需要；另外，由于铝的散热性好，这样用本铜箔复合基材做成的线路板散热效果良好，从而有助于电器产品的散热来提高产品的使用寿命。 Compared with the prior art, the beneficial effect of the utility model is that the thickness of the copper layer can be reduced by adding a layer of aluminum foil under the condition of the same thickness specifications of the circuit board, and the material cost of copper is much higher than that of aluminum. , so that the production cost of copper foil composite base material can be greatly reduced; at the same time, due to the more complex process and more waste water produced during copper production, environmental pollution can be reduced by reducing the amount of copper used, which is in line with the growing Environmental protection needs; in addition, due to the good heat dissipation of aluminum, the circuit board made of the copper foil composite base material has a good heat dissipation effect, thereby helping the heat dissipation of electrical products to improve the service life of the product.
下面结合附图与具体实施方式对本实用新型作进一步的详细描述： Below in conjunction with accompanying drawing and specific embodiment the utility model is described in further detail:
【附图说明】 【Description of drawings】
图1 是本实用新型实施例的结构示意图。 Fig. 1 is the structural representation of the utility model embodiment.
【具体实施方式】 【Detailed ways】
本实用新型为一种用于线路板的铜箔复合基材，包括有绝缘层或导热层1、通过粘胶4粘贴在绝缘层或导热层1上的铝箔2，以及电镀或化学沉铜在铝箔2表面上的铜层3，这样在线路板同等厚度规格要求的条件下，通过增加一层铝箔就可以降低铜层的厚度，而由于铜的材料成本远比铝高，这样就可以大大降低铜箔复合基材的生产成本；与此同时，由于生产铜时的工艺更复杂、产生的废水更多，这样通过减少铜的用量就可以减少环境污染，符合日益增长的环保需要；另外，由于铝的散热性好，这样用本铜箔复合基材做成的线路板散热效果良好，从而有助于电器产品的散热来提高产品的使用寿命。 The utility model relates to a copper foil composite base material used for circuit boards, which includes an insulating layer or a heat conducting layer 1, an aluminum foil 2 pasted on the insulating layer or the heat conducting layer 1 through glue 4, and electroplating or chemical deposition of copper on the The copper layer 3 on the surface of the aluminum foil 2 can reduce the thickness of the copper layer by adding a layer of aluminum foil under the same thickness specification requirements of the circuit board, and because the material cost of copper is much higher than that of aluminum, it can be greatly reduced. The production cost of copper foil composite base material; at the same time, because the process of producing copper is more complicated and more waste water is generated, the environmental pollution can be reduced by reducing the amount of copper used, which meets the growing needs of environmental protection; in addition, due to Aluminum has good heat dissipation, so the circuit board made of the copper foil composite base material has a good heat dissipation effect, thereby helping the heat dissipation of electrical products and improving the service life of the products.
本实用新型的铜箔复合基材的生产制作过程如下： The production process of the copper foil composite base material of the present utility model is as follows:
1、 在铝箔2的一面上以电镀或化学沉积法（即化学沉铜）方式镀上一层铜3； 1. Plating a layer of copper 3 on one side of the aluminum foil 2 by means of electroplating or chemical deposition (ie electroless copper deposition);
2、 在铝箔2另一面涂上粘胶4，粘胶可以是环氧树脂、水胶、聚氨酯等； 2. Apply glue 4 on the other side of the aluminum foil 2. The glue can be epoxy resin, water glue, polyurethane, etc.;
3、 在粘胶4上粘上绝缘层或导热层1，绝缘层通常是PI膜、玻纤板等，当绝缘层采用PI膜时，所生产出来的铜箔复合基材是挠性的，而当绝缘层采用玻纤板时，所生产出来的铜箔复合基材是刚性的，即是通常所说的PCB板。导热层通常是铝层，以进一步提高线路板的散热性能。 3. Adhere the insulating layer or heat conduction layer 1 on the glue 4. The insulating layer is usually PI film, glass fiber board, etc. When the insulating layer uses PI film, the copper foil composite substrate produced is flexible. When the insulating layer is made of glass fiber board, the copper foil composite substrate produced is rigid, which is commonly referred to as a PCB board. The heat conduction layer is usually an aluminum layer to further improve the heat dissipation performance of the circuit board.
尽管参照上面实施例详细说明了本脱离所述的权利要求限定的本实用新型的原理及精神范围的情况下，可对本实用新型做出各种变化或修改，但是通过本公开对于本领域技术人员显而易见的是，本公开实施例的详细描述仅用来解释，而不是用来限制本实用新型，而是由权利要求的内容限定保护的范围。 Although the present invention has been described in detail with reference to the above embodiments and departs from the principle and spirit scope of the present invention defined by the claims, various changes or modifications can be made to the present invention; Apparently, the detailed description of the embodiments of the present disclosure is only for explaining, not for limiting the present utility model, but the scope of protection is defined by the content of the claims.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705091.4U CN204206600U (en) | 2014-11-22 | 2014-11-22 | copper foil composite base material for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705091.4U CN204206600U (en) | 2014-11-22 | 2014-11-22 | copper foil composite base material for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204206600U true CN204206600U (en) | 2015-03-11 |
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ID=52664505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420705091.4U Expired - Lifetime CN204206600U (en) | 2014-11-22 | 2014-11-22 | copper foil composite base material for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204206600U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN115134995A (en) * | 2021-03-29 | 2022-09-30 | 铜陵睿变电路科技有限公司 | Circuit board made of copper-aluminum composite material and manufacturing method thereof |
| CN115384139A (en) * | 2022-09-20 | 2022-11-25 | 天长市京发铝业有限公司 | Aluminum-based aluminum-clad metal plate for electronic circuit and preparation method thereof |
| CN115866906A (en) * | 2022-12-24 | 2023-03-28 | 绍兴市舜杭电子科技有限公司 | PCB (printed circuit board) preparation process and PCB |
| CN116093340A (en) * | 2022-12-30 | 2023-05-09 | 深圳惠科新材料有限公司 | Composite copper foil and its manufacturing method and battery |
-
2014
- 2014-11-22 CN CN201420705091.4U patent/CN204206600U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN115134995A (en) * | 2021-03-29 | 2022-09-30 | 铜陵睿变电路科技有限公司 | Circuit board made of copper-aluminum composite material and manufacturing method thereof |
| CN115384139A (en) * | 2022-09-20 | 2022-11-25 | 天长市京发铝业有限公司 | Aluminum-based aluminum-clad metal plate for electronic circuit and preparation method thereof |
| CN115384139B (en) * | 2022-09-20 | 2024-01-02 | 天长市京发铝业有限公司 | Aluminum-based aluminum-coated metal plate for electronic circuit and preparation method thereof |
| CN115866906A (en) * | 2022-12-24 | 2023-03-28 | 绍兴市舜杭电子科技有限公司 | PCB (printed circuit board) preparation process and PCB |
| CN116093340A (en) * | 2022-12-30 | 2023-05-09 | 深圳惠科新材料有限公司 | Composite copper foil and its manufacturing method and battery |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151211 Address after: Keyuan Road 528400 in Guangdong province Zhongshan City Jianghai District No. 17 building four floor B2 Patentee after: Jiangmen Jianghai Yong Chong Xin Electronics Co.,Ltd. Address before: 528400 Guangdong Province, Zhongshan Jianghai garden Yuanzhi Bay Street six building 1502 Patentee before: Wang Yanxin |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 528400 Guangdong province Jiangmen Jianghai Keyuan Road No. 17 building four floor B2 Patentee after: Jiangmen Jianghai Yong Chong Xin Electronics Co.,Ltd. Address before: Keyuan Road 528400 in Guangdong province Zhongshan City Jianghai District No. 17 building four floor B2 Patentee before: Jiangmen Jianghai Yong Chong Xin Electronics Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150311 |