CN203446104U - Insulating thermal conductive substrate - Google Patents

Insulating thermal conductive substrate Download PDF

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Publication number
CN203446104U
CN203446104U CN201320061366.0U CN201320061366U CN203446104U CN 203446104 U CN203446104 U CN 203446104U CN 201320061366 U CN201320061366 U CN 201320061366U CN 203446104 U CN203446104 U CN 203446104U
Authority
CN
China
Prior art keywords
layer
thermal insulation
insulation layer
counterbore
thermal conductive
Prior art date
Application number
CN201320061366.0U
Other languages
Chinese (zh)
Inventor
萧哲力
廖萍涛
张守金
Original Assignee
鹤山东力电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鹤山东力电子科技有限公司 filed Critical 鹤山东力电子科技有限公司
Priority to CN201320061366.0U priority Critical patent/CN203446104U/en
Application granted granted Critical
Publication of CN203446104U publication Critical patent/CN203446104U/en

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Abstract

The utility model discloses an insulating thermal conductive substrate comprising a copper foil layer, an insulating thermal conductive layer and an aluminum base layer. One side of the copper foil layer is adhered to one side of the insulating thermal conductive layer. The other side of the insulating thermal conductive layer which is composed of 20 to 40% epoxy resin and 60 to 80% thermal conductive filling powder is adhered to the aluminum base layer. The insulating thermal conductive substrate is simple in structure and convenient to produce, and has good heat radiation performance.

Description

Insulating heat-conductive substrate
Technical field
The utility model relates to a kind of insulating heat-conductive substrate.
Background technology
Copper-clad plate, has another name called base material.Supporting material is soaked with resin, and one or both sides are coated with Copper Foil, and a kind of board-like material forming through hot pressing, is called copper clad laminate.It is the stock of being PCB, is often base material.When it is produced for multi-layer sheet, be also central layer.Mostly there is the poor deficiency of heat sinking function in conventional base material.
Utility model content
The purpose of this utility model is to provide a kind of insulating heat-conductive substrate, has solved the above-mentioned deficiency of prior art, and it is simple in structure, easy to make, perfect heat-dissipating.
In order to reach above-mentioned purpose of design, the technical solution adopted in the utility model is as follows:
A substrate, comprises copper foil layer, thermal insulation layer, aluminum base layer, described copper foil layer one side bonds thermal insulation layer one side, the bonding aluminum base layer of thermal insulation layer opposite side that the heat filling powder of the described epoxy resin by 20-40% and 60-80% forms.
Preferably, described thermal insulation layer both sides are respectively equipped with staggered counterbore, the relative boss that is provided with of counterbore of described copper foil layer side and thermal insulation layer one side, and boss embeds in the counterbore of described thermal insulation layer; The relative boss that is provided with of counterbore of described aluminum base layer side and thermal insulation layer opposite side, boss embeds in the counterbore of described thermal insulation layer.
More preferably, the counterbore of described thermal insulation layer one or both sides is bellmouth, and the boss in described copper foil layer and/or aluminum base layer is taper platform.
The beneficial effect of insulating heat-conductive substrate described in the utility model is: simple in structure, easy to make, and perfect heat-dissipating.
The structural design of counterbore, boss, has increased heat conducting contact area, improves heat transference efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of insulating heat-conductive substrate described in the utility model.
Fig. 2 is the cutaway view of insulating heat-conductive substrate described in the utility model.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the utility model is described in further detail.
As shown in Figure 1, insulating heat-conductive substrate described in the utility model embodiment, comprise copper foil layer 1, thermal insulation layer 2, aluminum base layer 3, described copper foil layer 1 one side bonds thermal insulation layer 2 one sides, the bonding aluminum base layer 3 of described thermal insulation layer 2 opposite side, during use, heat absorbs thermal insulation layer 2 from copper foil layer 1, then from thermal insulation layer 2, is delivered to aluminum base layer 3 and dispels the heat.
Described thermal insulation layer 2 is comprised of the epoxy resin of 20-40% and the heat filling powder of 60-80%, and the fillibility of epoxy resin is 86%, makes thermal insulation layer 2 thermal conductivitys rise to 4.2W/m.k by original 2W/m.k, has greatly promoted the heat sinking function of product.
As shown in Figure 2, described thermal insulation layer 2 both sides are respectively equipped with staggered counterbore 4, the relative boss 5 that is provided with of counterbore 4 of described copper foil layer 1 side and thermal insulation layer 2 one sides, boss 5 embeds in the counterbore 4 of described thermal insulation layer 2, thermal insulation layer 2 and the contact area of copper foil layer 1 are increased, be convenient to heat transmission; The relative boss 6 that is provided with of counterbore 4 of described aluminum base layer 3 sides and thermal insulation layer 2 opposite sides, boss 6 embeds in the counterbore 4 of described thermal insulation layer 2, and thermal insulation layer 2 and the contact area of aluminum base layer 3 are increased, and is convenient to heat transmission.
While further implementing, the counterbore 4 of described thermal insulation layer 2 one or both sides is bellmouth, and the boss 5 on copper foil layer 1 on the other side (boss 6 in aluminum base layer 3) is taper platform.
This embodiment, just for preferred embodiment of the present utility model is described, can not limit the utility model.

Claims (3)

1. an insulating heat-conductive substrate, is characterized in that: comprise copper foil layer, thermal insulation layer, aluminum base layer, described copper foil layer one side bonds thermal insulation layer one side, the bonding aluminum base layer of described thermal insulation layer opposite side.
2. insulating heat-conductive substrate according to claim 1, it is characterized in that: described thermal insulation layer both sides are respectively equipped with staggered counterbore, the relative boss that is provided with of counterbore of described copper foil layer side and thermal insulation layer one side, boss embeds in the counterbore of described thermal insulation layer; The relative boss that is provided with of counterbore of described aluminum base layer side and thermal insulation layer opposite side, boss embeds in the counterbore of described thermal insulation layer.
3. insulating heat-conductive substrate according to claim 2, is characterized in that: the counterbore of described thermal insulation layer one or both sides is bellmouth, and the boss in described copper foil layer and/or aluminum base layer is taper platform.
CN201320061366.0U 2013-02-04 2013-02-04 Insulating thermal conductive substrate CN203446104U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320061366.0U CN203446104U (en) 2013-02-04 2013-02-04 Insulating thermal conductive substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320061366.0U CN203446104U (en) 2013-02-04 2013-02-04 Insulating thermal conductive substrate

Publications (1)

Publication Number Publication Date
CN203446104U true CN203446104U (en) 2014-02-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320061366.0U CN203446104U (en) 2013-02-04 2013-02-04 Insulating thermal conductive substrate

Country Status (1)

Country Link
CN (1) CN203446104U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105307382A (en) * 2014-07-28 2016-02-03 三星电机株式会社 Printed circuit board and method of manufacturing the same
CN105578735A (en) * 2016-03-14 2016-05-11 龙南骏亚电子科技有限公司 High-heat-conduction multilayer circuit board
CN107830420A (en) * 2017-11-27 2018-03-23 安徽文尧智能光电科技有限公司 A kind of LED line light source based on aluminium base radiating
CN108922952A (en) * 2018-05-29 2018-11-30 北京敬科技有限公司 A kind of board structure and its production technology of semiconductor diode chip
CN108980750A (en) * 2018-06-15 2018-12-11 陆伯阳 A kind of LED desk lamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105307382A (en) * 2014-07-28 2016-02-03 三星电机株式会社 Printed circuit board and method of manufacturing the same
CN105578735A (en) * 2016-03-14 2016-05-11 龙南骏亚电子科技有限公司 High-heat-conduction multilayer circuit board
CN107830420A (en) * 2017-11-27 2018-03-23 安徽文尧智能光电科技有限公司 A kind of LED line light source based on aluminium base radiating
CN108922952A (en) * 2018-05-29 2018-11-30 北京敬科技有限公司 A kind of board structure and its production technology of semiconductor diode chip
CN108980750A (en) * 2018-06-15 2018-12-11 陆伯阳 A kind of LED desk lamp

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GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140219

Termination date: 20160204

CF01 Termination of patent right due to non-payment of annual fee