CN207744224U - A kind of pcb board part of thermoelectricity separation - Google Patents
A kind of pcb board part of thermoelectricity separation Download PDFInfo
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- CN207744224U CN207744224U CN201721925597.6U CN201721925597U CN207744224U CN 207744224 U CN207744224 U CN 207744224U CN 201721925597 U CN201721925597 U CN 201721925597U CN 207744224 U CN207744224 U CN 207744224U
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- pcb board
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Abstract
The utility model discloses a kind of pcb board parts of thermoelectricity separation, the pcb board part is laminated multilayer plate, include a metal substrate for heat dissipation, control is deep in the middle part of the metal substrate etches boss pad, the metal substrate is laminated with PP layers around boss pad, it is provided with line layer on the PP layers, the line layer is by being laminated to PP layers, the metal foil layer on boss pad etches.The pcb board part of the thermoelectricity separation of the utility model, component is directly connected with copper base, it is finally reached the effect directly to radiate, substantially increase the effect of heat dissipation, improve the light output rate of LED, it ensure that the stability of its light efficiency, while the damage also avoided under LED is interfered by extraneous factor surprisingly occurs.
Description
Technical field
The utility model is related to pcb board product technical fields, relate in particular to a kind of pcb board part of thermoelectricity separation.
Background technology
LED is a kind of solid-state semiconductor luminescent device, it is not polluted, and is third generation lighting source in the world today.Mesh
Preceding electro-optical efficiency has been approached 28%, is highest in known existing luminescent material.But traditional LED radiating modes are member
Device heating, then hot to be distributed to Metal Substrate by heat-conducting medium, copper-based (aluminium base) heat dissipation, using height between circuit and Metal Substrate
Hot medium heat dissipation is led, general coefficient of heat transfer is in 1.5-4w/m.k.With being widely used for LED, high-power LED is using tradition
Heat eliminating medium+metallic based structures cannot be satisfied at all its heat dissipation demand.A kind of Metal Substrate plate of thermoelectricity separation is in this ring
It uses and gives birth under border.
Invention content
The purpose of this utility model is that in view of the above-mentioned defects in the prior art, a kind of pcb board part of thermoelectricity separation is provided,
Aim to solve the problem that the heat dissipation problem of great power LED.
To achieve the goals above, the technical solution of the utility model is：
A kind of pcb board part of thermoelectricity separation, which is laminated multilayer plate, includes a metal substrate for heat dissipation,
Control is deep in the middle part of the metal substrate etches boss pad, which is laminated with PP layers around boss pad, the PP layers
On be provided with line layer, the line layer is by being laminated to PP layers, the metal foil layer on boss pad etches.
As the improvement to above-mentioned technical proposal, the metal substrate is copper base.
As the improvement to above-mentioned technical proposal, the metal foil layer is copper metal layers of foil.
Compared with prior art, the utility model has the advantages and positive effects of：
The pcb board part of the thermoelectricity separation of the utility model, processes in such a way that control etches deeply and etches a bump pad,
Then it is laminated the pad that will be radiated in pcb board by the way of PP windowings to be machined directly on copper base, reduces heat conduction PP to dissipating
The influence of heat.
Using technical solution provided by the utility model, the advantage made the change of the following aspects and brought：1、
The copper base of thermoelectricity separation mainly solves heat dissipation problem, and traditional copper base radiating mode generates heat for component, and then heat is by leading
Thermal medium is distributed to metal substrate, and the coefficient of heat transfer of heat-conducting medium is generally in 1.5-4w/m.k, and heat dissipation is bad, and thermoelectricity separating plate
Part is that copper base directly radiates, and the coefficient of heat transfer 380-400w/m.k of copper substantially increases the effect of heat dissipation.2, first according to client
Demand determine copper base thickness, then using control etch deeply by the way of process with the copper-based of bump pad；According to convex
The size of point pad, hollows out the corresponding positions PP according to the size of bump pad, then more by being laminated out corresponding lamination
Laminate realizes the separation of heat and electricity in circuit design, so that component is directly connected with copper base, be finally reached the effect directly to radiate
Fruit；3, the pcb board part of thermoelectricity separation uses the method that pcb board is combined respective advantage with copper coin, improves the light output of LED
Rate, ensure that the stability of its light efficiency, while the damage also avoided under LED is interfered by extraneous factor surprisingly occurs.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, any modification, equivalent replacement, improvement and so on should be included in the utility model
Within protection domain.
As shown in Figure 1, the pcb board part of the thermoelectricity separation of the utility model, which is laminated multilayer plate, including one
For the metal substrate 1 of heat dissipation, which etches boss pad 11 deeply, and the metal substrate 1 is in boss pad
It is laminated with PP layers 2 around 11, is provided with line layer 3 on the PP layers 2, the line layer 3 is by being laminated to PP layers 2, boss pad 11
On metal foil layer etch.
As the improvement to above-mentioned technical proposal, the metal substrate 1 is copper base.
As the improvement to above-mentioned technical proposal, the metal foil layer is copper metal layers of foil.
The pcb board part of the thermoelectricity separation of the utility model processes in this way：
1, inner figure has been made by copper-based, control is deep to etch bump pad；
2, suitable PP is selected, hollows out the corresponding positions PP by the way of numerical control hollow out according to the size of bump pad；
3, select suitable laminar manner that copper-based, fluting the PP, the metal foil layer that etch bump pad are pressed into layer
Press multilayer boards half-finished product；
4, copper-based bump pad location polishing is exposed by way of mechanical grinding；
5, lead to overetched mode and process corresponding circuit according to the line map of Customer design.
The pcb board part of the thermoelectricity separation of the utility model, processes in such a way that control etches deeply and etches a bump pad,
Then it is laminated the pad that will be radiated in pcb board by the way of PP windowings to be machined directly on copper base, reduces heat conduction PP to dissipating
The influence of heat.
Using technical solution provided by the utility model, the advantage made the change of the following aspects and brought：1、
The copper base of thermoelectricity separation mainly solves heat dissipation problem, and traditional copper base radiating mode generates heat for component, and then heat is by leading
Thermal medium is distributed to metal substrate, and the coefficient of heat transfer of heat-conducting medium is generally in 1.5-4w/m.k, and heat dissipation is bad, and thermoelectricity separating plate
Part is that copper base directly radiates, and the coefficient of heat transfer 380-400w/m.k of copper substantially increases the effect of heat dissipation.2, first according to client
Demand determine copper base thickness, then using control etch deeply by the way of process with the copper-based of bump pad；According to convex
The size of point pad, hollows out the corresponding positions PP according to the size of bump pad, then more by being laminated out corresponding lamination
Laminate realizes the separation of heat and electricity in circuit design, so that component is directly connected with copper base, be finally reached the effect directly to radiate
Fruit；3, the pcb board part of thermoelectricity separation uses the method that pcb board is combined respective advantage with copper coin, improves the light output of LED
Rate, ensure that the stability of its light efficiency, while the damage also avoided under LED is interfered by extraneous factor surprisingly occurs.
Claims (3)
1. a kind of pcb board part of thermoelectricity separation, it is characterised in that：The pcb board part be laminated multilayer plate, including one for heat dissipation
Metal substrate, the control of metal substrate middle part is deep to etch boss pad, which is laminated with PP around boss pad
Layer is provided with line layer on the PP layers, and the line layer is by being laminated to PP layers, the metal foil layer on boss pad etches.
2. the pcb board part of thermoelectricity separation according to claim 1, it is characterised in that：The metal substrate is copper base.
3. the pcb board part of thermoelectricity separation according to claim 1, it is characterised in that：The metal foil layer is copper metal foil
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721925597.6U CN207744224U (en) | 2017-12-31 | 2017-12-31 | A kind of pcb board part of thermoelectricity separation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721925597.6U CN207744224U (en) | 2017-12-31 | 2017-12-31 | A kind of pcb board part of thermoelectricity separation |
Publications (1)
| Publication Number | Publication Date |
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| CN207744224U true CN207744224U (en) | 2018-08-17 |
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| CN201721925597.6U Active CN207744224U (en) | 2017-12-31 | 2017-12-31 | A kind of pcb board part of thermoelectricity separation |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN110996498A (en) * | 2019-12-26 | 2020-04-10 | 乐健科技（珠海）有限公司 | Method for preparing reflective circuit board |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
-
2017
- 2017-12-31 CN CN201721925597.6U patent/CN207744224U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN110996498A (en) * | 2019-12-26 | 2020-04-10 | 乐健科技（珠海）有限公司 | Method for preparing reflective circuit board |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
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