CN106922081A - A kind of single-clad board - Google Patents

Abstract

A single-sided printed circuit board, comprising an aluminum substrate, the upper surface of the aluminum substrate is provided with a recessed heat dissipation groove, and an aluminum heat conduction column is arranged in the heat dissipation groove, and the upper surface of the aluminum substrate is An insulating layer is arranged on the surface, a conductive layer is arranged on the insulating layer, a heat dissipation ground wire is arranged on the conductive layer, and a perforation for connecting the interior of the aluminum substrate with the heat dissipation ground wire is arranged on the heat dissipation ground wire. In the present invention, the heat dissipation performance of the aluminum base plate is more excellent by setting the aluminum heat conduction column and the heat dissipation ground wire.

Description

A single-sided printed circuit board

technical field

The invention relates to the field of aluminum-based printed circuit board structures, in particular to a single-sided printed circuit board.

Background technique

Aluminum substrates are used in many high-heat power consumption circuits because their substrates are aluminum materials with good heat dissipation performance. However, as a circuit board, aluminum substrates inevitably need to add insulating layers and conductive layers, while insulating layers The thermal conductivity of the material itself is very poor, which makes it difficult for the heat generated by the circuit and components of the aluminum substrate to be efficiently transmitted to the aluminum part of the aluminum substrate during actual use, resulting in the actual heat dissipation capacity being only better than that of the epoxy substrate. Higher than the limited efficiency, and due to poor heat dissipation, the aging of the circuit will be faster than before, resulting in a synchronous decline in life.

Contents of the invention

The object of the present invention is to provide a single-sided printed circuit board, which can make the heat dissipation performance of the aluminum substrate more excellent by arranging the aluminum heat conduction column and the heat dissipation ground wire.

The technical purpose of the present invention is achieved by the following technical solutions: a single-sided printed circuit board, including an aluminum substrate, the upper surface of the aluminum substrate is provided with a recessed heat dissipation groove, the heat dissipation groove An aluminum heat conduction column is arranged inside, an insulating layer is arranged on the upper surface of the aluminum substrate, a conductive layer is arranged on the insulating layer, a heat dissipation ground wire is arranged on the conductive layer, and a heat dissipation ground wire is arranged on the heat dissipation ground wire The through hole in the aluminum substrate communicates with the heat dissipation ground wire.

As a preference of the present invention, the linear array in the heat dissipation groove is provided with a plurality of heat dissipation through holes for leading out the heat in the heat dissipation groove.

As a preference of the present invention, a heat conduction medium is arranged on the top end surface of the aluminum heat conduction column.

As a preference of the present invention, the heat conduction medium is a copper sheet, and the copper sheet and the aluminum heat conduction column are fixed by welding.

As a preference of the present invention, a conductor is arranged on the inner wall of the perforation, and the conductor is connected to the aluminum substrate.

As a preference of the present invention, a bottom plate is further included, the bottom plate is bonded to the bottom of the aluminum substrate, and a second through hole aligned with the axis of the heat dissipation through hole is arranged on the bottom plate.

As a preference of the present invention, the diameter of the second through hole is greater than or equal to the heat dissipation through hole.

As a preference of the present invention, the bottom plate is a copper bottom plate.

As a preference of the present invention, the bottom plate is welded to the bottom plate of the aluminum substrate.

As a preference of the present invention, the heat dissipation ground wire is arranged at the edge of the aluminum substrate.

In summary, the present invention has the following beneficial effects:

The invention has the advantages of good heat dissipation performance and long service life.

Description of drawings

Fig. 1 is a schematic structural view of an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of an embodiment of the present invention after connecting a power consumption device;

Fig. 3 is the structural representation of the explosion of the embodiment of the present invention;

In the picture:

1- aluminum base plate; 2- heat sink; 3- aluminum thermal column; 4- insulating layer; 5- heat dissipation ground wire; 6- perforation; 7- heat dissipation through hole; second via.

detailed description

The present invention will be described in further detail below in conjunction with the accompanying drawings.

As shown in Fig. 1, Fig. 2 and Fig. 3, the embodiment of the present invention includes an aluminum substrate 1, the upper surface of the aluminum substrate 1 is provided with a recessed heat dissipation groove 2, and an aluminum heat conduction column 3 is arranged in the heat dissipation groove 2, The upper surface of the aluminum substrate is provided with an insulating layer 4, and the insulating layer 4 is provided with a conductive layer 5. The conductive layer 5 is provided with a heat dissipation ground wire 5, and the heat dissipation ground wire 5 is arranged at the edge of the aluminum substrate 1. There is a perforation 6 for connecting the interior of the aluminum substrate 1 with the heat dissipation ground wire 5. A conductor is provided on the inner wall of the perforation 6, and the conductor is connected to the aluminum substrate 1. The setting of the perforation 6 has substantially connected the entire aluminum substrate. 1 is used as a ground, so that a large amount of heat generated on the line is conducted to the heat dissipation ground wire 5, and then transferred to the aluminum substrate 1 by the heat dissipation ground wire 5, so as to maximize the heat dissipation area. For the heat generated by the circuit itself, aluminum The area of the manufacturing substrate 1 is sufficient to dissipate the heat generated by the circuit lines on it for the first time. The linear array in the heat dissipation groove 2 is provided with a plurality of heat dissipation through holes 7 for deriving the heat in the heat dissipation groove 2. Since the upper part of the heat dissipation groove 2 is correspondingly soldered with a power dissipation device, as shown in Figure 2, the power dissipation device The generated heat will be blocked by the device itself when dissipating upward, and after the heat dissipation through hole 7 is opened in the heat dissipation groove 2, not only the temperature in the heat dissipation groove 2 will be derived, but also because the heat dissipation through hole 7 runs through the aluminum substrate 1 Therefore, the heat inside the aluminum substrate 1 can also be released through outlets.

A heat conduction medium 8 is arranged on the top end surface of the aluminum heat conduction column 3 , and the heat conduction medium 8 is a material such as a silica gel pad, a copper sheet, or silicone grease. The heat conduction medium 8 is preferably a copper sheet, and the copper sheet and the aluminum heat conduction column 3 are fixed by welding.

This embodiment also includes a bottom plate 9 , which is bonded to the bottom of the aluminum substrate 1 , and is provided with a second through hole 10 aligned with the axis of the heat dissipation through hole 7 on the bottom plate 9 . The diameter of the second through hole 10 is greater than or equal to the heat dissipation through hole 7 . The base plate 9 is a copper base plate 9 . The material of the bottom plate 9 is preferred, it must be made of copper. The bottom plate 9 has two uses. The first is to raise the aluminum base plate 1 so that the perforation 6 cannot be in contact with other metals or shells. The second is to place the The heat on the aluminum substrate 1 is conducted away. When the housing is another heat dissipation structure, the copper bottom plate 9 can maximize the heat conduction efficiency, so that heat will not accumulate inside the aluminum substrate 1 . The bottom plate 9 is welded to the bottom plate 9 of the aluminum substrate 1 .

This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications to this embodiment without creative contribution as required after reading this specification, but as long as they are within the rights of the present invention All claims are protected by patent law.

Claims (10)

1. A single-sided printed circuit board, characterized in that: it includes an aluminum substrate (1), the upper surface of the aluminum substrate (1) is provided with a sunken heat dissipation groove (2), and the heat dissipation groove (2) is provided with an aluminum heat conduction column (3), the upper surface of the aluminum substrate is provided with an insulating layer (4), the insulating layer (4) is provided with a conductive layer (5), and the conductive layer (5) ) is provided with a heat dissipation ground wire (5), and the heat dissipation ground wire (5) is provided with a perforation (6) for communicating the interior of the aluminum substrate (1) with the heat dissipation ground wire (5). 2. A single-sided printed circuit board according to claim 1, characterized in that: the linear array in the heat dissipation groove (2) is provided with a plurality of heat dissipation grooves (2) for exporting the heat Thermal vias (7). 3 . The single-sided printed circuit board according to claim 1 , characterized in that: a heat-conducting medium ( 8 ) is provided on the top end surface of the aluminum heat-conducting column ( 3 ). 4 . 4. A single-sided printed circuit board according to claim 3, characterized in that: the heat-conducting medium (8) is a copper sheet, and the copper sheet passes through the aluminum heat-conducting column (3) Welding fixed. 5. The single-sided printed circuit board according to claim 1, characterized in that: a conductor is arranged on the inner wall of the through hole (6), and the conductor is connected to the aluminum substrate (1). 6. A single-sided printed circuit board according to claim 2, characterized in that it further comprises a bottom plate (9), the bottom plate (9) is bonded to the bottom of the aluminum substrate (1), The bottom plate (9) is provided with a second through hole (10) aligned axially with the heat dissipation through hole (7). 7. The single-sided printed circuit board according to claim 6, characterized in that: the diameter of the second through hole (10) is greater than or equal to the heat dissipation through hole (7). 8. A single-sided printed circuit board according to claim 6, characterized in that: said base plate (9) is a copper base plate (9). 9. A single-sided printed circuit board according to claim 8, characterized in that the bottom plate (9) is welded to the bottom plate (9) of the aluminum substrate (1). 10. The single-sided printed circuit board according to claim 1, characterized in that: the heat dissipation ground wire (5) is arranged at the edge of the aluminum substrate (1).