CN203554878U - Metal based carbon composite heat conducting material - Google Patents
Metal based carbon composite heat conducting material Download PDFInfo
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- CN203554878U CN203554878U CN201320704067.4U CN201320704067U CN203554878U CN 203554878 U CN203554878 U CN 203554878U CN 201320704067 U CN201320704067 U CN 201320704067U CN 203554878 U CN203554878 U CN 203554878U
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Abstract
The utility model relates to a metal based carbon composite heat conducting material. The metal based carbon composite heat conducting material comprises a heat quick conducting layer, a heat plane even radiation layer, a heat conducting glue adhesive layer and a heat radiation surface layer. The heat quick conducting layer is a layer of a copper foil plate. The heat plane even radiation layer is a carbon nanotube layer which is evenly coated on an upper surface of the heat quick conducting layer. The heat conducting glue adhesive layer is a layer of heat conducting glue which is adhered to a lower surface of the heat quick conducting layer. The heat radiation surface layer is a corrugated surface sheet metal which is adhered to a lower surface of the heat conducting glue adhesive layer. The carbon nanotube layer is adhered on the copper foil plate, and thus a good effect of horizontal plane even heat radiation is obtained, a problem that the carbon nanotube layer is low in vertical heat radiation rate is solved, the tensile strength and rigidity of the material is improved, and by recombination of the heat conducting glue adhesive layer and an outer layer of the corrugated surface sheet metal, the specific surface area of the outmost heat radiation surface is increased ingeniously and substantially, and the heat radiation effect of the material is optimized and improved.
Description
Technical field
The utility model relates to a kind of Metal Substrate carbon composite heat-conducting material.
Background technology
Along with electron trade develops rapidly, many terminal electronic product producer are impacted electronic market by the modes such as compressed products volume of constantly enhancing product performance.This mode increases interiors of products electronic component relative density, take up room and dwindle, thereby caused electronic product in running, electronic component temperature is assembled and cannot be shed, the operation usefulness of product is reduced, and too high temperature even also may produce potential safety hazard.For solve electronic product element because of heat production too much, the heat producing causes electronic product internal temperature too high, and then affect the problem of product operation usefulness, a lot of electronic product choice for use graphite flakes dispel the heat, but the easy dry linting of graphite, has brought certain quality and potential safety hazard to electronic product.Contrast with graphite-phase, metallic copper has higher rigidity and buckling strength, the conductive coefficient of its vertical direction is higher, heat conductivility is better, but the conductive coefficient of its horizontal direction differs greatly with graphite, be not suitable for directly serving as heat sink material in the integrated electronic product of high density components, therefore the common way of industry is after graphite and the laminating of copper aluminium, to use in electronic product inside, to improve thermal conductivity, strengthen radiating effect, but because there is the existence of adhesive layer between graphite flake and metal level, there will be heat to transmit discontinuous phenomenon, and then reduce thermal conductivity and the radiating effect of whole material.
Utility model content
The technical problems to be solved in the utility model is the above-mentioned defect that how to overcome prior art, and a kind of Metal Substrate carbon composite heat-conducting material is provided.
For solving the problems of the technologies described above, this Metal Substrate carbon composite heat-conducting material comprises heat all loose layer, heat conduction gluing layer and heat radiation surface layers of conducting shell, hot plane fast; The quick conducting shell of wherein said heat is one deck copper foil plate, described hot plane all loose layer is the carbon nano-tube that one deck is evenly coated on the quick conducting shell upper surface of described heat, described heat conduction gluing layer is the heat-conducting glue that one deck invests the quick conducting shell lower surface of described heat, and described heat radiation surface layer is the ripple table sheet metal that one deck is attached at described heat conduction gluing layer lower surface.So design, on copper foil plate layer, carbon nano-tube coating layer is defended the contact that heat that thermal source parts produce provides, conduction interfaces, utilize carbon nanotube layer by heat uniformly dispersing on horizontal plane, made up the low problem of the horizontal thermal conductivity of copper foil plate layer, then heat conducts downwards by copper foil plate layer, made up again the low defect of carbon nanotube layer vertical heat transfer rate, improve the hot strength of material simultaneously, rigidity, the two complementation, make this material there is quick and stable thermal conduction effect, and by the compound outer field corrugated surface sheet metal of heat conduction gluing layer, ingenious and increased significantly the specific area of outermost radiating surface, coordinate heat conductive design fast, further reasonably optimize and the perfect radiating effect of this material.
As optimization, the thickness of the quick conducting shell copper foil plate of described heat is greater than or equal to 18um.
As optimization, the described hot plane all thickness of loose layer carbon nanotube layer is all greater than or equal to 5um.
As optimization, the thickness of described heat conduction gluing layer heat-conducting glue is greater than or equal to 25um.
As optimization, the ripple number that described heat radiation surface layer corrugated surface sheet metal is every millimeter is greater than or equal to 3.
A kind of Metal Substrate carbon of the utility model composite heat-conducting material is being formed at carbon nanotube layer on copper foil plate layer in the mode of coating, so that the conduction interfaces of thermal source parts heat production to be provided, and then obtain good horizontal plane Homogeneouslly-radiating effect, made up the low problem of the horizontal thermal conductivity of copper foil plate layer, and copper foil plate layer has made up the low problem of carbon nanotube layer vertical heat transfer rate, improve the hot strength of material simultaneously, rigidity, the two complementation, make this material there is quick and stable thermal conduction effect, and by the compound outer field corrugated surface sheet metal of heat conduction gluing layer, ingenious and increased significantly the specific area of outermost radiating surface, coordinate heat conductive design fast, further reasonably optimize and the perfect radiating effect of this material.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, a kind of Metal Substrate carbon of the utility model composite heat-conducting material is described further:
Fig. 1 is the rip cutting cross section hierarchy schematic diagram of this Metal Substrate carbon composite heat-conducting material.
In figure: 1-heat is all loose layer, 3-heat conduction gluing layer, 4-surface layers that dispels the heat of conducting shell, the hot plane of 2-fast.
Embodiment
This Metal Substrate carbon composite heat-conducting material comprises heat all loose layer 2, heat conduction gluing layer 3 and heat radiation surface layers 4 of conducting shell 1, hot plane fast; The quick conducting shell 1 of wherein said heat is one deck copper foil plate, described hot plane all loose layer 2 is the carbon nano-tube that one deck is evenly coated on quick conducting shell 1 upper surface of described heat, the heat-conducting glue of described heat conduction gluing layer 3 quick conducting shell 1 lower surface of described heat for one deck invests, the ripple table sheet metal of described heat radiation surface layer 4 described heat conduction gluing layer 3 lower surface for one deck is attached at.The thickness of quick conducting shell 1 copper foil plate of described heat is greater than or equal to 18um.The described hot plane all thickness of loose layer 2 carbon nanotube layer is all greater than or equal to 5um.The thickness of described heat conduction gluing layer 3 heat-conducting glue is greater than or equal to 25um.The ripple number that described heat radiation surface layer 4 corrugated surface sheet metal is every millimeter is greater than or equal to 3.
The utility model includes but not limited to above-mentioned execution mode, and any product that meets the description of these claims, within all falling into protection range of the present utility model.
Claims (5)
1. a Metal Substrate carbon composite heat-conducting material, is characterized in that: comprise heat all loose layer (2), heat conduction gluing layer (3) and heat radiation surface layers (4) of conducting shell (1), hot plane fast; The quick conducting shell of wherein said heat (1) is one deck copper foil plate, described hot plane all loose layer (2) is the carbon nano-tube that one deck is evenly coated on the quick conducting shell of described heat (1) upper surface, the heat-conducting glue of described heat conduction gluing layer (3) the quick conducting shell of described heat (1) lower surface for one deck invests, the ripple table sheet metal of described heat radiation surface layer (4) described heat conduction gluing layer (3) lower surface for one deck is attached at.
2. Metal Substrate carbon composite heat-conducting material according to claim 1, is characterized in that: the thickness of the quick conducting shell of described heat (1) copper foil plate is greater than or equal to 18um.
3. Metal Substrate carbon composite heat-conducting material according to claim 1, is characterized in that: the described hot plane all thickness of loose layer (2) carbon nanotube layer is all greater than or equal to 5um.
4. Metal Substrate carbon composite heat-conducting material according to claim 1, is characterized in that: the thickness of described heat conduction gluing layer (3) heat-conducting glue is greater than or equal to 25um.
5. according to the arbitrary described Metal Substrate carbon composite heat-conducting material of claim 1 to 4, it is characterized in that: the ripple number that described heat radiation surface layer (4) corrugated surface sheet metal is every millimeter is greater than or equal to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320704067.4U CN203554878U (en) | 2013-11-08 | 2013-11-08 | Metal based carbon composite heat conducting material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320704067.4U CN203554878U (en) | 2013-11-08 | 2013-11-08 | Metal based carbon composite heat conducting material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203554878U true CN203554878U (en) | 2014-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320704067.4U Expired - Lifetime CN203554878U (en) | 2013-11-08 | 2013-11-08 | Metal based carbon composite heat conducting material |
Country Status (1)
| Country | Link |
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| CN (1) | CN203554878U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
| CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A high-performance heat sink based on aligned carbon nanotube film and its preparation method |
| CN114750490A (en) * | 2022-04-28 | 2022-07-15 | 安徽碳华新材料科技有限公司 | Alkene-carbon composite material with efficient heat dissipation capacity |
-
2013
- 2013-11-08 CN CN201320704067.4U patent/CN203554878U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
| CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A high-performance heat sink based on aligned carbon nanotube film and its preparation method |
| CN114750490A (en) * | 2022-04-28 | 2022-07-15 | 安徽碳华新材料科技有限公司 | Alkene-carbon composite material with efficient heat dissipation capacity |
| CN114750490B (en) * | 2022-04-28 | 2023-10-20 | 安徽碳华新材料科技有限公司 | High-efficiency heat dissipation capacity olefinic carbon composite material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140416 |