CN203554878U - Metal based carbon composite heat conducting material - Google Patents
Metal based carbon composite heat conducting material Download PDFInfo
- Publication number
- CN203554878U CN203554878U CN201320704067.4U CN201320704067U CN203554878U CN 203554878 U CN203554878 U CN 203554878U CN 201320704067 U CN201320704067 U CN 201320704067U CN 203554878 U CN203554878 U CN 203554878U
- Authority
- CN
- China
- Prior art keywords
- heat
- layer
- conducting
- carbon composite
- quick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 title claims abstract description 27
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 16
- 239000002131 composite material Substances 0.000 title claims abstract description 16
- 239000004020 conductor Substances 0.000 title claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims abstract description 16
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 14
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 14
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- 239000002344 surface layer Substances 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 11
- 238000004026 adhesive bonding Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 239000012790 adhesive layer Substances 0.000 abstract description 5
- 230000000191 radiation effect Effects 0.000 abstract 1
- 230000006798 recombination Effects 0.000 abstract 1
- 238000005215 recombination Methods 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 238000005457 optimization Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Images
Abstract
The utility model relates to a metal based carbon composite heat conducting material. The metal based carbon composite heat conducting material comprises a heat quick conducting layer, a heat plane even radiation layer, a heat conducting glue adhesive layer and a heat radiation surface layer. The heat quick conducting layer is a layer of a copper foil plate. The heat plane even radiation layer is a carbon nanotube layer which is evenly coated on an upper surface of the heat quick conducting layer. The heat conducting glue adhesive layer is a layer of heat conducting glue which is adhered to a lower surface of the heat quick conducting layer. The heat radiation surface layer is a corrugated surface sheet metal which is adhered to a lower surface of the heat conducting glue adhesive layer. The carbon nanotube layer is adhered on the copper foil plate, and thus a good effect of horizontal plane even heat radiation is obtained, a problem that the carbon nanotube layer is low in vertical heat radiation rate is solved, the tensile strength and rigidity of the material is improved, and by recombination of the heat conducting glue adhesive layer and an outer layer of the corrugated surface sheet metal, the specific surface area of the outmost heat radiation surface is increased ingeniously and substantially, and the heat radiation effect of the material is optimized and improved.
Description
Technical field
The utility model relates to a kind of Metal Substrate carbon composite heat-conducting material.
Background technology
Along with electron trade develops rapidly, many terminal electronic product producer are impacted electronic market by the modes such as compressed products volume of constantly enhancing product performance.This mode increases interiors of products electronic component relative density, take up room and dwindle, thereby caused electronic product in running, electronic component temperature is assembled and cannot be shed, the operation usefulness of product is reduced, and too high temperature even also may produce potential safety hazard.For solve electronic product element because of heat production too much, the heat producing causes electronic product internal temperature too high, and then affect the problem of product operation usefulness, a lot of electronic product choice for use graphite flakes dispel the heat, but the easy dry linting of graphite, has brought certain quality and potential safety hazard to electronic product.Contrast with graphite-phase, metallic copper has higher rigidity and buckling strength, the conductive coefficient of its vertical direction is higher, heat conductivility is better, but the conductive coefficient of its horizontal direction differs greatly with graphite, be not suitable for directly serving as heat sink material in the integrated electronic product of high density components, therefore the common way of industry is after graphite and the laminating of copper aluminium, to use in electronic product inside, to improve thermal conductivity, strengthen radiating effect, but because there is the existence of adhesive layer between graphite flake and metal level, there will be heat to transmit discontinuous phenomenon, and then reduce thermal conductivity and the radiating effect of whole material.
Utility model content
The technical problems to be solved in the utility model is the above-mentioned defect that how to overcome prior art, and a kind of Metal Substrate carbon composite heat-conducting material is provided.
For solving the problems of the technologies described above, this Metal Substrate carbon composite heat-conducting material comprises heat all loose layer, heat conduction gluing layer and heat radiation surface layers of conducting shell, hot plane fast; The quick conducting shell of wherein said heat is one deck copper foil plate, described hot plane all loose layer is the carbon nano-tube that one deck is evenly coated on the quick conducting shell upper surface of described heat, described heat conduction gluing layer is the heat-conducting glue that one deck invests the quick conducting shell lower surface of described heat, and described heat radiation surface layer is the ripple table sheet metal that one deck is attached at described heat conduction gluing layer lower surface.So design, on copper foil plate layer, carbon nano-tube coating layer is defended the contact that heat that thermal source parts produce provides, conduction interfaces, utilize carbon nanotube layer by heat uniformly dispersing on horizontal plane, made up the low problem of the horizontal thermal conductivity of copper foil plate layer, then heat conducts downwards by copper foil plate layer, made up again the low defect of carbon nanotube layer vertical heat transfer rate, improve the hot strength of material simultaneously, rigidity, the two complementation, make this material there is quick and stable thermal conduction effect, and by the compound outer field corrugated surface sheet metal of heat conduction gluing layer, ingenious and increased significantly the specific area of outermost radiating surface, coordinate heat conductive design fast, further reasonably optimize and the perfect radiating effect of this material.
As optimization, the thickness of the quick conducting shell copper foil plate of described heat is greater than or equal to 18um.
As optimization, the described hot plane all thickness of loose layer carbon nanotube layer is all greater than or equal to 5um.
As optimization, the thickness of described heat conduction gluing layer heat-conducting glue is greater than or equal to 25um.
As optimization, the ripple number that described heat radiation surface layer corrugated surface sheet metal is every millimeter is greater than or equal to 3.
A kind of Metal Substrate carbon of the utility model composite heat-conducting material is being formed at carbon nanotube layer on copper foil plate layer in the mode of coating, so that the conduction interfaces of thermal source parts heat production to be provided, and then obtain good horizontal plane Homogeneouslly-radiating effect, made up the low problem of the horizontal thermal conductivity of copper foil plate layer, and copper foil plate layer has made up the low problem of carbon nanotube layer vertical heat transfer rate, improve the hot strength of material simultaneously, rigidity, the two complementation, make this material there is quick and stable thermal conduction effect, and by the compound outer field corrugated surface sheet metal of heat conduction gluing layer, ingenious and increased significantly the specific area of outermost radiating surface, coordinate heat conductive design fast, further reasonably optimize and the perfect radiating effect of this material.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, a kind of Metal Substrate carbon of the utility model composite heat-conducting material is described further:
Fig. 1 is the rip cutting cross section hierarchy schematic diagram of this Metal Substrate carbon composite heat-conducting material.
In figure: 1-heat is all loose layer, 3-heat conduction gluing layer, 4-surface layers that dispels the heat of conducting shell, the hot plane of 2-fast.
Embodiment
This Metal Substrate carbon composite heat-conducting material comprises heat all loose layer 2, heat conduction gluing layer 3 and heat radiation surface layers 4 of conducting shell 1, hot plane fast; The quick conducting shell 1 of wherein said heat is one deck copper foil plate, described hot plane all loose layer 2 is the carbon nano-tube that one deck is evenly coated on quick conducting shell 1 upper surface of described heat, the heat-conducting glue of described heat conduction gluing layer 3 quick conducting shell 1 lower surface of described heat for one deck invests, the ripple table sheet metal of described heat radiation surface layer 4 described heat conduction gluing layer 3 lower surface for one deck is attached at.The thickness of quick conducting shell 1 copper foil plate of described heat is greater than or equal to 18um.The described hot plane all thickness of loose layer 2 carbon nanotube layer is all greater than or equal to 5um.The thickness of described heat conduction gluing layer 3 heat-conducting glue is greater than or equal to 25um.The ripple number that described heat radiation surface layer 4 corrugated surface sheet metal is every millimeter is greater than or equal to 3.
The utility model includes but not limited to above-mentioned execution mode, and any product that meets the description of these claims, within all falling into protection range of the present utility model.
Claims (5)
1. a Metal Substrate carbon composite heat-conducting material, is characterized in that: comprise heat all loose layer (2), heat conduction gluing layer (3) and heat radiation surface layers (4) of conducting shell (1), hot plane fast; The quick conducting shell of wherein said heat (1) is one deck copper foil plate, described hot plane all loose layer (2) is the carbon nano-tube that one deck is evenly coated on the quick conducting shell of described heat (1) upper surface, the heat-conducting glue of described heat conduction gluing layer (3) the quick conducting shell of described heat (1) lower surface for one deck invests, the ripple table sheet metal of described heat radiation surface layer (4) described heat conduction gluing layer (3) lower surface for one deck is attached at.
2. Metal Substrate carbon composite heat-conducting material according to claim 1, is characterized in that: the thickness of the quick conducting shell of described heat (1) copper foil plate is greater than or equal to 18um.
3. Metal Substrate carbon composite heat-conducting material according to claim 1, is characterized in that: the described hot plane all thickness of loose layer (2) carbon nanotube layer is all greater than or equal to 5um.
4. Metal Substrate carbon composite heat-conducting material according to claim 1, is characterized in that: the thickness of described heat conduction gluing layer (3) heat-conducting glue is greater than or equal to 25um.
5. according to the arbitrary described Metal Substrate carbon composite heat-conducting material of claim 1 to 4, it is characterized in that: the ripple number that described heat radiation surface layer (4) corrugated surface sheet metal is every millimeter is greater than or equal to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320704067.4U CN203554878U (en) | 2013-11-08 | 2013-11-08 | Metal based carbon composite heat conducting material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320704067.4U CN203554878U (en) | 2013-11-08 | 2013-11-08 | Metal based carbon composite heat conducting material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203554878U true CN203554878U (en) | 2014-04-16 |
Family
ID=50472932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320704067.4U Expired - Lifetime CN203554878U (en) | 2013-11-08 | 2013-11-08 | Metal based carbon composite heat conducting material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203554878U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
| CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A kind of radiator with high performance based on aligned carbon nanotube film and preparation method |
| CN114750490A (en) * | 2022-04-28 | 2022-07-15 | 安徽碳华新材料科技有限公司 | Alkene-carbon composite material with efficient heat dissipation capacity |
-
2013
- 2013-11-08 CN CN201320704067.4U patent/CN203554878U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
| CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A kind of radiator with high performance based on aligned carbon nanotube film and preparation method |
| CN114750490A (en) * | 2022-04-28 | 2022-07-15 | 安徽碳华新材料科技有限公司 | Alkene-carbon composite material with efficient heat dissipation capacity |
| CN114750490B (en) * | 2022-04-28 | 2023-10-20 | 安徽碳华新材料科技有限公司 | High-efficiency heat dissipation capacity olefinic carbon composite material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140416 |