CN203618272U - Novel thermal insulating structure - Google Patents
Novel thermal insulating structure Download PDFInfo
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- CN203618272U CN203618272U CN201320736291.1U CN201320736291U CN203618272U CN 203618272 U CN203618272 U CN 203618272U CN 201320736291 U CN201320736291 U CN 201320736291U CN 203618272 U CN203618272 U CN 203618272U
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Abstract
The utility model discloses a novel thermal insulating structure comprising a heat source contact layer, an insulating thermal layer, a middle connecting layer and a rapid heat radiating layer. The insulating thermal layer is arranged between the heat source contact layer and the middle connecting layer. The rapid heat radiating layer is welded at the lower surface of the middle connecting layer. Through the above mode, the novel thermal insulating structure disclosed by the utility model can be directly welded to an external heat source for use, the heat conduction is more direct, the insulating thermal layer is made of modified insulating grapheme, the insulation effect is good, the planar heat conduction performance of a composite material can be improved, the heat resistance is small, the heat conduction is more uniform and rapid, the heat radiation effect is good, the protection of the external heat source is good, and the security is high.
Description
Technical field
The utility model relates to heat conduction technical field, particularly relates to a kind of Novel heat-conducting insulation system.
Background technology
Along with the development of modern science and technology, the function of various smart machines from strength to strength, and volume does less and less, small and exquisite outward appearance is conveniently installed and is carried, brought dramatic change to people's production and life, but because smart machine volume is too small, the heat producing when internal component running can not pass in time, easily cause decline or the damage of equipment performance, even blast.Can say, heat dissipation problem is just perplexing further developing of intelligent equipment.
The modes such as that existing radiating mode generally has is air-cooled, liquid cooling, are all that local pyrexia is expanded to greater room, take away heat by air or liquid.Such as the common gilled radiator that is applied in all kinds of electronic devices surface, adopt many aluminium flakes or copper sheet to take away the heat that device sends, but metal material heat conductivility is limited, such as the conductive coefficient 377W/mK of copper, aluminium is 230W/mK), metal is conductor simultaneously, and aluminium flake or copper sheet may cause the danger such as short circuit when charged device is dispelled the heat.If heat carrier is carried out to insulation processing, can increase again thermal resistance, reduce the capacity of heat transmission.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of Novel heat-conducting insulation system, and heat transfer efficiency is high, good insulation preformance, and radiating rate is fast.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of Novel heat-conducting insulation system is provided, comprise: thermal source contact layer, thermal insulation layer, intermediate connecting layer and quick heat radiating layer, described thermal insulation layer is arranged between thermal source contact layer and intermediate connecting layer, and described quick heat radiating layer is welded on the lower surface of intermediate connecting layer.
In preferred embodiment of the utility model, described thermal source contact layer is copper sheet metal.
In preferred embodiment of the utility model, described thermal insulation layer is nano level Graphene thin layer, and described Graphene thin layer adopts chemical deposition or physical method to be attached to the lower surface of thermal source contact layer.
In preferred embodiment of the utility model, the material that described Graphene thin layer adopts is modification insulation Graphene.
In preferred embodiment of the utility model, described intermediate connecting layer is nickel material coating.
In preferred embodiment of the utility model, described intermediate connecting layer is plated in the lower surface of thermal insulation layer.
In preferred embodiment of the utility model, described quick heat radiating layer is aluminium matter or copper cooling fin, and described aluminium matter or copper cooling fin are fin structure or thin-slab structure.
In preferred embodiment of the utility model, the upper surface of described aluminium matter or copper cooling fin is a plane, and described plane-welding is on described nickel material coating.
The beneficial effects of the utility model are: a kind of Novel heat-conducting insulation system that the utility model is pointed out; can directly be welded on external heat source and use; heat conduction is more direct, and thermal insulation layer adopts modification insulation Graphene, and not only insulation effect is good; more can improve composite material plane heat conductivility; thermal resistance is little, and the heat conduction making is more all even quick, good heat dissipation effect; good to the protectiveness of external heat source, safe.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the structural representation of a kind of Novel heat-conducting insulation system one preferred embodiment of the utility model.
In accompanying drawing, the mark of each parts is as follows: 1, thermal source contact layer, 2, thermal insulation layer, 3, intermediate connecting layer, 4, quick heat radiating layer.
Embodiment
To the technical scheme in the utility model embodiment be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present utility model, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making all other embodiment that obtain under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1, the utility model embodiment comprises:
A kind of Novel heat-conducting insulation system, comprise: thermal source contact layer 1, thermal insulation layer 2, intermediate connecting layer 3 and quick heat radiating layer 4, described thermal insulation layer 2 is arranged between thermal source contact layer 1 and intermediate connecting layer 3, and described quick heat radiating layer 4 is welded on the lower surface of intermediate connecting layer 3.
Further, described thermal source contact layer 1 is copper sheet metal.The heat-conducting effect of copper is outstanding, and be the situation of metal material for external heat source, the welding performance of copper is also outstanding, can weld with most metal materials, Novel heat-conducting insulation system can more directly be contacted with external heat source, rather than use traditional glue viscose glue, and the thermal resistance of glue is large, and heat conduction is slow.
The feature of a kind of Novel heat-conducting insulation system of the utility model maximum is to have adopted Graphene, and described thermal insulation layer 2 is nano level Graphene thin layer, and described Graphene thin layer adopts chemical deposition or physical method to be attached to the lower surface of thermal source contact layer 1.X, the y direction conductive coefficient of Graphene thin layer are very high, can Optimization of Copper or the heat conductivility of aluminum x, y direction, although Graphene z direction conductive coefficient is not high, due to thickness ultrathin, reach nanoscale, so thermal resistance is very little.
Further, the material that described Graphene thin layer adopts is modification insulation Graphene, and heat conductivility is outstanding, and has insulation effect, causes the problem of short circuit when effectively having avoided the utility model to dispel the heat to charged device.
Further, described intermediate connecting layer 3 is nickel material coating, and described intermediate connecting layer 3 is plated in the lower surface of thermal insulation layer 2.Graphene cannot weld with aluminium, and the utility model has utilized nickel as intermediate connecting layer 3 cleverly.
Further, described quick heat radiating layer 4 is aluminium matter or copper cooling fin, and described aluminium matter or copper cooling fin are fin structure or thin-slab structure, and area of dissipation expands, and good heat dissipation effect, speed are fast.
Further, the upper surface of described aluminium matter or copper cooling fin is a plane, and described plane-welding is on described nickel material coating.Due to the help of Graphene thin layer, the heat radiation uniformity of aluminium matter or copper cooling fin is also relatively good.
In sum, a kind of Novel heat-conducting insulation system that the utility model is pointed out, has avoided the use of adhesive in conventional composite heat sink material; the thermal resistance of entirety is little, good heat conduction effect, and heat conduction is even; and there is insulation effect, good to the protectiveness of components and parts, safe.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model description to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (8)
1. a Novel heat-conducting insulation system, it is characterized in that, comprise: thermal source contact layer, thermal insulation layer, intermediate connecting layer and quick heat radiating layer, described thermal insulation layer is arranged between thermal source contact layer and intermediate connecting layer, and described quick heat radiating layer is welded on the lower surface of intermediate connecting layer.
2. a kind of Novel heat-conducting insulation system according to claim 1, is characterized in that, described thermal source contact layer is copper sheet metal.
3. a kind of Novel heat-conducting insulation system according to claim 1, is characterized in that, described thermal insulation layer is nano level Graphene thin layer, and described Graphene thin layer adopts chemical deposition or physical method to be attached to the lower surface of thermal source contact layer.
4. a kind of Novel heat-conducting insulation system according to claim 3, is characterized in that, the material that described Graphene thin layer adopts is modification insulation Graphene.
5. a kind of Novel heat-conducting insulation system according to claim 1, is characterized in that, described intermediate connecting layer is nickel material coating.
6. a kind of Novel heat-conducting insulation system according to claim 5, is characterized in that, described intermediate connecting layer is plated in the lower surface of thermal insulation layer.
7. a kind of Novel heat-conducting insulation system according to claim 5, is characterized in that, described quick heat radiating layer is aluminium matter or copper cooling fin, and described aluminium matter or copper cooling fin are fin structure or thin-slab structure.
8. a kind of Novel heat-conducting insulation system according to claim 7, is characterized in that, the upper surface of described aluminium matter or copper cooling fin is a plane, and described plane-welding is on described nickel material coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320736291.1U CN203618272U (en) | 2013-11-21 | 2013-11-21 | Novel thermal insulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320736291.1U CN203618272U (en) | 2013-11-21 | 2013-11-21 | Novel thermal insulating structure |
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| CN203618272U true CN203618272U (en) | 2014-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320736291.1U Expired - Fee Related CN203618272U (en) | 2013-11-21 | 2013-11-21 | Novel thermal insulating structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103648253A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Novel thermally conductive and insulating structure |
| CN104723621A (en) * | 2015-03-27 | 2015-06-24 | 东莞市闻誉实业有限公司 | Novel composite material |
| CN107732825A (en) * | 2017-09-29 | 2018-02-23 | 上海市政工程设计研究总院（集团）有限公司 | A kind of big current-carrying capacity of heat-pipe radiator heat dissipation type pours into a mould bus and its heat dissipating method |
| CN111545855A (en) * | 2020-05-14 | 2020-08-18 | 北京航空航天大学 | Multifunctional structure passive heat dissipation device and welding method of high-thermal-conductivity heat conduction belt thereof |
-
2013
- 2013-11-21 CN CN201320736291.1U patent/CN203618272U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103648253A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Novel thermally conductive and insulating structure |
| CN103648253B (en) * | 2013-11-21 | 2016-01-20 | 苏州市莱赛电车技术有限公司 | A kind of Novel heat-conducting insulation system |
| CN104723621A (en) * | 2015-03-27 | 2015-06-24 | 东莞市闻誉实业有限公司 | Novel composite material |
| CN104723621B (en) * | 2015-03-27 | 2016-07-06 | 东莞市闻誉实业有限公司 | Composite |
| CN107732825A (en) * | 2017-09-29 | 2018-02-23 | 上海市政工程设计研究总院（集团）有限公司 | A kind of big current-carrying capacity of heat-pipe radiator heat dissipation type pours into a mould bus and its heat dissipating method |
| CN111545855A (en) * | 2020-05-14 | 2020-08-18 | 北京航空航天大学 | Multifunctional structure passive heat dissipation device and welding method of high-thermal-conductivity heat conduction belt thereof |
| CN111545855B (en) * | 2020-05-14 | 2021-07-02 | 北京航空航天大学 | Multifunctional structure passive heat dissipation device and welding method of high-thermal-conductivity heat conduction belt thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20151121 |