CN209643067U - A kind of novel high thermal conductivity aluminum matrix wiring board - Google Patents
A kind of novel high thermal conductivity aluminum matrix wiring board Download PDFInfo
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- CN209643067U CN209643067U CN201821861119.8U CN201821861119U CN209643067U CN 209643067 U CN209643067 U CN 209643067U CN 201821861119 U CN201821861119 U CN 201821861119U CN 209643067 U CN209643067 U CN 209643067U
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Abstract
The utility model relates to aluminum-based circuit board technical fields, and disclose a kind of novel high thermal conductivity aluminum matrix wiring board, including aluminum-based circuit board ontology, heat-conducting layer and wearing layer, the top of the wearing layer is connect with the bottom of aluminum-based circuit board ontology, the aluminum-based circuit board ontology is by port, mounting hole, circuit layer, insulating layer, aluminum base layer and card slot composition, the bottom of the circuit layer and the top of insulating layer connect, the top of the aluminum base layer and the bottom of insulating layer connect, the inside of aluminum-based circuit board ontology is arranged in the port, the inside of aluminum-based circuit board ontology and the inside of wearing layer is arranged in the mounting hole, the two sides of aluminum-based circuit board ontology and the two sides of wearing layer are arranged in the card slot, the heat-conducting layer is by copper layer, ceramic layer, copper foil layer, graphene layer, cooling fin, epoxy resin layer and polyvinyl chloride panel composition.It is bad that the utility model solves heat dissipation, easily because wiring board overheats, the problem of causing wiring board to damage.
Description
Technical field
The utility model relates to aluminum-based circuit board technical field, specially a kind of novel high thermal conductivity aluminum matrix wiring board.
Background technique
With the continuous development of social progress and science and technology, the field that wiring board is related to is more and more, and to wiring board
Requirement it is higher and higher.Traditional wiring board is long using the technological process of production, environmental pollution is big, resource utilization is low；In addition, right
It is bad due to radiating in the wiring board of some high currents, easily because wiring board overheats, wiring board is caused to damage.
Utility model content
The purpose of this utility model is to provide a kind of novel high thermal conductivity aluminum matrix wiring boards, reach aluminum-based circuit board heat dissipation
It is high-efficient, so that aluminum-based circuit board service life is obtained extended purpose.
To achieve the above object, the utility model provides the following technical solutions: a kind of novel high thermal conductivity aluminum matrix wiring board, packet
Aluminum-based circuit board ontology, heat-conducting layer and wearing layer are included, the top of the wearing layer is connect with the bottom of aluminum-based circuit board ontology, institute
It states aluminum-based circuit board ontology to be made of port, mounting hole, circuit layer, insulating layer, aluminum base layer and card slot, the bottom of the circuit layer
It is connect with the top of insulating layer, the top of the aluminum base layer and the bottom of insulating layer connect, and the port is arranged in aluminium base route
The inside of aluminum-based circuit board ontology and the inside of wearing layer, the card slot setting is arranged in the inside of plate ontology, the mounting hole
In the two sides of aluminum-based circuit board ontology and the two sides of wearing layer.
The heat-conducting layer is by copper layer, ceramic layer, copper foil layer, graphene layer, cooling fin, epoxy resin layer and polyvinyl chloride
Board group is connected at the bottom of, the copper layer and the top of ceramic layer, and the bottom of the ceramic layer and the top of copper foil layer connect,
The bottom of the copper foil layer and the top of graphene layer connect, and the bottom of the graphene layer and the top of cooling fin connect, institute
The top of the bottom and epoxy resin layer of stating cooling fin connects, and connects at the top of the bottom of the epoxy resin layer and polyvinyl chloride panel
It connects.
The wearing layer is worked out by adhesive layer, ceramic powder last layer, internal organization level, steel-tape armouring layer, enhancement layer and surface layer
Net composition, the bottom of the adhesive layer and the top of ceramic powder last layer connect, and the bottom and inside of the ceramic powder last layer are worked out
The bottom of the top connection of layer, the internal organization level is connect with the top of steel-tape armouring layer, the bottom of the steel-tape armouring layer
It is connect with the top of enhancement layer, the bottom of the enhancement layer is connect with the top of surface layer establishment net.
Preferably, the inside of the port and the outer surface of heat-conducting layer connect.
Preferably, the circuit layer with a thickness of 2/3rds of insulating layer, the thickness with a thickness of aluminum base layer of insulating layer
3/4ths.
Preferably, the thickness of the copper layer, ceramic layer, copper foil layer, graphene layer, epoxy resin layer and polyvinyl chloride panel
It is consistent, 2/3rds of the thickness with a thickness of ceramic layer of cooling fin.
Preferably, the consistency of thickness of the thickness of the wearing layer and aluminum base layer, adhesive layer, ceramic powder last layer, internal establishment
Layer, steel-tape armouring layer, enhancement layer and the thickness of surface layer establishment net are consistent.
Preferably, the outer surface of the surface layer establishment net is connected with flexible metal net.
The utility model provides a kind of novel high thermal conductivity aluminum matrix wiring board.Have it is following the utility model has the advantages that
(1), the utility model by copper layer, ceramic layer, copper foil layer, graphene layer, cooling fin, epoxy resin layer and gathers
The setting of vinyl chloride sheet so that the heat spreader speed on aluminum-based circuit board upper layer mentions fastly, while using ceramic layer logical as heat dissipation
Road improves the mobility of heat, by the setting of polyvinyl chloride panel, not only ensure that the insulating properties of circuit board body bottom, but also
The wearability and corrosion resistance of circuit board body bottom are increased, so that the service life of wiring board gets a promotion.
(2), the utility model passes through adhesive layer, ceramic powder last layer, internal organization level, steel-tape armouring layer, enhancement layer and table
The setting of layer establishment net, aluminum-based circuit board by being placed on need tool to be used by staff manually, by by bolt
In incoming mounting hole, then by rotating bolt, it is transferred to bolt at the position connected using tool, in order to make aluminium base route
Accurate positioning when the position connection that plate is connect with the tool, aluminum-based circuit board can be in contact with the position of installation, pass through
It is compiled on the bottom of aluminum-based circuit board setting adhesive layer, ceramic powder last layer, internal organization level, steel-tape armouring layer, enhancement layer and surface layer
Net processed, so that the wearability that aluminum-based circuit board has, avoids aluminum-based circuit board from damaging when installation, increase aluminium base
The service life of plate.
Detailed description of the invention
Fig. 1 is the utility model perspective view；
Fig. 2 is the structural schematic diagram of the utility model heat-conducting layer；
Fig. 3 is the structural schematic diagram of the utility model wearing layer.
In figure: 1 aluminum-based circuit board ontology, 101 ports, 102 mounting holes, 103 circuit layers, 104 insulating layers, 105 aluminum base layers,
106 card slots, 2 heat-conducting layers, 201 copper layers, 202 ceramic layers, 203 copper foil layers, 204 graphene layers, 205 cooling fins, 206 epoxies
Resin layer, 207 polyvinyl chloride panels, 3 wearing layers, 301 adhesive layers, 302 ceramic powder last layers, 303 inside organization levels, 304 steel band armours
Fill layer, 305 enhancement layers, 306 surface layers establishment net.
Specific embodiment
As shown in Figure 1-3, the utility model provides a kind of technical solution: a kind of novel high thermal conductivity aluminum matrix wiring board, including
Aluminum-based circuit board ontology 1, heat-conducting layer 2 and wearing layer 3, the fixed company in the top of wearing layer 3 and the bottom of aluminum-based circuit board ontology 1
It connects, aluminum-based circuit board ontology 1 is by port 101, mounting hole 102, circuit layer 103, insulating layer 104, aluminum base layer 105 and card slot 106
Composition, the bottom of circuit layer 103 are fixedly connected with the top of insulating layer 104, the top of aluminum base layer 105 and the bottom of insulating layer 104
Portion is fixedly connected, and the position of port 101 is provided with the inside of aluminum-based circuit board ontology 1, and the position of mounting hole 102 is provided with aluminium base
The inside of wiring board ontology 1 and the inside of wearing layer 3, the position of card slot 106 are provided with the two sides of aluminum-based circuit board ontology 1 and resistance to
Grind the two sides of layer 3.
Heat-conducting layer 2 is by copper layer 201, ceramic layer 202, copper foil layer 203, graphene layer 204, cooling fin 205, epoxy resin
Layer 206 and polyvinyl chloride panel 207 form, and the bottom of copper layer 201 is fixedly connected with the top of ceramic layer 202, ceramic layer 202
Bottom be fixedly connected with the top of copper foil layer 203, the bottom of copper foil layer 203 is fixedly connected with the top of graphene layer 204, stone
The bottom of black alkene layer 204 is fixedly connected with the top of cooling fin 205, the bottom of cooling fin 205 and the top of epoxy resin layer 206
It is fixedly connected, the bottom of epoxy resin layer 206 is fixedly connected with the top of polyvinyl chloride panel 207.
Wearing layer 3 is by adhesive layer 301, ceramic powder last layer 302, internal organization level 303, steel-tape armouring layer 304, enhancement layer
305 and surface layer establishment net 306 form, the bottom of adhesive layer 301 is fixedly connected with the top of ceramic powder last layer 302, ceramic powders
The bottom of layer 302 is fixedly connected with the top of internal organization level 303, bottom and the steel-tape armouring layer 304 of internal organization level 303
Top is fixedly connected, and the bottom of steel-tape armouring layer 304 is fixedly connected with the top of enhancement layer 305, the bottom of enhancement layer 305 with
The top of surface layer establishment net 306 is fixedly connected, and the inside of port 101 is fixedly connected with the outer surface of heat-conducting layer 2, circuit layer 103
With a thickness of 2/3rds of insulating layer 104,3/4ths of the thickness with a thickness of aluminum base layer 105 of insulating layer 104, copper layer
201, ceramic layer 202, copper foil layer 203, graphene layer 204, epoxy resin layer 206 and the thickness of polyvinyl chloride panel 207 are consistent,
2/3rds of the thickness with a thickness of ceramic layer 202 of cooling fin 205, the thickness of wearing layer 3 and the thickness one of aluminum base layer 105
It causes, net is worked out on adhesive layer 301, ceramic powder last layer 302, internal organization level 303, steel-tape armouring layer 304, enhancement layer 305 and surface layer
306 thickness is consistent, and the outer surface of surface layer establishment net 306 is fixedly connected with flexible metal net, the inside spiral shell of mounting hole 102
Line is connected with bolt, the copper layer 201, ceramic layer 202, copper foil layer 203, graphene layer 204, cooling fin 205, epoxy resin
Layer 206, adhesive layer 301, ceramic powder last layer 302, internal organization level 303, steel-tape armouring layer 304, is reinforced polyvinyl chloride panel 207
The inside of layer 305 and surface layer establishment net 306 offers heat release hole.
When in use, staff is needed on tool to be used by being manually placed on aluminum-based circuit board 1, by by spiral shell
Bolt is passed in mounting hole 102, then by rotating bolt, is transferred to bolt at the position connected using tool, in order to make aluminium
Accurate positioning when the position connection that base circuit board 1 is connect with the tool, aluminum-based circuit board 1 can connect with the position of installation
Touching, by the way that adhesive layer 301, ceramic powder last layer 302, internal organization level 303, steel-tape armouring is arranged in the bottom of aluminum-based circuit board 1
Layer 304, enhancement layer 305 and surface layer establishment net 306 make simultaneously so that the heat spreader speed on 1 upper layer of aluminum-based circuit board mentions fastly
It uses ceramic layer 202 as heat dissipation channel, improves the mobility of heat, pass through the setting of polyvinyl chloride panel.
It can to sum up obtain, the utility model passes through copper layer 201, ceramic layer 202, copper foil layer 203, graphene layer 204, heat dissipation
The setting of piece 205, epoxy resin layer 206 and polyvinyl chloride panel 207, so that the heat spreader speed on 1 upper layer of aluminum-based circuit board mentions
Fastly, it while using ceramic layer 202 as heat dissipation channel, improves the mobility of heat, by the setting of polyvinyl chloride panel, both protected
The insulating properties of circuit board body bottom has been demonstrate,proved, and has increased the wearability and corrosion resistance of circuit board body bottom, so that route
The service life of plate gets a promotion, and the utility model passes through adhesive layer 301, ceramic powder last layer 302, internal organization level 303, steel-tape armouring
The setting of layer 304, enhancement layer 305 and surface layer establishment net 306, staff is by being placed on needs for aluminum-based circuit board 1 manually
On the tool used, by the way that bolt to be passed in mounting hole 102, then by rotating bolt, so that bolt is transferred to this and use tool institute
At the position of connection, accurate positioning when connection for the position for connecting aluminum-based circuit board 1 with the tool, aluminium base route
Plate 1 can and the position of installation be in contact, by the bottom of aluminum-based circuit board 1 be arranged adhesive layer 301, ceramic powder last layer 302,
Net 306 is worked out on internal organization level 303, steel-tape armouring layer 304, enhancement layer 305 and surface layer so that aluminum-based circuit board 1 have it is resistance to
Mill property avoids aluminum-based circuit board 1 from damaging when installation, increases the service life of aluminum substrate.
Claims (7)
1. a kind of novel high thermal conductivity aluminum matrix wiring board, including aluminum-based circuit board ontology (1), heat-conducting layer (2) and wearing layer (3), institute
The top for stating wearing layer (3) is connect with the bottom of aluminum-based circuit board ontology (1), it is characterised in that: the aluminum-based circuit board ontology
(1) by port (101), mounting hole (102), circuit layer (103), insulating layer (104), aluminum base layer (105) and card slot (106) group
At the bottom of the circuit layer (103) is connect with the top of insulating layer (104), the top of the aluminum base layer (105) and insulating layer
(104) bottom connection, the port (101) are arranged in the inside of aluminum-based circuit board ontology (1), and the mounting hole (102) sets
The inside in aluminum-based circuit board ontology (1) and the inside of wearing layer (3) are set, the card slot (106) is arranged in aluminum-based circuit board sheet
The two sides of body (1) and the two sides of wearing layer (3)；
The heat-conducting layer (2) is by copper layer (201), ceramic layer (202), copper foil layer (203), graphene layer (204), cooling fin
(205), epoxy resin layer (206) and polyvinyl chloride panel (207) composition, the bottom and ceramic layer (202) of the copper layer (201)
Top connection, the bottom of the ceramic layer (202) connect with the top of copper foil layer (203), the bottom of the copper foil layer (203)
It is connect with the top of graphene layer (204), the bottom of the graphene layer (204) is connect with the top of cooling fin (205), described
The bottom of cooling fin (205) is connect with the top of epoxy resin layer (206), the bottom of the epoxy resin layer (206) and polychlorostyrene
The top of vinyl plate (207) connects；
The wearing layer (3) is by adhesive layer (301), ceramic powder last layer (302), internal organization level (303), steel-tape armouring layer
(304), enhancement layer (305) and surface layer establishment net (306) composition, the bottom and ceramic powder last layer (302) of the adhesive layer (301)
Top connection, the bottom of the ceramic powder last layer (302) connect with the top of internal organization level (303), it is described inside work out
The bottom of layer (303) is connect with the top of steel-tape armouring layer (304), the bottom of the steel-tape armouring layer (304) and enhancement layer
(305) top connection, the bottom of the enhancement layer (305) are connect with the top of surface layer establishment net (306).
2. a kind of novel high thermal conductivity aluminum matrix wiring board according to claim 1, it is characterised in that: the port (101)
Inside is connect with the outer surface of heat-conducting layer (2).
3. a kind of novel high thermal conductivity aluminum matrix wiring board according to claim 1, it is characterised in that: the circuit layer (103)
With a thickness of 2/3rds of insulating layer (104), 3/4ths of the thickness with a thickness of aluminum base layer (105) of insulating layer (104).
4. a kind of novel high thermal conductivity aluminum matrix wiring board according to claim 1, it is characterised in that: the copper layer (201),
Ceramic layer (202), copper foil layer (203), graphene layer (204), epoxy resin layer (206) and polyvinyl chloride panel (207) thickness
It is consistent, 2/3rds of the thickness with a thickness of ceramic layer (202) of cooling fin (205).
5. a kind of novel high thermal conductivity aluminum matrix wiring board according to claim 1, it is characterised in that: the wearing layer (3)
The consistency of thickness of thickness and aluminum base layer (105), adhesive layer (301), ceramic powder last layer (302), internal organization level (303), steel band
Armor (304), enhancement layer (305) and the thickness of surface layer establishment net (306) are consistent.
6. a kind of novel high thermal conductivity aluminum matrix wiring board according to claim 1, it is characterised in that: work out net in the surface layer
(306) outer surface is connected with flexible metal net.
7. a kind of novel high thermal conductivity aluminum matrix wiring board according to claim 1, it is characterised in that: the mounting hole (102)
Inside thread be connected with bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821861119.8U CN209643067U (en) | 2018-11-12 | 2018-11-12 | A kind of novel high thermal conductivity aluminum matrix wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821861119.8U CN209643067U (en) | 2018-11-12 | 2018-11-12 | A kind of novel high thermal conductivity aluminum matrix wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209643067U true CN209643067U (en) | 2019-11-15 |
Family
ID=68472756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821861119.8U Active CN209643067U (en) | 2018-11-12 | 2018-11-12 | A kind of novel high thermal conductivity aluminum matrix wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209643067U (en) |
-
2018
- 2018-11-12 CN CN201821861119.8U patent/CN209643067U/en active Active
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