CN207766645U - A kind of radiator structure of pcb board - Google Patents
A kind of radiator structure of pcb board Download PDFInfo
- Publication number
- CN207766645U CN207766645U CN201721591735.1U CN201721591735U CN207766645U CN 207766645 U CN207766645 U CN 207766645U CN 201721591735 U CN201721591735 U CN 201721591735U CN 207766645 U CN207766645 U CN 207766645U
- Authority
- CN
- China
- Prior art keywords
- heat
- pcb board
- radiator structure
- dissipating layer
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 16
- 239000010439 graphite Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of radiator structures of pcb board, including substrate, insulating layer, heat dissipating layer and graphite linings, which is characterized in that the two substrates are parallel to each other；Heat dissipating layer is equipped between the two substrates；Insulating layer is equipped between the heat dissipating layer and any substrate；The graphite linings are arranged between insulating layer and heat dissipating layer.The utility model, simple in structure, easy to use, good heat dissipation effect, service life are long.
Description
Technical field
The utility model is related to a kind of technical field of PCB board, more particularly to a kind of radiator structure of pcb board.
Background technology
PCB, that is, printed circuit board, also known as printed wiring board, are important electronic unit, are the supports of electronic component
Body is the supplier of electronic component electrical connection.Almost each our common electronic equipment, such as electronic hand in life
Table, calculator, computer, telecommunications etc. are required for using PCB editions.Single pcb board includes multiple monolithics, these monolithics tool
There are identical structure and pattern, used with being segmented into multiple monolithics after the making and test for completing pcb board, to realize rule
The production of modelling.
With the continuous development of electronic technology, pcb board is to high density, in high precision, fine pore, thin wire, thin space, Gao Ke
It leans on, multiple stratification, high-speed transfer, light weight, slim direction is developed.Therefore higher and higher in the integrated level of pcb board, the electricity on circuit board
Subcomponent quantity is also more and more, and power is also increasing so that PCB surface temperature is higher and higher.At present to the main of pcb board
It radiates by the manufacture material with heat dissipation effect is used, but this heat dissipation effect is poor, to the higher pcb board of cooling requirements
It just cannot be satisfied requirement, it is therefore desirable to a kind of pcb board radiator structure of good heat dissipation effect.
Utility model content
In order to overcome the shortcomings of the prior art, the utility model provides a kind of easy to use, and good heat dissipation effect makes
With the pcb board radiator structure of long lifespan.
Technical solution adopted by the utility model to solve its technical problems is：A kind of radiator structure of pcb board, including base
Plate, insulating layer, heat dissipating layer and graphite linings, which is characterized in that the two substrates are parallel to each other；Heat dissipation is equipped between the two substrates
Layer；Insulating layer is equipped between the heat dissipating layer and any substrate；The graphite linings are arranged between insulating layer and heat dissipating layer.
Preferably, radiator structure further includes heat dissipation film, thermal conductive metal plate and heat conduction copper bar；The heat conduction copper bar setting exists
In heat dissipating layer；The thermal conductive metal plate is connected with heat conduction copper bar.
Preferably, being designed with heat emission hole on the two substrates, two substrates are equipped with cooling fin on two side.
Preferably, the heat conduction copper bar runs through heat dissipating layer both sides, heat dissipation is posted on the heat conduction copper bar surface for stretching out heat dissipating layer
Film.
It is nano-sized carbon heat dissipation film as the preferred heat dissipation film.
Preferably, the thermal conductive metal plate is connected by welding with heat conduction copper bar, thermal conductive metal plate upper and lower ends
Contacted with the lower layer of graphite linings.
Preferably, the graphite linings are graphene.
Preferably, metal conducting strip is made of aluminium alloy.
Advantageous effect：The radiator structure of the utility model pcb board passes through the thermal conductive metal plate and conduction copper in heat dissipating layer
The heat that heat sink generates is transmitted to outside, is radiated using air, along with the heat dissipation with heat dissipation film and cooling fin, energy by item
Effectively heat is dissipated；This design good heat dissipation effect, rapid heat dissipation, and service life is long, is hardly damaged.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the structural schematic diagram of the radiator structure of the utility model pcb board.
1- heat emission holes；2- cooling fins；3- insulating layers；4- heat dissipating layers；5- substrates；6- thermal conductive metal plates；7- graphite linings；8- is led
Hot copper bar；9- heat dissipation films.
Specific implementation mode
The utility model is described in further detail presently in connection with attached drawing.These attached drawings are simplified schematic diagram,
Only illustrate the basic structure of the utility model in a schematic way, therefore it only shows composition related with the utility model.
As shown in Figure 1, a kind of radiator structure of pcb board, including substrate 5, insulating layer 3, heat dissipating layer 4, graphite linings 7, heat dissipation
Film 4, thermal conductive metal plate 6 and heat conduction copper bar 8.Two substrates 5 are mutually parallel, and two substrates 5 are equipped with heat emission hole 1, and two substrates 5 are left
Right both sides are equipped with cooling fin 2, are convenient for the heat dissipation of substrate 5；Heat dissipating layer 4 is arranged between two substrates 5；Heat dissipating layer 4 and any substrate 5
Between be equipped with insulating layer 3；Graphite linings 7 are arranged between insulating layer 3 and heat dissipating layer 4, and graphite linings 7 are graphene；Heat dissipation film 9 uses
Nano-sized carbon heat dissipation film；Thermal conductive metal plate 6 is arranged inside heat dissipating layer 4, and thermal conductive metal plate 6 is linked as by welding with heat conduction copper bar 8
One, and 6 upper and lower ends of thermal conductive metal plate are contacted with 7 lower layer of graphite linings；Heat conduction copper bar 8 runs through 4 both ends of heat dissipating layer, stretches out and dissipates
Post heat dissipation film in 8 surface of heat conduction copper bar of thermosphere 4.
Heat is transmitted to heat dissipating layer by the utility model by graphite linings, the thermal conductive metal plate in heat dissipating layer and heat conduction copper bar
Heat is transmitted to the external world again using the good thermal conductivity of metal, is radiated by air and heat dissipation film, it is quick to reach
The effect of heat dissipation.
It is enlightenment, through the above description, related work people with the above-mentioned desirable embodiment according to the utility model
Member can carry out various changes and amendments in the range of without departing from this item utility model technological thought completely.This item is real
It is not limited to the contents of the specification with novel technical scope, it is necessary to which its technology is determined according to right
Property range.
Claims (7)
1. a kind of radiator structure of pcb board, including substrate, insulating layer, heat dissipating layer and graphite linings, the two substrates are parallel to each other,
It is equipped with heat dissipating layer between the two substrates, insulating layer is equipped between the heat dissipating layer and any substrate, the graphite linings setting exists
Between insulating layer and heat dissipating layer, which is characterized in that further include heat dissipation film, thermal conductive metal plate and heat conduction copper bar, the heat conduction copper bar
It is arranged in heat dissipating layer, the thermal conductive metal plate is connected with heat conduction copper bar.
2. the radiator structure of pcb board according to claim 1, which is characterized in that it is designed with heat emission hole on the two substrates,
Two substrates are equipped with cooling fin on two side.
3. the radiator structure of pcb board according to claim 1, which is characterized in that the heat conduction copper bar runs through heat dissipating layer two
Heat dissipation film is posted on side, the heat conduction copper bar surface for stretching out heat dissipating layer.
4. the radiator structure of pcb board according to claim 1, which is characterized in that the thermal conductive metal plate is vertically welded in
On heat conduction copper bar, thermal conductive metal plate upper and lower ends are contacted with the lower layer of graphite linings.
5. the radiator structure of pcb board according to claim 1, which is characterized in that the heat dissipation film is nano-sized carbon heat dissipation film.
6. the radiator structure of pcb board according to claim 1, which is characterized in that the graphite linings are graphene.
7. the radiator structure of pcb board according to claim 4, which is characterized in that metal conducting strip is made of aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721591735.1U CN207766645U (en) | 2017-11-24 | 2017-11-24 | A kind of radiator structure of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721591735.1U CN207766645U (en) | 2017-11-24 | 2017-11-24 | A kind of radiator structure of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207766645U true CN207766645U (en) | 2018-08-24 |
Family
ID=63189094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721591735.1U Expired - Fee Related CN207766645U (en) | 2017-11-24 | 2017-11-24 | A kind of radiator structure of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207766645U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115510A (en) * | 2021-03-10 | 2021-07-13 | 深圳市宏杰兴业科技有限公司 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
-
2017
- 2017-11-24 CN CN201721591735.1U patent/CN207766645U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115510A (en) * | 2021-03-10 | 2021-07-13 | 深圳市宏杰兴业科技有限公司 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180824 |