CN204104210U - A kind of pcb board with radiator structure - Google Patents
A kind of pcb board with radiator structure Download PDFInfo
- Publication number
- CN204104210U CN204104210U CN201420584781.9U CN201420584781U CN204104210U CN 204104210 U CN204104210 U CN 204104210U CN 201420584781 U CN201420584781 U CN 201420584781U CN 204104210 U CN204104210 U CN 204104210U
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- CN
- China
- Prior art keywords
- substrate layer
- heat
- pcb board
- copper foil
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of pcb board with radiator structure, relate to integrated circuit board field, solve the problem that existing pcb board radiating effect is not good.This pcb board comprises the substrate layer of insulation, the upper and lower surface of substrate layer is provided with copper foil layer, the outer surface of copper foil layer is provided with antioxidation coating, heat radiation copper coin is provided with in substrate layer, this heat radiation copper coin comprises the heat-conducting part be folded in substrate layer and puts the radiating part outside substrate layer with dew, the upper and lower end face of heat-conducting part is provided with outside vertically extending heat conduction fin, and radiating part can be sticked thermal grease or the high low temperature heat-transfer device of other conductive coefficients.The heat that pcb board produces can be transmitted to the external world rapidly by the heat radiation copper coin be arranged in substrate layer by the utility model, and radiating efficiency is high, and meanwhile, the antioxidation coating that copper foil layer outer surface is arranged can delay the oxidizing process of copper foil layer.
Description
Technical field
The utility model relates to integrated circuit board field, and it is high to be specifically related to a kind of radiating efficiency, the pcb board of long service life.
Background technology
PCB and printed wiring board, be called for short printed board, one of vitals of electronics industry, almost often kind of electronic equipment is little of electronic watch, calculator, large to computer, communication electronic device, military issue weapons system, as long as there are the electronic devices and components such as integrated circuit, in order to the electric interconnection between them, all printed board will be used.It can be divided into single sided board according to the circuit number of plies, double sided board and multi-layer sheet, along with the integrated level of pcb board is more and more higher, components and parts on pcb board are arranged also more and more intensive, area of dissipation is not enough, especially more easily exceed standard in the components and parts environment temperature of height heating, not only affect the life-span of these type of components and parts, also can affect the performance of pcb board, in order to improve heat dispersion, special fan generally can be set or radiating groove is set in the upper and lower surface of pcb board and dispel the heat, it is larger that this type of heat abstractor one carrys out volume, can not adapt to current to the thinner lighter trend of electronic product requirement, two to carry out radiating effect not obvious, urgently improve.
Utility model content
In order to solve the defect that above-mentioned technology exists, the utility model provides a kind of radiating efficiency high, the pcb board of long service life.
The utility model realizes the technical scheme that above-mentioned technique effect adopts:
A kind of pcb board with radiator structure, comprise the substrate layer of insulation, the upper and lower surface of described substrate layer is provided with copper foil layer, heat radiation copper coin is provided with in described substrate layer, this heat radiation copper coin comprises the radiating part that the heat-conducting part be folded in described substrate layer is put outside described substrate layer with dew, and the upper and lower end face of described heat-conducting part is provided with outside vertically extending heat conduction fin.
Above-mentioned a kind of pcb board with radiator structure, described radiating part is sticked thermal grease or the high low temperature heat-transfer device of other conductive coefficients.
Above-mentioned a kind of pcb board with radiator structure, the outer surface of described copper foil layer is provided with antioxidation coating.
Above-mentioned a kind of pcb board with radiator structure, described antioxidation coating is organic film.
Above-mentioned a kind of pcb board with radiator structure, the thickness of described organic film is not more than 0.1 micron.
The beneficial effects of the utility model are: the heat that pcb board produces can be transmitted to the external world rapidly by the heat radiation copper coin be arranged in substrate layer by the utility model, radiating efficiency is high, meanwhile, the antioxidation coating that copper foil layer outer surface is arranged can delay the oxidizing process of copper foil layer.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is front view of the present utility model.
In figure: 1-substrate layer, 2-copper foil layer, 3-heat radiation copper coin, 4-fixing hole, 5-stitch hole, 31-heat conduction fin, 32-radiating part, 33-heat-conducting part.
Embodiment
Referring to Figure of description and specific embodiment, the utility model is described in further detail:
Shown in seeing figures.1.and.2, a kind of pcb board with radiator structure, it comprises the substrate layer 1 of insulation, and the upper and lower surface of this substrate layer 1 is equipped with copper foil layer 2.Wherein, improve as one of the present utility model, be provided with heat radiation copper coin 3 in substrate layer 1, heat radiation copper coin 3 is one-body molded casting in substrate layer 1, adds heat radiation copper coin 3 and the closeness of contact of substrate layer 1, is conducive to carrying out heat transfer better.This heat radiation copper coin 3 comprises and is folded in heat-conducting part in substrate layer 1 33 and dew puts the radiating part 32 outside substrate layer 1, and radiating part 33 is sticked thermal grease or the high low temperature heat-transfer device of other conductive coefficients.Transfer on heat radiation copper coin 3 more quickly and efficiently for making the heat assembled in substrate layer 1, the upper and lower end face of this heat-conducting part 33 is provided with outside vertically extending heat conduction fin 31, heat conduction fin 31 is contained in substrate layer 1 closely, upper end and the copper foil layer 2 of heat conduction fin 31 keep at a certain distance away, and avoid being electrically connected.
Further, a kind ofly have in the pcb board of radiator structure above-mentioned, the outer surface of copper foil layer 2 is provided with antioxidation coating, and this antioxidation coating is the organic film that thickness is not more than 0.1 micron.It can delay the oxidizing process of copper foil layer 2, extends the useful life of pcb board.
In sum, the heat that pcb board produces can be transmitted to the external world rapidly by the heat radiation copper coin be arranged in substrate layer by the utility model, and radiating efficiency is high, and meanwhile, the antioxidation coating that copper foil layer outer surface is arranged can delay the oxidizing process of copper foil layer.
More than show and describe general principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; the just principle of the present utility model described in above-described embodiment and specification; under the prerequisite not departing from the utility model spirit and scope, the utility model also has various changes and modifications; these changes and improvements all fall in claimed scope of the present utility model, and the protection range that the utility model requires is defined by appending claims and equivalent thereof.
Claims (5)
1. one kind has the pcb board of radiator structure, comprise the substrate layer of insulation, the upper and lower surface of described substrate layer is provided with copper foil layer, it is characterized in that, heat radiation copper coin is provided with in described substrate layer, this heat radiation copper coin comprises the radiating part that the heat-conducting part be folded in described substrate layer is put outside described substrate layer with dew, and the upper and lower end face of described heat-conducting part is provided with outside vertically extending heat conduction fin.
2. a kind of pcb board with radiator structure according to claim 1, is characterized in that, described radiating part is sticked thermal grease or the high low temperature heat-transfer device of other conductive coefficients.
3. a kind of pcb board with radiator structure according to claim 1, it is characterized in that, the outer surface of described copper foil layer is provided with antioxidation coating.
4. a kind of pcb board with radiator structure according to claim 3, is characterized in that, described antioxidation coating is organic film.
5. a kind of pcb board with radiator structure according to claim 4, is characterized in that, the thickness of described organic film is not more than 0.1 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420584781.9U CN204104210U (en) | 2014-09-25 | 2014-09-25 | A kind of pcb board with radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420584781.9U CN204104210U (en) | 2014-09-25 | 2014-09-25 | A kind of pcb board with radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204104210U true CN204104210U (en) | 2015-01-14 |
Family
ID=52272603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420584781.9U Expired - Fee Related CN204104210U (en) | 2014-09-25 | 2014-09-25 | A kind of pcb board with radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204104210U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
-
2014
- 2014-09-25 CN CN201420584781.9U patent/CN204104210U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180425 Address after: 325000 Binhai five economic development zone, Binhai Economic and Technological Development Zone, Wenzhou, Zhejiang 315 Patentee after: Zhejiang Jun Hao electronic Limited by Share Ltd Address before: 325000 C602 District, Binhai Park, Wenzhou economic and Technological Development Zone, Wenzhou, Zhejiang Patentee before: GLOBAL PROSPECT SCIEN-TECH INC.(ZHEJIANG) |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150114 Termination date: 20180925 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |