CN207491316U - A kind of high efficiency and heat radiation covers copper aluminum substrate - Google Patents

Abstract

The utility model discloses a kind of high efficiency and heat radiations to cover copper aluminum substrate, including aluminum substrate, copper foil layer is fixedly connected at the top of the aluminum substrate inner cavity, the bottom of the copper foil layer is fixedly connected with insulating layer, side of the insulating layer far from copper foil layer is provided with heat dissipating layer, side of the heat dissipating layer far from insulating layer is fixedly connected with thermal insulation layer, and side of the thermal insulation layer far from heat dissipating layer is fixedly connected with heat-sink shell.The utility model on the surface of aluminum substrate by setting heat dissipating layer, increase aluminium base plate body and the contact area of air, increase the heat dissipation range of aluminum substrate, accelerate the radiating rate of aluminum substrate, pass through the setting of heat-sink shell, it ensure that the position of aluminum substrate heat transfer, reduce because ambient air temperature raising cause aluminum substrate radiating efficiency decline the problem of, by increasing heat dissipation film on the surface of heat dissipating layer, improve the heat dissipation effect of aluminum substrate, it is poor to solve heat dissipation effect simultaneously, the problem of people are used for requiring can not be met.

Description

A kind of high efficiency and heat radiation covers copper aluminum substrate

Technical field

The utility model is related to aluminum substrate technical field, specially a kind of high efficiency and heat radiation covers copper aluminum substrate.

Background technology

Aluminum substrate is a kind of metal-based copper-clad plate with good heat radiating function, and general single sided board is by three-decker institute group Into, be circuit layer (copper foil), insulating layer and metal-based layer respectively, for it is high-end use be also designed as dual platen, structure is Circuit layer, insulating layer, aluminium base, insulating layer, circuit layer, with the fast development of science and technology, electronic equipment wants mainboard Ask also higher and higher, calculating speed is also getting faster, and the exothermic energy of conventional motherboard is higher and higher, but existing aluminum substrate Heat dissipation effect is poor, can not meet the requirement that people are used for.

Utility model content

The purpose of this utility model is to provide a kind of high efficiency and heat radiations to cover copper aluminum substrate, has the advantages of good heat dissipation effect, It is poor to solve heat dissipation effect, the problem of people are used for requiring can not be met.

To achieve the above object, the utility model provides following technical solution：A kind of high efficiency and heat radiation covers copper aluminum substrate, including Aluminum substrate is fixedly connected with copper foil layer at the top of the aluminum substrate inner cavity, and the bottom of the copper foil layer is fixedly connected with insulating layer, Side of the insulating layer far from copper foil layer is provided with heat dissipating layer, and side of the heat dissipating layer far from insulating layer is fixedly connected with absolutely Edge heat-conducting layer, side of the thermal insulation layer far from heat dissipating layer are fixedly connected with heat-sink shell, and the heat-sink shell is led far from insulation The side of thermosphere is fixedly connected with conducting shell.

Preferably, it is bonded with heat dissipation film at the top of the heat dissipating layer, the surface at the top of the heat dissipation film and insulating layer bottom Surface bonding.

Preferably, the both sides of the aluminium base plate surface offer mounting hole, and the quantity of mounting hole is four, in symmetrical Setting.

Preferably, the heat dissipating layer is internally provided with heat emission hole, and the heat emission hole is evenly distributed on the interior table of heat dissipating layer Face.

Compared with prior art, the beneficial effects of the utility model are as follows：

1st, the utility model increases contact of the aluminium base plate body with air by setting heat dissipating layer on the surface of aluminum substrate Area increases the heat dissipation range of aluminum substrate, accelerates the radiating rate of aluminum substrate, by the setting of heat-sink shell, ensure that aluminium The position of substrate heat transfer, reduce because ambient air temperature raising cause aluminum substrate radiating efficiency decline the problem of, pass through Increase heat dissipation film on the surface of heat dissipating layer, improve the heat dissipation effect of aluminum substrate, while it is poor to solve heat dissipation effect, can not meet people The problem of being used for requiring.

2nd, the utility model prevents the thermal resistance of insulating heat-conduction material is excessive from influencing system by the setting of thermal insulation layer Heat dissipation effect, ensured the heat dissipation performance of aluminum substrate when in use, by the setting of insulating layer, aluminum substrate ontology can be increased Insulation performance, prevent electric leakage, damage component, by the setting of conducting shell and mounting hole, increase the conduction of aluminum substrate Performance, while mounting hole conveniently installs aluminum substrate, increases stability when using, and passes through the setting of heat emission hole, increases The heat dissipation area of heat dissipating layer, achievees the effect that high efficiency and heat radiation.

Description of the drawings

FIG. 1 is a schematic structural view of the utility model；

Fig. 2 is the utility model aluminum substrate vertical view；

Fig. 3 is the utility model heat dissipating layer partial sectional view.

In figure：1 aluminum substrate, 2 copper foil layers, 3 insulating layers, 4 heat dissipating layers, 5 thermal insulation layers, 6 heat-sink shells, 7 conducting shells, 8 dissipate Hotting mask, 9 mounting holes, 10 heat emission holes.

Specific embodiment

The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work All other embodiments obtained shall fall within the protection scope of the present invention.

- 3 are please referred to Fig.1, a kind of high efficiency and heat radiation covers copper aluminum substrate, and including aluminum substrate 1, the both sides on 1 surface of aluminum substrate are opened Equipped with mounting hole 9, and the quantity of mounting hole 9 is four, is symmetrical set, and by the setting of conducting shell 7 and mounting hole 9, is increased The conductive performance of aluminum substrate 1, while mounting hole 9 conveniently installs aluminum substrate 1, increases stability when using, aluminum substrate 1 Copper foil layer 2 is fixedly connected at the top of inner cavity, the bottom of copper foil layer 2 is fixedly connected with insulating layer 3, by the setting of insulating layer 3, The insulation performance of aluminum substrate ontology can be increased, prevent electric leakage, damage component, side of the insulating layer 3 far from copper foil layer 2 Heat dissipating layer 4 is provided with, the top of heat dissipating layer 4 is bonded with heat dissipation film 8, the surface on the surface and 3 bottom of insulating layer at 8 top of heat dissipation film Bonding, heat dissipating layer 4 are internally provided with heat emission hole 10, and heat emission hole 10 is evenly distributed on the inner surface of heat dissipating layer 4, passes through heat emission hole 10 setting increases the heat dissipation area of heat dissipating layer 4, achievees the effect that high efficiency and heat radiation, side of the heat dissipating layer 4 far from insulating layer 3 is consolidated Surely thermal insulation layer 5 is connected with, by the setting of thermal insulation layer 5, prevents excessive influence of the thermal resistance of insulating heat-conduction material from being The heat dissipation effect of system, has ensured the heat dissipation performance of aluminum substrate 1 when in use, and side of the thermal insulation layer 5 far from heat dissipating layer 4 is fixed Heat-sink shell 6 is connected with, side of the heat-sink shell 6 far from thermal insulation layer 5 is fixedly connected with conducting shell 7, passes through the table in aluminum substrate 1 Face sets heat dissipating layer 4, increases aluminium base plate body and the contact area of air, increases the heat dissipation range of aluminum substrate 1, accelerate The radiating rate of aluminum substrate by the setting of heat-sink shell 6, ensure that the position of 1 heat transfer of aluminum substrate, reduce because empty around The problem of raising of temperature degree causes 1 radiating efficiency of aluminum substrate to decline by increasing heat dissipation film 8 on the surface of heat dissipating layer 4, improves aluminium The heat dissipation effect of substrate 1, while it is poor to solve heat dissipation effect, can not meet the problem of people are used for requiring.

In use, by setting heat dissipating layer 4 on the surface of aluminum substrate 1, the contact surface of aluminium base plate body and air is increased Product increases the heat dissipation range of aluminum substrate 1, accelerates the radiating rate of aluminum substrate, and 1 heat of aluminum substrate is ensure that by heat-sink shell 6 Measure transmit position, reduce because ambient air temperature raising cause 1 radiating efficiency of aluminum substrate decline the problem of, by radiating The surface of layer 4 increases heat dissipation film 8, improves the heat dissipation effect of aluminum substrate 1, insulating heat-conduction material is prevented by thermal insulation layer 5 The excessive heat dissipation effect for influencing system of thermal resistance is increased the heat dissipation area of heat dissipating layer 4 by heat emission hole 10, reaches high efficiency and heat radiation Effect.

In summary：The high efficiency and heat radiation covers copper aluminum substrate, passes through copper foil layer 2, insulating layer 3, heat dissipating layer 4, thermal insulation layer 5th, the cooperation of heat-sink shell 6, conducting shell 7 and heat dissipation film 8, solves that heat dissipation effect is poor, can not meet people and be used for requirement Problem.

While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art, It is appreciated that can these embodiments be carried out with a variety of variations in the case of the principle and spirit for not departing from the utility model, repaiied Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.

Claims (4)

1. a kind of high efficiency and heat radiation covers copper aluminum substrate, including aluminum substrate (1), it is characterised in that：The top of aluminum substrate (1) inner cavity Copper foil layer (2) is fixedly connected with, the bottom of the copper foil layer (2) is fixedly connected with insulating layer (3), and the insulating layer (3) is separate The side of copper foil layer (2) is provided with heat dissipating layer (4), and side of the heat dissipating layer (4) far from insulating layer (3) is fixedly connected with insulation Heat-conducting layer (5), side of the thermal insulation layer (5) far from heat dissipating layer (4) are fixedly connected with heat-sink shell (6), the heat-sink shell (6) side far from thermal insulation layer (5) is fixedly connected with conducting shell (7).

2. a kind of high efficiency and heat radiation according to claim 1 covers copper aluminum substrate, it is characterised in that：The top of the heat dissipating layer (4) Portion is bonded with heat dissipation film (8), and the surface at the top of the heat dissipation film (8) is Nian Jie with the surface of insulating layer (3) bottom.

3. a kind of high efficiency and heat radiation according to claim 1 covers copper aluminum substrate, it is characterised in that：Aluminum substrate (1) surface Both sides offer mounting hole (9), and the quantity of mounting hole (9) is four, is symmetrical set.

4. a kind of high efficiency and heat radiation according to claim 1 covers copper aluminum substrate, it is characterised in that：The heat dissipating layer (4) it is interior Portion is provided with heat emission hole (10), and the heat emission hole (10) is evenly distributed on the inner surface of heat dissipating layer (4).