CN210351985U - Miniature electronic circuit device - Google Patents

Abstract

A miniature electronic circuit device comprises a packaging box, a plurality of pins, a printed circuit board and a plurality of electronic components. The packaging box comprises an upper cover and a base connected with the upper cover, wherein the upper cover is provided with a cover body layer and a heat dissipation coating coated on the cover body layer, and the upper cover and the base jointly define a containing chamber; the pin is fixedly arranged on the base in a penetrating way and comprises at least one pin for a signal; the printed circuit board is arranged in the accommodating chamber and is electrically connected with the pin for the at least one signal; the electronic component is electrically connected on the printed circuit board to transmit signals to the at least one pin for the signals, and heat energy generated by the electronic component is indirectly transmitted out of the accommodating chamber through the heat dissipation coating, so that the heat dissipation efficiency of the miniature electronic circuit device is improved.

Description

Miniature electronic circuit device

Technical Field

The present invention relates to an electronic circuit device, and more particularly to a miniature electronic circuit device.

Background

The existing electronic circuit device tends to be miniaturized along with the product design, the size is also continuously reduced, the electronic circuit device generally comprises a plurality of electronic components which are fixed on a printed circuit board in a welding mode, along with the reduction of the size of the printed circuit board, the electronic components are closer to each other, the heat dissipation efficiency is reduced, the contact area between the whole electronic circuit device and the outside is also reduced, and the heat dissipation effect is also influenced. The electronic circuit device is overheated, which affects the performance and may be burnt out, and this is why miniaturization of many high power consumption electronic circuit devices, such as power supply circuits and driving circuits of high power led bulbs, is not easy to achieve. Therefore, manufacturers also need to overcome the heat dissipation problem of electronic circuit devices when miniaturizing the electronic circuit devices.

Disclosure of Invention

The present invention is directed to a miniature electronic circuit device that overcomes at least one of the disadvantages of the prior art.

The utility model discloses a miniature electronic circuit device contains encapsulation box, many pins, printed circuit board, and a plurality of electronic component. The packaging box comprises an upper cover and a base connected with the upper cover, wherein the upper cover is provided with a cover body layer and a heat dissipation coating coated on the cover body layer, and the upper cover and the base jointly define a containing chamber; the pin is fixedly arranged on the base in a penetrating way and comprises at least one pin for a signal; the printed circuit board is arranged in the accommodating chamber and comprises an insulated base layer, a conductive layer which is superposed on the base layer, is made of a conductor material and has a circuit layout pattern, and a protective adhesive which covers the conductive layer and is insulated, wherein the at least one pin for the signal is electrically connected with the conductive layer; the electronic component is arranged on the printed circuit board and is respectively electrically connected with the conductive layer so as to transmit signals to the at least one signal pin through the circuit layout pattern, and heat energy generated by the electronic component is indirectly transmitted out of the accommodating chamber through the heat dissipation coating.

The utility model discloses a miniature electronic circuit device, the upper cover still have the cladding in the metal level of the outer and high thermal conductivity of heat dissipation coating.

The utility model discloses a miniature electronic circuit device, heat dissipation coating has the outer peripheral face of specific roughness.

The utility model discloses a miniature electronic circuit device, the roughness scope of outer peripheral face is in between Ra0.9 to Ra 80.

The utility model discloses a miniature electronic circuit device still contain set up in hold the room and with electronic component reaches the heat-conducting medium of upper cover contact makes the heat energy that electronic component produced via heat-conducting medium conducts heat radiation coating.

The utility model discloses a miniature electronic circuit device, heat-conducting medium has the packing and is in the thermal grease who holds the room.

The utility model discloses a miniature electronic circuit device, heat-conducting medium has the packing and is in the thermal grease who holds the room, and at least a slice fin.

The utility model discloses a miniature electronic circuit device, the pin still includes the pin of an at least heat conduction usefulness, the pin of an at least heat conduction usefulness is worn to establish and is fixed the base, and have expose in the upper end of base top surface, and expose in the lower tip of the surface of base, heat-conducting medium with electronic component reaches the upper end contact of the pin of an at least heat conduction usefulness makes the heat energy that electronic component produced via heat-conducting medium conducts the pin of an at least heat conduction usefulness, and passes through the lower tip of the pin of an at least heat conduction usefulness is with heat energy transfer play outside the appearance room.

The utility model discloses a miniature electronic circuit device, printed circuit board is still including connecting the setting and is in the heat-conducting layer of the bottom surface of basic unit, the heat energy part via that electronic component produced the basic unit transmits extremely the heat-conducting layer and then transmits extremely hold in the room, the rethread heat dissipation coating transmits outside the room.

The beneficial effects of the utility model reside in that: the heat energy generated when the electronic component is conducted and operated is transferred out of the containing chamber through the heat dissipation coating of the upper cover, so that the heat dissipation efficiency of the miniature electronic circuit device is effectively improved.

Drawings

Other features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiments with reference to the accompanying drawings, in which:

fig. 1 is an exploded perspective view illustrating a first embodiment of the microelectronic circuit device of the present invention;

FIG. 2 is a cross-sectional view of a printed circuit board to assist in illustrating the first embodiment;

FIG. 3 is a partial cross-sectional view of the first embodiment;

FIG. 4 is a partial cross-sectional view of a second embodiment of the microelectronic circuit device of the present invention;

fig. 5 is an exploded perspective view illustrating a third embodiment of the microelectronic circuit device of the present invention;

FIG. 6 is a partial cross-sectional view of the third embodiment;

FIG. 7 is a cross-sectional view of a printed circuit board to assist in explaining the third embodiment; and

fig. 8 is a cross-sectional view supplementary illustrating a simplified aspect of the printed circuit board of the third embodiment.

Detailed Description

Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same reference numerals.

Referring to fig. 1, 2 and 3, a first embodiment of the microelectronic circuit device of the present invention includes a package box 2 having a chamber 20, a plurality of pins 3 disposed on the package box 2, a printed circuit board 4 disposed on the chamber 20, a plurality of electronic components 5 disposed on the printed circuit board 4, and a heat-conducting medium 6 disposed on the chamber 20.

The package 2 includes a top cover 21 and a base 22 coupled to the top cover 21, the top cover 21 and the base 22 together defining the chamber 20. The top cover 21 has a cover body layer 211 and a heat dissipation coating 212 covering the cover body layer 211. The thermal dissipation coating 212 has an outer peripheral surface 213 with a specific roughness (Ra0.9-Ra 80). Preferably, the lid body layer 211 is made of a plastic material to reduce the manufacturing cost, the heat dissipation coating 212 is made of a heat conductive material with high thermal conductivity, such as a material containing graphene, and the base 22 is made of an insulating ceramic material to increase the heat dissipation speed of the package 2. The heat dissipation coating 212 is formed by striking on the surface thereof through a sand blasting process to form the rough outer peripheral surface 213, which is used to increase the contact area between the heat dissipation coating 212 and the inside and outside of the accommodating chamber 20 to increase the heat dissipation speed, but the implementation is not limited thereto, and the outer peripheral surface 213 may also be a smooth surface, and the heat dissipation effect is achieved only through the high thermal conductivity of the heat dissipation coating 212.

The pins 3 are more precisely fixed on two side edges of the long side direction of the base 22, and include four signal pins 31 respectively adjacent to four corners of the base 22, and six heat-conducting pins 32 spaced at two side edges of the long side direction of the base 22 and between the signal pins 31, each signal pin 31 has an upper end 311 exposed above the inner edge of the base 22, and a lower end 312 exposed on the outer edge of the base 22 and welded to the printed circuit board 4, each heat-conducting pin 32 has an upper end 321 exposed above the inner edge of the base 22, and a lower end 322 exposed on the outer edge of the base 22, and the signal pins 31 are made of conductive metal material. The heat conducting pins 32 are also made of an electrically conductive metal material, but not limited thereto, and the heat conducting pins 32 may also be made of other heat conducting materials with higher heat conductivity, such as a material containing graphene.

Referring to fig. 2, the printed circuit board 4 of the present embodiment includes an insulating substrate 41, a conductive layer 42 stacked on the substrate 41 and made of a conductive material and having a circuit layout pattern, and a protective adhesive 43 covering the surface of the conductive layer 42 and insulated from the conductive layer 42, wherein the substrate 41 and the conductive layer 42 are bonded by an adhesive, in this embodiment, the substrate 41 is an insulating prepreg made of glass fiber nonwoven material and epoxy resin, and the conductive layer 42 is copper.

The electronic components 5 are electrically connected to the conductive layer 42 through the protective adhesive 43, respectively, to transmit electrical signals to at least one of the signal pins 31 through the circuit layout pattern, and to receive external electrical signals from at least another one of the signal pins 31.

The heat conducting medium 6 contacts with the electronic component 5, the upper end 321 of the heat conducting pin and the heat dissipating coating 212 of the upper cover 21, so that the heat generated by the electronic component 5 due to conduction and operation is conducted to the heat conducting pin 32 and the upper cover 21 through the heat conducting medium 6, and the heat is transferred out of the accommodating chamber 20 through the lower end 322 of the heat conducting pin and the heat dissipating coating 212 in a heat convection exchange manner, thereby achieving a heat dissipating effect. In the present embodiment, the heat conducting medium 6 includes a heat dissipating paste 61 filled in the chamber 20.

Referring to fig. 4, a second embodiment of the microelectronic circuit device of the present invention is different from the first embodiment in that: the upper cover 21 has a laminated structure.

In the second embodiment, the lid body layer 211 of the top lid 21 is made of a metal material, the heat dissipation coating 212 is wrapped outside the lid body layer 211, and a metal layer 214 is wrapped outside the heat dissipation coating 212. The metal layer 214 may be a layer of metal material with high thermal conductivity coated on the heat dissipation coating 212 by electroplating, such as a nickel layer, which not only improves the overall heat dissipation efficiency of the microelectronic circuit device, but also shields the electromagnetic waves generated by the electronic component 5.

Referring to fig. 5, 6 and 7, the third embodiment of the present invention, different from the first embodiment, is different in that the number of the heat conducting pins 32 is increased to six, twelve in both sides, the structure of the printed circuit board 4, and the heat conducting medium 6 is added with the heat sink 62 which is arranged in the chamber 20 and is in direct and indirect contact with the upper surface of the electronic component 5, thereby further increasing the heat dissipation efficiency of the micro circuit board package.

As shown in fig. 7, the printed circuit board 4 of the third embodiment includes three base layers 41 arranged at intervals, two heat conduction layers 44 respectively between two adjacent base layers 41, two conductive layers 42, and two protective adhesives 43. The conductive layer 42 covers the base layer 41 at the uppermost layer and the base layer 41 at the lowermost layer respectively. The protective adhesive 43 covers the outer side of the conductive layer 42, the space between the base layer 41 and the conductive layer 42, and the space between the base layer 41 and the heat conductive layer 44, respectively, and are bonded by an adhesive, the heat conductive layer 44 is different from the conductive layer 42 in that the heat conductive layer 44 is a whole copper sheet for conducting heat energy, and the printed circuit board 4 can also be referred to as a double-sided board with a structure of multiple heat conductive layers 44.

The heat conducting layer 44 in the printed circuit board 4 is in indirect contact with the upper end 321 of the heat conducting pin and the heat dissipating coating 212 of the upper cover 21 through the heat dissipating paste 61, so that the heat generated by the heat conducting layer 42 of the printed circuit board 4 is transferred to the outside of the accommodating chamber 20 when the electronic component 5 is conducted and operated, thereby improving the heat dissipating efficiency.

In addition, the heat-conducting medium 6 further includes two T-shaped heat dissipation fins 62 stacked on the electronic component 5 to increase the heat dissipation area of the electronic component 5, and the number of the heat-conducting pins 32 is increased to further improve the overall heat dissipation performance.

It should be noted that in another simplified version of the present embodiment, the printed circuit board 4 may also be a dual-panel structure with a single heat conductive layer 44 as shown in fig. 8. The printed circuit board 4 of the double-sided board can be provided with electronic components 5 on both the top and bottom surfaces thereof.

To sum up, the utility model discloses this heat dissipation coating 212 and this metal level 214 of miniature electronic circuit device through this upper cover 21 will outside this chamber 20 is held in the produced heat energy transmission of this conducting layer 42 of electronic component 5 and this printed circuit board 4 when switching on and function, improve the radiating efficiency effectively, cooperate this heat-conducting medium 6 with pin 32 that the heat conduction was used promotes the radiating efficiency more, has the difficult problem of heat dissipation because of encapsulation heat radiating area is not enough after solving the miniaturation of electronic circuit device, consequently, can reach really the utility model aims.

However, the above description is only an example of the present invention, and the scope of the present invention should not be limited thereto, and all the simple equivalent changes and modifications made according to the claims and the contents of the specification should be included in the scope of the present invention.

Claims (9)

1. A microelectronic circuit device, comprising: the packaging box comprises a packaging box, a plurality of pins, a printed circuit board and a plurality of electronic components; the packaging box comprises an upper cover and a base which is jointed with the upper cover, and the upper cover and the base jointly define a containing chamber; the pin is fixedly arranged on the base in a penetrating way and comprises at least one pin for a signal; the printed circuit board is arranged in the accommodating chamber and comprises an insulated base layer, a conductive layer which is superposed on the base layer, is made of a conductor material and has a circuit layout pattern, and an insulated protective adhesive which covers the conductive layer, wherein the at least one pin for the signal is electrically connected with the conductive layer; the electronic component is arranged on the printed circuit board and is respectively electrically connected with the conductive layer so as to transmit signals to the pins for at least one signal through the circuit layout pattern, and the electronic component is characterized in that: the upper cover is provided with a cover body layer and a heat dissipation coating which is coated on the cover body layer, and heat energy generated by the electronic assembly can be indirectly transferred out of the accommodating chamber through the heat dissipation coating.

2. The microelectronic circuit device according to claim 1, wherein: the upper cover is also provided with a metal layer which is coated outside the heat dissipation coating and has high heat conductivity.

3. The microelectronic circuit device according to claim 1, wherein: the heat dissipation coating has an outer peripheral surface with a specific roughness.

4. A microelectronic circuit device according to claim 3, characterized in that: the roughness of the outer peripheral surface ranges from Ra0.9 to Ra 80.

5. The microelectronic circuit device according to claim 1, wherein: the heat-conducting coating is arranged in the accommodating chamber and is in contact with the electronic assembly and the upper cover, so that heat energy generated by the electronic assembly is conducted to the heat-radiating coating through the heat-conducting medium.

6. The microelectronic circuit device according to claim 5, wherein: the heat conducting medium is provided with heat dissipation paste filled in the accommodating chamber.

7. The microelectronic circuit device according to claim 5, wherein: the heat conducting medium is provided with heat dissipation paste filled in the accommodating chamber and at least one heat dissipation sheet.

8. The microelectronic circuit device according to claim 5, wherein: the pins further comprise at least one pin for heat conduction, the at least one pin for heat conduction is fixedly arranged on the base in a penetrating mode and is provided with an upper end portion exposed out of the top surface of the base and a lower end portion exposed out of the outer surface of the base, the heat conduction medium is in contact with the electronic assembly and the upper end portion of the at least one pin for heat conduction, heat energy generated by the electronic assembly is conducted to the at least one pin for heat conduction through the heat conduction medium, and the heat energy is transferred out of the accommodating chamber through the lower end portion of the at least one pin for heat conduction.

9. The microelectronic circuit device according to claim 1, wherein: the printed circuit board further comprises a heat conduction layer connected and arranged on the bottom surface of the base layer, and heat energy generated by the electronic component is transmitted to the heat conduction layer through the base layer and then transmitted to the accommodating chamber and then transmitted to the outside of the accommodating chamber through the heat dissipation coating.

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