CN110012609A - The combination process of high-thermal conductive metal circuit board - Google Patents
The combination process of high-thermal conductive metal circuit board Download PDFInfo
- Publication number
- CN110012609A CN110012609A CN201910388177.6A CN201910388177A CN110012609A CN 110012609 A CN110012609 A CN 110012609A CN 201910388177 A CN201910388177 A CN 201910388177A CN 110012609 A CN110012609 A CN 110012609A
- Authority
- CN
- China
- Prior art keywords
- glue
- line
- heat
- circuit board
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Abstract
The invention discloses the combination process of high-thermal conductive metal circuit board, it is the following steps are included: S1, take a copper sheet (1), copper foil is set in the top surface and bottom surface of copper sheet (1), it is etched in upper copper by etch process upper wiring layer (2), while lower line layer (3) is etched in lower copper foil by etch process；S2, go out multiple longitudinally disposed through slots (4) in copper sheet (1) interior Milling Process using milling machine, be embedded in a heat conducting pipe (5) after processing in each through slot (4)；The installation of S3, upper radiator structure；The installation of S4, lower radiator structure.Technical benefits of the invention are as follows: the high-thermal conductive metal heat dissipation for circuit board effect produced is good, long service life, manufacturing cost is low, manufacture craft is simple.
Description
Technical field
The present invention relates to the combination process of high-thermal conductive metal circuit board.
Background technique
Circuit board is the supporting body of electronic device, is essential part in an electronic product or electrical equipment.With
The development of electronics, electrical technology, requirement of the people to circuit board is also higher and higher, especially with LED as luminaire
Part, it is also higher and higher to the heat dissipation performance requirement of circuit board after entering into people's lives, currently, some need high heat dispersion
Circuit board be all to be to be equipped with one layer of heat-conducting glue on aluminium sheet, on the one hand can play thermally conductive effect using aluminum base circuit board,
On the other hand there are also the effect of insulation, it is attached with one layer of copper film circuit board line on heat-conducting glue, but the thermal conductivity of heat-conducting glue
It can not be very well, to will affect the heating conduction of whole circuit board.With working long hours for circuit board, heat bulk deposition
On line layer, eventually lead to line layer and burn, seriously reduce the service life of circuit board, the competitiveness in market also gradually under
Drop.Therefore need that a kind of heat dissipation effect is obvious, high-thermal conductive metal circuit board with long service life.
Summary of the invention
The purpose of the present invention is to overcome the shortcomings of the existing technology, and it is scattered to provide a kind of high-thermal conductive metal circuit board produced
Thermal effect is good, long service life, manufacturing cost are low, the simple high-thermal conductive metal circuit board of manufacture craft combination process.
The purpose of the present invention is achieved through the following technical solutions: the combination process of high-thermal conductive metal circuit board, it includes
Following steps:
S1, a copper sheet is taken, copper foil is set in the top surface and bottom surface of copper sheet, through etch process in upper copper
Upper wiring layer is etched, while lower line layer is etched in lower copper foil by etch process；
S2, using milling machine, Milling Process goes out multiple longitudinally disposed through slots in copper sheet, is embedded in each through slot after processing
A piece heat conducting pipe；
The installation of S3, upper radiator structure: worker first smears glue-line on the top surface of upper wiring layer, then table of the worker in glue-line
It is bonded with heat-conducting glue on face, glue-line is then smeared on the top surface of upper heat-conducting glue, worker is bonded on the surface of the glue-line
Heat-conducting substrate is finally bonded multiple upper radiation tooths on the top surface of upper heat-conducting substrate and along its length, is finally completed
The installation of upper radiator structure；
The installation of S4, lower radiator structure: worker first smears glue-line on the bottom surface of lower line layer, then table of the worker in glue-line
It is bonded lower heat-conducting glue on face, glue-line is then smeared under the bottom surface of lower heat-conducting glue, under worker is bonded under the surface of the glue-line
Heat-conducting substrate is finally bonded multiple lower radiation tooths under the bottom surface of lower heat-conducting substrate and along its length, is finally completed
The installation of lower radiator structure；
S5, upper radiator structure, the lower radiator structure after bonding are put into togerther in drying box together with copper sheet, are dried after a period of time
After dry, the glue-line of smearing can be solidified, to finally obtain high-thermal conductive metal circuit board.
The beneficial effects of the present invention are: high-thermal conductive metal heat dissipation for circuit board effect that the present invention produces is good, service life
Length, manufacturing cost is low, manufacture craft is simple.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the combined type high thermal conductivity circuit board produced;
Fig. 2 is the A-A cross-sectional view of Fig. 1.
Specific embodiment
The present embodiment is the preferred embodiment for the present invention, other its all principles and basic structure are identical or close as the present embodiment
As, within that scope of the present invention.
The combination process of high-thermal conductive metal circuit board, it the following steps are included:
S1, a copper sheet 1 is taken, copper foil is set in the top surface and bottom surface of copper sheet 1, by etch process in upper copper
On etch upper wiring layer 2, while lower line layer 3 is etched in lower copper foil by etch process；
S2, using milling machine, Milling Process goes out multiple longitudinally disposed through slots 4 in copper sheet 1, embedding in each through slot 4 after processing
Enter a heat conducting pipe 5；
The installation of S3, upper radiator structure: worker first smears glue-line on the top surface of upper wiring layer 2, and then worker is in glue-line
It is bonded with heat-conducting glue 6 on surface, glue-line is then smeared on the top surface of upper heat-conducting glue 6, worker glues on the surface of the glue-line
Heat-conducting substrate 7 is connected, is finally bonded multiple upper radiation tooths 8 on the top surface of upper heat-conducting substrate 7 and along its length, finally
Complete the installation of radiator structure；
The installation of S4, lower radiator structure: worker first smears glue-line on the bottom surface of lower line layer 3, and then worker is in glue-line
It is bonded lower heat-conducting glue 9 on surface, glue-line is then smeared under the bottom surface of lower heat-conducting glue 9, worker glues under the surface of the glue-line
Lower heat-conducting substrate 10 is connect, is finally bonded multiple lower radiation tooths 11 under the bottom surface of lower heat-conducting substrate 10 and along its length,
It has been finally completed the installation of lower radiator structure；
S5, upper radiator structure, the lower radiator structure after bonding are put into togerther in drying box together with copper sheet 1, through after a period of time
After drying, the glue-line of smearing can be solidified, to finally obtain high-thermal conductive metal circuit board, structure is as shown in Figure 1 and 2.
The working principle of the high-thermal conductive metal circuit board are as follows: upper wiring layer 2 and lower 3 permanent worker of line layer when the circuit board
When making, a large amount of heat is accumulated on copper sheet 1 and line layer, due to being provided with heat conducting pipe 5 in copper sheet 1, heat conducting pipe 5 is by copper sheet
Heat dissipation on 1 realizes heat dissipation to copper sheet 1 into air, since copper sheet 1 has obtained effective heat dissipation, avoid copper sheet 1 by
It is excessively high in temperature and thermal deformation occur, extend the service life of circuit board；Simultaneously because being provided with heat dissipation on upper wiring layer 2
Structure, therefore the heat of upper wiring layer 2 is sequentially eventually transferred into upper radiation tooth 8, upper heat dissipation through upper heat-conducting glue 6, upper heat-conducting substrate 7
Tooth 8 transfers heat in air again, so as to avoid due on upper wiring layer 2 temperature it is excessively high and damage, extend circuit board
Service life；Similarly due to being provided with lower radiator structure on lower line layer 3, the heat of lower line layer 3 is led under sequentially passing through
Hot glue 9, lower heat-conducting substrate 10 are eventually transferred into lower radiation tooth 11, and lower radiation tooth 11 transfers heat in air again, to keep away
Exempt from further to extend the service life of circuit board since temperature is excessively high and damage on lower line layer 3.In addition, realizing simultaneously
It radiates while copper sheet 1 and two line layers, has been completed in a short time the heat dissipation of circuit board, the spy with good heat dissipation effect
Point.Therefore there is long service life by the high-thermal conductive metal circuit board that the combination process is prepared, heat dissipation effect is significantly special
Point, and the processing step is simple.
It is pointed out that the technical concepts and features of above-mentioned preferred embodiment only to illustrate the invention, its object is to
Those skilled in the art can understand the contents of the present invention and implements accordingly, and protection of the invention can not be limited with this
Range.Any equivalent change or modification in accordance with the spirit of the invention should be covered by the protection scope of the present invention.
Claims (1)
1. the combination process of high-thermal conductive metal circuit board, it is characterised in that: it the following steps are included:
S1, a copper sheet (1) is taken, copper foil is set in the top surface and bottom surface of copper sheet (1), by etch process on upper layer
It is etched on copper foil upper wiring layer (2), while lower line layer (3) is etched in lower copper foil by etch process；
S2, go out multiple longitudinally disposed through slots (4) in copper sheet (1) interior Milling Process using milling machine, in each through slot (4) after processing
Inside it is embedded in a heat conducting pipe (5)；
The installation of S3, upper radiator structure: worker first smears glue-line on the top surface of upper wiring layer (2), and then worker is in glue-line
Surface on be bonded with heat-conducting glue (6), glue-line, table of the worker in the glue-line are then smeared on the top surface of upper heat-conducting glue (6)
It is bonded with heat-conducting substrate (7) on face, is finally bonded multiple upper dissipate on the top surface of upper heat-conducting substrate (7) and along its length
Hot tooth (8), has been finally completed the installation of upper radiator structure；
The installation of S4, lower radiator structure: worker first smears glue-line on the bottom surface of lower line layer (3), and then worker is in glue-line
Surface on be bonded lower heat-conducting glue (9), glue-line, table of the worker in the glue-line are then smeared under the bottom surface of lower heat-conducting glue (9)
Be bonded under face lower heat-conducting substrate (10), be finally bonded under the bottom surface of lower heat-conducting substrate (10) and along its length it is multiple under
Radiation tooth (11), has been finally completed the installation of lower radiator structure；
S5, upper radiator structure, the lower radiator structure after bonding are put into togerther in drying box together with copper sheet (1), when by one section
Between dry after, the glue-line of smearing can be solidified, to finally obtain high-thermal conductive metal circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910388177.6A CN110012609A (en) | 2019-05-10 | 2019-05-10 | The combination process of high-thermal conductive metal circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910388177.6A CN110012609A (en) | 2019-05-10 | 2019-05-10 | The combination process of high-thermal conductive metal circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110012609A true CN110012609A (en) | 2019-07-12 |
Family
ID=67176463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910388177.6A Pending CN110012609A (en) | 2019-05-10 | 2019-05-10 | The combination process of high-thermal conductive metal circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110012609A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683475A (en) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | Production method of composite high-frequency circuit board |
| CN116528458A (en) * | 2023-04-06 | 2023-08-01 | 深圳市基石新材料技术有限公司 | Circuit board module with heat dissipation structure and manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007300048A (en) * | 2006-05-08 | 2007-11-15 | Gigabyte Technology Co Ltd | Heat dissipation printed circuit board and its construction for conducting heat by heat pipe |
| KR101241123B1 (en) * | 2012-10-31 | 2013-03-11 | 주식회사 에이비엘코리아 | Heatsink using heatpipes |
| CN106061102A (en) * | 2016-07-06 | 2016-10-26 | 四川海英电子科技有限公司 | Production process of high-heat-conductivity circuit board |
| CN208317104U (en) * | 2018-06-26 | 2019-01-01 | 丰顺县锦顺科技有限公司 | The two-sided PCB circuit board radiator structure of multi-layered high-density |
| CN208424910U (en) * | 2018-08-01 | 2019-01-22 | 四川海英电子科技有限公司 | A kind of high thermal conductivity printed circuit board |
-
2019
- 2019-05-10 CN CN201910388177.6A patent/CN110012609A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007300048A (en) * | 2006-05-08 | 2007-11-15 | Gigabyte Technology Co Ltd | Heat dissipation printed circuit board and its construction for conducting heat by heat pipe |
| KR101241123B1 (en) * | 2012-10-31 | 2013-03-11 | 주식회사 에이비엘코리아 | Heatsink using heatpipes |
| CN106061102A (en) * | 2016-07-06 | 2016-10-26 | 四川海英电子科技有限公司 | Production process of high-heat-conductivity circuit board |
| CN208317104U (en) * | 2018-06-26 | 2019-01-01 | 丰顺县锦顺科技有限公司 | The two-sided PCB circuit board radiator structure of multi-layered high-density |
| CN208424910U (en) * | 2018-08-01 | 2019-01-22 | 四川海英电子科技有限公司 | A kind of high thermal conductivity printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683475A (en) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | Production method of composite high-frequency circuit board |
| CN116528458A (en) * | 2023-04-06 | 2023-08-01 | 深圳市基石新材料技术有限公司 | Circuit board module with heat dissipation structure and manufacturing method |
| CN116528458B (en) * | 2023-04-06 | 2023-10-20 | 深圳市基石新材料技术有限公司 | Circuit board module with heat dissipation structure and manufacturing method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190712 |