CN205900586U - Multilayer LED photo engine structure - Google Patents
Multilayer LED photo engine structure Download PDFInfo
- Publication number
- CN205900586U CN205900586U CN201620769962.8U CN201620769962U CN205900586U CN 205900586 U CN205900586 U CN 205900586U CN 201620769962 U CN201620769962 U CN 201620769962U CN 205900586 U CN205900586 U CN 205900586U
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- Prior art keywords
- hole
- conductive layer
- conductive
- conductive component
- led light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model discloses a multilayer LED photo engine packaging structure, including base plate, conductive component, driving element and illuminating part, the upper surface of base plate is located to the conductive component, the conductive component including be no less than two, and from last to connecting gradually down fixed conducting layer, the conducting layer includes insulating piece and the conducting strip that is equipped with the preinstalled circuit, and the conducting strip is located the insulating piece top and is connected fixedly with the insulating piece, all be equipped with the first through -hole that runs through insulating piece and conducting strip in the conductive component on every conducting layer, conducting layer except being located lower floor in the conductive component all is equipped with the second through -hole that a plurality of runs through insulating piece and conducting strip on other conducting layers, all be equipped with the connecting wire in first through -hole and the second through -hole, the connecting wire is used for connecting illuminating part and conductive component to and the electricity is connected between messenger's conducting layer and the conducting layer. The utility model has the advantages of realize thermoelectric separation to structure through the multilayer conducting layer can realize the three -dimensional wiring of multilayer.
Description
Technical field
The utility model is related to led encapsulating structure field, more particularly, to multilayer led photo engine encapsulating structure.
Background technology
As conventional light source, semiconductor light-emitting-diode (led) also can produce heat during operation, and how much it depends on
In overall luminous efficiency.Power up under energy effect outside, the radiation recombination in electronics and hole occurs electroluminescent, attached in pn-junction
The light closely radiating also needs just to arrive at the external world through the semiconductor medium of chip itself and encapsulation medium.Combination current injects
Efficiency, radioluminescence quantum efficiency, chip exterior light extraction efficiency etc., finally probably only have the input electric energy of 30%-40% to turn
Turn to luminous energy, the energy of remaining 60%-70% mainly converts heat energy in the form of the lattice vibration that non-radiative recombination occurs, so
The heat dissipation problem how solving led becomes the key technology of the led making high reliability low light attenuation.
General, led chip is the thermoelectricity with having the bonded adhesives hydropexis of high thermal conductivity on the detached line layer of thermoelectricity
Detached line layer be usually aluminium/copper-based line layer or ceramic base line layer, be beneficial to led chip generation heat quickly from
It is delivered on the heat-dissipating casing of light fixture in the circuit basic unit of high heat conduction.
Led photo engine is that led driving power supply and led luminescent device are integrated on one piece of line layer, and such technology changes
The led having become traditional drives the drawbacks of separate with led luminescent device.The photo engine technology of optoelectronic integration, eliminates heaviness, large
Big led drives, and is beneficial to the ting model of light fixture, lightening design.
Led line layer role in photo engine led product is: on the one hand it has the circuit of electrical connection, permissible
Wire on mains current via line layer is input in led driving power supply, electric current exports through the process of led driving power supply
Wire on suitable electric current via line layer is delivered on led chip so that led luminescent device energy normal luminous；On the other hand
Line layer be led chip produce heat transfer on the aluminum heat-dissipating casing of light fixture, be finally dispersed in the air.
At present the LED lamp of most conventional is luminescent device technology detached with led power drives because luminescent device and
Led power drives are detached, and the input of led line layer has been just the good electric current of outside drive processes.
But in integrated photo engine, because there being led driving power supply, it will be processed into suitable led to the civil power of input
The electric current of luminescent device exports to luminescent device again.Because there being the electric current to civil power to process, it is related to the conversion of electric current, typically
Led drive circuit complicated and changeable, and the led individual layer line layer of routine can not meet demand, because the crossing one another of complexity
Wiring can destroy the normal work of led driving power supply, so general led driving power supply is the circuit using 2 layers or more
Layer, our common computer main boards or cell phone mainboard are all the line layers of use 2 layers or more the numbers of plies.
2 functions of photo engine module: provide circuit to connect and transmission heat；Although the heat conduction of general thermoelectricity detached basic unit
Coefficient ＞ 25w/m.k, but the detached wiring board of general thermoelectricity only has a sandwich circuit layer it is impossible to meet some needs cloth multilayers
The complicated circuit of circuit；And of the prior art can meet needs multilayer wiring the multilayer circuit board of complicated circuit heat conduction system
Number only only has 1.0w/m.k, here it is why on multilayer line mainboard cpu heater members must add fan and help dissipate
Heat is.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide multilayer led photo engine encapsulating structure,
It enables multilayer circuit board function and has the good capacity of heat transmission.
The purpose of this utility model employs the following technical solutions realization:
Multilayer led light engine arrangement, including substrate, conductive component, driving element and illuminating part, conductive component is located at substrate
Upper surface；The conductive layer that conductive component includes no less than two and is sequentially connected from top to bottom；Conductive layer include insulating trip and
It is provided with the conducting strip of preinstalled circuit, conducting strip is connected above insulating trip and with insulating trip；
It is equipped with, on each conductive layer in described conductive component, the first through hole running through insulating trip and conducting strip, each is conductive
All positions correspond to the first through hole of layer from top to bottom；Except positioned at undermost conductive layer in conductive component, on other conductive layers
It is equipped with the second through hole that several run through insulating trip and conducting strip, and the second through hole of each conductive layer equal position from top to bottom
Corresponding；
, in first through hole, driving element is on the predeterminated position of conductive component for described illuminating part；First through hole and
Be equipped with connecting line in second through hole, connecting line is used for connecting illuminating part and conductive component, and make conductive layer and conductive layer it
Between electrically connect.
Preferably, in the adjacent conductive layer of any two, the aperture of the second through hole of underlying conductive layer is less than
The aperture preset size of second through hole of conductive layer of top.
Preferably, in the adjacent conductive layer of any two, the aperture of the first through hole of underlying conductive layer is less than
The aperture preset size of the first through hole of conductive layer of top.
Preferably, described pre-set dimension is 0.5mm-1mm.
Preferably, the upper surface of described conductive component is provided with solder mask.
Preferably, being filled with insulating materials in described second through hole.
Preferably, described conducting strip is copper foil layer.
Preferably, described substrate is highly heat-conductive material plate.
Preferably, described connecting line is bonding line.
Compared to existing technology, the beneficial effects of the utility model are:
Realize thermoelectricity to separate, and Multilayer vertical wiring can be realized by the structure of plurality of conductive layers.
Brief description
Fig. 1 is the generalized section of the utility model multilayer led light engine arrangement；
In figure: 00, substrate；01st, driving element；02nd, illuminating part；03rd, insulating trip；04th, conducting strip；05th, first through hole；
06th, the second through hole；07th, connecting line；08th, insulating materials.
Specific embodiment
Below, in conjunction with accompanying drawing and specific embodiment, the utility model is described further:
Multilayer led light engine arrangement, as shown in figure 1, include substrate 00, conductive component, driving element 01 and illuminating part 02；
Described substrate 00 is highly heat-conductive material plate, and substrate 00 can be but not limited to copper coin, aluminium sheet, iron plate or ceramic wafer etc..
Conductive component includes being sequentially connected fixing conductive layer from top to bottom no less than two；Conductive layer includes insulating trip
03 and conducting strip 04, conducting strip 04 can be but not limited to copper foil layer, copper foil layer located at insulating trip 03 top and with insulating trip 03
It is connected, copper foil layer etched default conducting wire.
First through hole 05 is equipped with all conductive layers in described conductive component, described first through hole 05 runs through insulating trip 03
And copper foil layer；Position corresponds to the first through hole 05 of all conductive layers in conductive component from top to bottom, and often adjacent two lead
Electric layer, the aperture of the first through hole 05 of underlying conductive layer is less than the aperture preset of the first through hole 05 of conductive layer of top
Size, pre-set dimension is 0.5mm-1mm；In the adjacent conductive layer of each two, underlying conductive layer exposes conduction up to the open air
Region in the first through hole 05 of layer is the first reserved area；There is the default conducting wire on conductive layer in first reserved area.
Except positioned at undermost conductive layer, other conductive layers being equipped with several the second through holes 06 in conductive component,
Second through hole 06 runs through insulating trip 03 and copper foil layer；All positions correspond to second through hole 06 of all conductive layers from top to bottom, and often
Two adjacent conductive layers, the aperture of the second through hole 06 of underlying conductive layer is less than the second through hole of the conductive layer of top
06 aperture preset size, pre-set dimension is 0.5mm-1mm, and in the adjacent conductive layer of each two, underlying conductive layer exposes to the open air
Region in second through hole 06 of conductive layer up is the second reserved area.Have pre- on conductive layer in second reserved area
If conducting wire.
The upper surface of conductive component needs the region of electric insulation to be provided with solder mask, and solder mask is used for avoiding in conductive component
The conducting wire of the copper foil layer of the superiors is oxidized；Described driving element 01 is arranged on the default position of the upper surface of conductive component
Put.
Described conductive component is connected located at the upper surface of substrate 00 and with substrate 00, and illuminating part 02 is located at substrate 00
Upper surface and be located at first through hole 05 in.
The first through hole 05 of described conductive component and the second through hole 06 are equipped with connecting line 07, connecting line 07 can be but not
It is limited to bonding line；Bonding line is used for connecting the first reserved area of copper foil layer in conductive component, make copper foil layer and copper foil layer it
Between electrically connect；Bonding line is additionally operable to connect the second reserved area of the copper foil layer in conductive component, make copper foil layer and copper foil layer it
Between electrically connect；Bonding line is additionally operable to electrically connect illuminating part 02 and copper foil layer.
It is filled with insulating materials 08, insulating materials 08 is used for the connecting line in protection the second through hole 06 in second through hole 06
07；Described insulating materials 08 can be but not limited to silica gel.
The utility model has a characteristic that
1) multilayer conductive Rotating fields, so that the led driving power supply wiring of complexity is possibly realized, will not make led drives line
There is intersection conflict in road.
2) thermoelectricity isolating construction, illuminating part is directly bonded on high thermal conductive substrate, substrate can be aluminium sheet, copper circuit board or
Ceramic circuit-board, in the heat transfer that can easily illuminating part be produced to outside radiator.
3) plurality of conductive layers wire structures, the wire laying mode of Multilayer vertical, decreasing individual layer wiring board needs big line
Road surface is amassed.
Increase conductive layer that can be unlimited using this technique, until the conductive layer up increasing cannot meet what needs cut
First through hole or the second via area.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various
Corresponding change and deformation, and all these change and deformation all should belong to the protection of the utility model claim
Within the scope of.
Claims (9)
1. multilayer led light engine arrangement is it is characterised in that include substrate, conductive component, driving element and illuminating part, conductive group
Part is located at the upper surface of substrate；The conductive layer that conductive component includes no less than two and is sequentially connected from top to bottom；Conductive layer bag
Include insulating trip and the conducting strip being provided with preinstalled circuit, conducting strip is connected above insulating trip and with insulating trip；
It is equipped with, on each conductive layer in described conductive component, the first through hole running through insulating trip and conducting strip, each conductive layer
All positions correspond to first through hole from top to bottom；Except positioned at undermost conductive layer, other conductive layers being all provided with conductive component
Several are had to run through the second through hole of insulating trip and conducting strip, and the second through hole of each conductive layer equal position pair from top to bottom
Should；
, in first through hole, driving element is on the predeterminated position of conductive component for described illuminating part；First through hole and second
It is equipped with connecting line in through hole, connecting line is used for connecting illuminating part and conductive component, and make electricity between conductive layer and conductive layer
Connect.
2. multilayer led light engine arrangement as claimed in claim 1 is it is characterised in that in the adjacent conductive layer of any two, position
It is less than the aperture preset size of the second through hole of the conductive layer of top in the aperture of the second through hole of the conductive layer of lower section.
3. multilayer led light engine arrangement as claimed in claim 1 is it is characterised in that in the adjacent conductive layer of any two, position
It is less than the aperture preset size of the first through hole of the conductive layer of top in the aperture of the first through hole of the conductive layer of lower section.
4. multilayer led light engine arrangement as claimed in claim 2 or claim 3 is it is characterised in that described pre-set dimension is 0.5mm-
1mm.
5. multilayer led light engine arrangement as claimed in claim 1 is it is characterised in that the upper surface of described conductive component is provided with
Solder mask.
6. multilayer led light engine arrangement as claimed in claim 1 is it is characterised in that be filled with insulating materials in the second through hole.
7. multilayer led light engine arrangement as claimed in claim 1 is it is characterised in that conducting strip is copper foil layer.
8. multilayer led light engine arrangement as claimed in claim 1 is it is characterised in that substrate is highly heat-conductive material plate.
9. multilayer led light engine arrangement as claimed in claim 1 is it is characterised in that connecting line is bonding line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620769962.8U CN205900586U (en) | 2016-07-20 | 2016-07-20 | Multilayer LED photo engine structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620769962.8U CN205900586U (en) | 2016-07-20 | 2016-07-20 | Multilayer LED photo engine structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205900586U true CN205900586U (en) | 2017-01-18 |
Family
ID=57773315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620769962.8U Active CN205900586U (en) | 2016-07-20 | 2016-07-20 | Multilayer LED photo engine structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205900586U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977364A (en) * | 2016-07-20 | 2016-09-28 | 广州硅能照明有限公司 | Multilayer LED light engine structure and processing method thereof |
-
2016
- 2016-07-20 CN CN201620769962.8U patent/CN205900586U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977364A (en) * | 2016-07-20 | 2016-09-28 | 广州硅能照明有限公司 | Multilayer LED light engine structure and processing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 510000 Room 201, building A4, No. 11, Kaiyuan Avenue, Huangpu District, Guangzhou, Guangdong Patentee after: Silicon energy photoelectric semiconductor (Guangzhou) Co.,Ltd. Address before: 510000 second floor, building A4, No. 11, Kaiyuan Avenue, Science City, Guangzhou Development Zone, Guangzhou, Guangdong Patentee before: GUANGZHOU LEDTEEN OPTOELECTRONICS Co.,Ltd. |